JPS6214492A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS6214492A JPS6214492A JP15358285A JP15358285A JPS6214492A JP S6214492 A JPS6214492 A JP S6214492A JP 15358285 A JP15358285 A JP 15358285A JP 15358285 A JP15358285 A JP 15358285A JP S6214492 A JPS6214492 A JP S6214492A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- high frequency
- frequency
- frequency printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
日既要〕
無線通信機等を構成する回路には、低周波回路と、高周
波回路が用いられており、この低周波回路と高周波回路
を実装するプリント基板の材質が異なるので、高周波プ
リント基板を、低周波プリント基板に重畳実装して自動
実装を可能にした。[Detailed Description of the Invention] Japanese Already Required] Low frequency circuits and high frequency circuits are used in circuits constituting wireless communication devices, etc., and the material of the printed circuit board on which the low frequency circuits and high frequency circuits are mounted is different. Since they are different, the high-frequency printed circuit board is superimposed on the low-frequency printed circuit board to enable automatic mounting.
本発明は、低周波回路部品と、高周波回路部品を同時実
装可能なプリント基板に係り、とくに高周波プリント基
板を低周波プリント基板に重畳接着するようにしたプリ
ント基板に関する。The present invention relates to a printed circuit board on which low frequency circuit components and high frequency circuit components can be simultaneously mounted, and particularly to a printed circuit board in which a high frequency printed circuit board is superimposed and bonded to a low frequency printed circuit board.
近年、電子機器とくに無線装置は小形、軽量化の要望が
強いが、無線通信機等を構成する回路には、低周波回路
と、高周波回路が併用されているので、低周波回路には
低価格のガラスエポキシ樹脂等のプリント基板が、また
高周波回路には高周波損失の少ない高価なテフロン・ガ
ラス等からなるプリント基板が用いられる。したがって
、プリント基板への部品実装は別個に行なわなければな
らず、また高周波プリント基板は周波数が高くなれば厚
さは薄くなる為、自動実装が出来ないので、低周波回路
部品と、高周波回路部品の同時実装可能なプリント基板
の開発が強く要望されている。In recent years, there has been a strong demand for electronic devices, especially wireless devices, to be smaller and lighter, but the circuits that make up wireless communication equipment use both low-frequency circuits and high-frequency circuits, so low-frequency circuits are available at low prices. For high-frequency circuits, printed circuit boards made of expensive Teflon glass or the like with little high-frequency loss are used. Therefore, components must be mounted on printed circuit boards separately, and high-frequency printed circuit boards become thinner as the frequency increases, so automatic mounting is not possible. There is a strong demand for the development of a printed circuit board that can be mounted simultaneously.
第３図は、従来のプリント基板を説明する装置の模式的
斜視図である。FIG. 3 is a schematic perspective view of an apparatus for explaining a conventional printed circuit board.
図において、金属たとえばアルミニューム等からなる筺
体１に低周波部（ミキサ部、中間周波部等）を搭載する
ガラスエポキシ樹脂等からなる低周波プリント基！Ｆｉ
２と、高周波部を搭載する高周波損失の少ないテフロン
・ガラス等からなるプリント基板３に、それぞれ低周波
部と高周波部を搭載して、前記筐体１内に実装して、こ
のプリント基板間を図示しない同軸線等で接続するとと
もに、要すれば両基板間をシールド板４で遮蔽する構造
となっている。In the figure, a low-frequency printed base made of glass epoxy resin or the like is mounted with a low-frequency part (mixer part, intermediate frequency part, etc.) mounted on a housing 1 made of metal such as aluminum! Fi
A low frequency section and a high frequency section are respectively mounted on a printed circuit board 3 made of Teflon glass or the like with low high frequency loss on which a high frequency section is mounted, and the circuit board 3 is mounted inside the housing 1 and connected between the printed circuit boards. The structure is such that they are connected by a coaxial line (not shown) or the like, and if necessary, the two boards are shielded by a shield plate 4.
