JPS62145398U - - Google Patents
Info
- Publication number
- JPS62145398U JPS62145398U JP3197886U JP3197886U JPS62145398U JP S62145398 U JPS62145398 U JP S62145398U JP 3197886 U JP3197886 U JP 3197886U JP 3197886 U JP3197886 U JP 3197886U JP S62145398 U JPS62145398 U JP S62145398U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- surface treatment
- high frequency
- housing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 5
- 239000002335 surface treatment layer Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例における高周波シー
ルド筐体の斜視図、第２図は同フレームと仕切板
との接合部の斜視図、第３図は同筐体とプリント
基板との接続部の斜視図、第４図は同筐体とプリ
ント基板との接続部断面図、第５図は同筐体とプ
リント基板とを同時デイツプした例の接続断面図
、第６図は従来の高周波シールド筐体の斜視図、
第７図は同筐体接続部の斜視図、第８図は同別ピ
ース金属板使用例の筐体接続部の斜視図、第９図
は同断面図である。
１…筐体、１ａ…フレーム、１ｂ…仕切板、２
…表面処理層、３…プリント基板、４…銅箔部分
、５…ソルダレジスト未塗布部分、６…表面処理
層除去部分、７…半田。
Fig. 1 is a perspective view of a high frequency shield casing according to an embodiment of the present invention, Fig. 2 is a perspective view of the joint between the frame and the partition plate, and Fig. 3 is a perspective view of the connection between the casing and the printed circuit board. Figure 4 is a cross-sectional view of the connection between the housing and the printed circuit board, Figure 5 is a cross-sectional view of the connection in an example where the housing and the printed circuit board are simultaneously dipped, and Figure 6 is a conventional high-frequency shield. A perspective view of the housing;
FIG. 7 is a perspective view of the case connection part, FIG. 8 is a perspective view of the case connection part in an example of using the same piece metal plate, and FIG. 9 is a sectional view thereof. 1... Housing, 1a... Frame, 1b... Partition plate, 2
...Surface treatment layer, 3. Printed circuit board, 4. Copper foil portion, 5. Solder resist uncoated portion, 6. Surface treatment layer removed portion, 7. Solder.
Claims (1)
し電気遮蔽を行なう金属性の仕切板とからなる筐
体は半田付け可能な金属上に半田が付着し難いメ
ツキ等の表面処理を施した材料により作成されて
おり、前記筐体の一部分には表面処理層を除去し
た箇所を有することを特徴とする高周波シールド
筐体。 (2) 金属性の筐体は複数の金属性のフレームと
仕給板より構成され、金属性のフレームと仕切板
、また仕切板同士の接合部に表面処理層除去箇所
を有することを特徴とする実用新案登録請求の範
囲第(1)項記載の高周波シールド筐体。 (3) 金属性のシールド筐体内部には回路部品の
配線されたプリント基板を有し、該プリント基板
と筐体との半田付け接続を行なう箇所に、表面処
理層を除去した部分を有することを特徴とする実
用新案登録請求の範囲第(1)項記載の高周波シー
ルド筐体。[Scope of Claim for Utility Model Registration] (1) A housing consisting of a metal frame and a metal partition plate that forms compartments inside the frame and performs electrical shielding is difficult for solder to adhere to metal that can be soldered. 1. A high frequency shield casing, characterized in that the casing is made of a material subjected to surface treatment such as plating, and has a portion from which the surface treatment layer has been removed. (2) The metal casing is composed of a plurality of metal frames and supply plates, and is characterized by having surface treatment layer removal areas at the metal frames and partition plates, and at the joints between the partition plates. A high frequency shield casing according to claim (1) of the utility model registration claim. (3) The metal shield housing must have a printed circuit board on which circuit components are wired inside, and have a portion from which the surface treatment layer has been removed at the location where the printed circuit board and the housing are connected by soldering. A high frequency shield casing according to claim (1) of the utility model registration claim, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3197886U JPS62145398U (en) | 1986-03-07 | 1986-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3197886U JPS62145398U (en) | 1986-03-07 | 1986-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145398U true JPS62145398U (en) | 1987-09-12 |
Family
ID=30838216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3197886U Pending JPS62145398U (en) | 1986-03-07 | 1986-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145398U (en) |
-
1986
- 1986-03-07 JP JP3197886U patent/JPS62145398U/ja active Pending
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