JPS62147701A - 炭素系抵抗ペ−スト - Google Patents
炭素系抵抗ペ−ストInfo
- Publication number
- JPS62147701A JPS62147701A JP60287786A JP28778685A JPS62147701A JP S62147701 A JPS62147701 A JP S62147701A JP 60287786 A JP60287786 A JP 60287786A JP 28778685 A JP28778685 A JP 28778685A JP S62147701 A JPS62147701 A JP S62147701A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resistance
- carbon
- paste
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 20
- 229910052799 carbon Inorganic materials 0.000 title claims description 18
- 239000011230 binding agent Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000004640 Melamine resin Substances 0.000 claims description 8
- 229920000877 Melamine resin Polymers 0.000 claims description 8
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- 229930003836 cresol Natural products 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 239000012766 organic filler Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims 2
- 229940100630 metacresol Drugs 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 238000006266 etherification reaction Methods 0.000 claims 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000740 bleeding effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000005562 fading Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- UNKQPEQSAGXBEV-UHFFFAOYSA-N formaldehyde;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound O=C.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 UNKQPEQSAGXBEV-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60287786A JPS62147701A (ja) | 1985-12-23 | 1985-12-23 | 炭素系抵抗ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60287786A JPS62147701A (ja) | 1985-12-23 | 1985-12-23 | 炭素系抵抗ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62147701A true JPS62147701A (ja) | 1987-07-01 |
| JPH0567041B2 JPH0567041B2 (enrdf_load_stackoverflow) | 1993-09-24 |
Family
ID=17721721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60287786A Granted JPS62147701A (ja) | 1985-12-23 | 1985-12-23 | 炭素系抵抗ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62147701A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007165709A (ja) * | 2005-12-15 | 2007-06-28 | Hitachi Chem Co Ltd | 液状組成物、抵抗体膜及びその形成方法、抵抗体素子並びに配線板 |
| JP2007165708A (ja) * | 2005-12-15 | 2007-06-28 | Hitachi Chem Co Ltd | 印刷抵抗体、印刷インク及び配線板 |
-
1985
- 1985-12-23 JP JP60287786A patent/JPS62147701A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007165709A (ja) * | 2005-12-15 | 2007-06-28 | Hitachi Chem Co Ltd | 液状組成物、抵抗体膜及びその形成方法、抵抗体素子並びに配線板 |
| JP2007165708A (ja) * | 2005-12-15 | 2007-06-28 | Hitachi Chem Co Ltd | 印刷抵抗体、印刷インク及び配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0567041B2 (enrdf_load_stackoverflow) | 1993-09-24 |
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