JPS62149895A - リ−ドフレ−ムの金めつき方法 - Google Patents
リ−ドフレ−ムの金めつき方法Info
- Publication number
- JPS62149895A JPS62149895A JP28983885A JP28983885A JPS62149895A JP S62149895 A JPS62149895 A JP S62149895A JP 28983885 A JP28983885 A JP 28983885A JP 28983885 A JP28983885 A JP 28983885A JP S62149895 A JPS62149895 A JP S62149895A
- Authority
- JP
- Japan
- Prior art keywords
- gold plating
- plated
- gold
- lead frame
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 71
- 239000010931 gold Substances 0.000 title claims abstract description 71
- 238000007747 plating Methods 0.000 claims abstract description 85
- 229910052716 thallium Inorganic materials 0.000 claims description 24
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 19
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 description 11
- 150000003839 salts Chemical class 0.000 description 8
- 230000002829 reductive effect Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- FYWSTUCDSVYLPV-UHFFFAOYSA-N nitrooxythallium Chemical compound [Tl+].[O-][N+]([O-])=O FYWSTUCDSVYLPV-UHFFFAOYSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YTQVHRVITVLIRD-UHFFFAOYSA-L thallium sulfate Chemical compound [Tl+].[Tl+].[O-]S([O-])(=O)=O YTQVHRVITVLIRD-UHFFFAOYSA-L 0.000 description 1
- 229940119523 thallium sulfate Drugs 0.000 description 1
- 229910000374 thallium(I) sulfate Inorganic materials 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28983885A JPS62149895A (ja) | 1985-12-23 | 1985-12-23 | リ−ドフレ−ムの金めつき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28983885A JPS62149895A (ja) | 1985-12-23 | 1985-12-23 | リ−ドフレ−ムの金めつき方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62149895A true JPS62149895A (ja) | 1987-07-03 |
| JPH0553878B2 JPH0553878B2 (enrdf_load_stackoverflow) | 1993-08-11 |
Family
ID=17748423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28983885A Granted JPS62149895A (ja) | 1985-12-23 | 1985-12-23 | リ−ドフレ−ムの金めつき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62149895A (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887755A (enrdf_load_stackoverflow) * | 1972-01-31 | 1973-11-17 | ||
| JPS55104495A (en) * | 1979-01-30 | 1980-08-09 | Electroplating Eng Of Japan Co | Gold plating liquid and gold plating method for using gold plating liquid |
| JPS5983788A (ja) * | 1982-11-04 | 1984-05-15 | Shinko Electric Ind Co Ltd | 高速銀めつき方法 |
-
1985
- 1985-12-23 JP JP28983885A patent/JPS62149895A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887755A (enrdf_load_stackoverflow) * | 1972-01-31 | 1973-11-17 | ||
| JPS55104495A (en) * | 1979-01-30 | 1980-08-09 | Electroplating Eng Of Japan Co | Gold plating liquid and gold plating method for using gold plating liquid |
| JPS5983788A (ja) * | 1982-11-04 | 1984-05-15 | Shinko Electric Ind Co Ltd | 高速銀めつき方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0553878B2 (enrdf_load_stackoverflow) | 1993-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5896869A (en) | Semiconductor package having etched-back silver-copper braze | |
| EP0405369B1 (en) | Process for producing copperclad laminate | |
| CN112259495A (zh) | 一种晶圆印刷工艺 | |
| JP3916586B2 (ja) | リードフレームのめっき方法 | |
| JPH11307711A (ja) | 半導体パッケ―ジ用リ―ドフレ―ム及びリ―ドフレ―ムメッキ方法 | |
| JPS62149895A (ja) | リ−ドフレ−ムの金めつき方法 | |
| JPH1027873A (ja) | 半導体装置用リードフレーム | |
| JPH0553879B2 (enrdf_load_stackoverflow) | ||
| JP4704313B2 (ja) | リードフレームのめっき方法 | |
| US20040231978A1 (en) | Electrode attachment to anode assembly | |
| CN109576766A (zh) | 一种电泳-电沉积制备纳米TiO2增强Sn基微凸点的方法 | |
| JPS58113386A (ja) | 銀めつき方法 | |
| JP2611431B2 (ja) | 均一部分電気メッキ法 | |
| JPH0964264A (ja) | リードフレームの部分めっき方法 | |
| JPH0613435A (ja) | キャリアテープ及びその製造方法 | |
| JP3043884B2 (ja) | 半導体装置の実装方法 | |
| JP3525618B2 (ja) | 金属基材へのめっき方法 | |
| KR100211927B1 (ko) | 동 합금 및 철-니켈 합금 소재의 동-니켈 합금 하지 도금 조성물 및 하지 도금 방법 | |
| JPH0421000B2 (enrdf_load_stackoverflow) | ||
| JP2811752B2 (ja) | 銀めっき液及び銀めっき方法 | |
| JPS62145847A (ja) | 部分銀めつきリ−ドフレ−ムの製造方法 | |
| JPS602692A (ja) | 銀メツキ方法 | |
| JP2007009334A5 (enrdf_load_stackoverflow) | ||
| JPH02281749A (ja) | リードフレームの製造方法 | |
| JP2003027279A (ja) | リードフレームのめっき方法 |