上記従来のプリント基板にあっては、低周波プリント基
板と、高周波プリント基板とを別個に部品を搭載するの
であるが、低周波プリント基板はガラスエポキシ樹脂等
で形成されているので自動実装が可能であるが、高周波
プリント基板は可撓性の比較的薄いテフロンガラスで形
成されているので、回路部品の自動実装ができず部品搭
載作業に多大の工数を要する等の問題点があった。In the conventional printed circuit board mentioned above, parts are mounted separately on the low frequency printed circuit board and the high frequency printed circuit board, but since the low frequency printed circuit board is made of glass epoxy resin etc., automatic mounting is possible. However, since the high-frequency printed circuit board is made of flexible and relatively thin Teflon glass, there are problems in that automatic mounting of circuit components is not possible and a large number of man-hours are required for mounting the components.
本発明は、上記の問題点を解決して自動実装が可能で小
形化したプリント基板を提供するものである。The present invention solves the above problems and provides a printed circuit board that can be automatically mounted and is miniaturized.
すなわち、低周波プリント基板に、高周波プリント基板
を実装するプリント基板を、前記低周波プリント基板の
高周波プリント基板を実装する部分に接地導体パターン
を形成し、この接地導体パターン上と高周波プリント基
板の下面に設けた接地導体パターンとを接着するように
したことによって解決される。That is, a printed circuit board on which a high frequency printed circuit board is mounted is formed on a low frequency printed circuit board, a ground conductor pattern is formed on the part of the low frequency printed circuit board where the high frequency printed circuit board is mounted, and a ground conductor pattern is formed on the ground conductor pattern and on the bottom surface of the high frequency printed circuit board. This problem can be solved by bonding the ground conductor pattern provided on the ground conductor pattern.
上記プリント基板は、高周波回路部品を搭載する可撓性
の比較的薄いテフロンガラスで形成された、高周波プリ
ント基板を、比較的硬質のエポキシ樹脂の低周波プリン
ト基板に接着したことによって、部品の自動実装が可能
となり、しかも小形化できる。The above printed circuit board is made by bonding a high frequency printed circuit board made of flexible relatively thin Teflon glass on which high frequency circuit components are mounted to a low frequency printed circuit board made of relatively hard epoxy resin. It is possible to implement it, and it can also be made smaller.
第１図は、本発明の一実施例を説明する図で、同図（ａ
）はプリント基板を実装した模式的斜視図。FIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a schematic perspective view of a printed circuit board mounted.
（ｂｌは複数の高周波プリント基板を実装した斜視図゛
で、第３図と同等の部分については同一符号を付してい
る。(bl is a perspective view in which a plurality of high-frequency printed circuit boards are mounted, and parts equivalent to those in FIG. 3 are given the same reference numerals.
第１図（ａ）は、金属たとえばアルミニューム等からな
る筺体１に低周波部（ミキサ部、中間周波部等）を搭載
するガラスエポキシ樹脂等からなる低周波プリント基板
２の、高周波部を搭載する高周波損失の少ないテフロン
・ガラス等からなる高周波プリント基板３を実装する部
分に、銅等からなる接地導体パターン２１を形成し、こ
の接地導体パターン２１にシート半田等を介して、高周
波プリント基板３を接着し、図示しない回路部品を実装
したるのち、前記筐体に取着する。そして必要に応じシ
ールド板４で遮蔽する。FIG. 1(a) shows a low frequency printed circuit board 2 made of glass epoxy resin, etc., in which a low frequency part (mixer part, intermediate frequency part, etc.) is mounted on a housing 1 made of metal such as aluminum, etc., and a high frequency part is mounted thereon. A ground conductor pattern 21 made of copper or the like is formed on the part where the high frequency printed circuit board 3 made of Teflon glass or the like with low high frequency loss is mounted, and the high frequency printed circuit board 3 is attached to this ground conductor pattern 21 via sheet solder or the like. After bonding and mounting circuit components (not shown), it is attached to the casing. Then, if necessary, it is shielded with a shield plate 4.
第１図（ｂ）は、低周波プリント基板２に複数の高周波
プリント基板３を、第１図（ａ）の工程の順序で接着し
たプリント基板である。FIG. 1(b) shows a printed circuit board in which a plurality of high frequency printed circuit boards 3 are bonded to a low frequency printed circuit board 2 in the order of steps shown in FIG. 1(a).
第２図は、本発明の他の実施例を説明する斜視図で、第
１図と同等の部分については同一符号を付している。FIG. 2 is a perspective view illustrating another embodiment of the present invention, in which the same parts as in FIG. 1 are designated by the same reference numerals.
図において、エポキシ樹脂等からなる低周波プリント基
板２に、複数の高周波プリント基板３を実装する位置に
、高周波プリント基板３より若干小さい孔２２を設け、
その周囲に銅等からなる接地導体パターン２１を形成し
て、この接地導体パターン２１にシート半田等を介して
、図示しない高周波プリント基板を接着するものである
。このようにすれば高周波プリント基板の裏面実装が可
能となる。In the figure, a hole 22 slightly smaller than the high frequency printed circuit board 3 is provided in a low frequency printed circuit board 2 made of epoxy resin or the like at a position where a plurality of high frequency printed circuit boards 3 are to be mounted.
A ground conductor pattern 21 made of copper or the like is formed around it, and a high frequency printed circuit board (not shown) is bonded to this ground conductor pattern 21 via sheet solder or the like. In this way, backside mounting of the high frequency printed circuit board becomes possible.
なお、本実施例では高周波プリント基板３をテフロンガ
ラスについて説明したが、より高周波数（ミリ波帯）に
なれば高周波損失のより少ないアルミナ基板を使用すれ
ば良い。In this embodiment, Teflon glass is used as the high frequency printed circuit board 3, but for higher frequencies (millimeter wave band), an alumina substrate with less high frequency loss may be used.
以上の説明から明らかなように、本発明によれば部品実
装作業能率が向上するとともに、小形化が期待でき、し
かも短距離接続が可能となり、コストダウンに極めて有
効である。As is clear from the above description, according to the present invention, the efficiency of component mounting work can be improved, miniaturization can be expected, and short-distance connections can be made, which is extremely effective in reducing costs.
第１図は、本発明の一実施例を説明する図で、同図ｆａ
ｔはプリント基板を実装した模式的斜視図。
（ｂ）は複数の高周波プリント基板を実装した斜視図、
第２図は、本発明の他の実施例を説明する斜視図、
第３図は、従来のプリント基板を説明する装置の模式的
斜視図である。
図において、ｌは１体、２は低周波プリント基板、３は
高周波プリント基板、４はシールド坂、２１は接地導体
パターン、２２は孔、をそれぞれ示す。
第 １ 図
オ項５ｇ月１仁、Ｊ方自例
第２図
２ イホ訃皮フ＃ｌ〉ト、ｅ気
第 ３ 図FIG. 1 is a diagram illustrating an embodiment of the present invention.
t is a schematic perspective view in which a printed circuit board is mounted. (b) is a perspective view with multiple high-frequency printed circuit boards mounted;
FIG. 2 is a perspective view for explaining another embodiment of the present invention, and FIG. 3 is a schematic perspective view of an apparatus for explaining a conventional printed circuit board. In the figure, l indicates one body, 2 indicates a low frequency printed circuit board, 3 indicates a high frequency printed circuit board, 4 indicates a shield slope, 21 indicates a ground conductor pattern, and 22 indicates a hole. Fig. 1 O section 5g month 1 nin, J way example Fig. 2
Claims (2)
板（３）を実装するプリント基板を、 前記低周波プリント基板（２）の高周波プリント基板（
３）を実装する部分に接地導体パターン（２１）を形成
し、 該接地導体パターン（２１）上と高周波プリント基板（
３）の下面に設けた接地導体パターンとを接着するよう
にしたことを特徴とするプリント基板。(1) A printed circuit board on which a high frequency printed circuit board (3) is mounted on a low frequency printed circuit board (2), and a high frequency printed circuit board (
A ground conductor pattern (21) is formed on the part where 3) is to be mounted, and a ground conductor pattern (21) is formed on the high frequency printed circuit board (
3) A printed circuit board characterized in that the ground conductor pattern provided on the lower surface is bonded to the ground conductor pattern.
基板（３）を実装する対応位置に、高周波プリント基板
（３）より若干小さい孔（２２）を設けたことを特徴と
する特許請求の範囲第（１）項に記載のプリント基板。(2) A hole (22) slightly smaller than the high frequency printed circuit board (3) is provided at a position corresponding to the mounting position of the high frequency printed circuit board (3) on the low frequency printed circuit board (2). The printed circuit board according to item (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15358285A JPS6214492A (en) | 1985-07-11 | 1985-07-11 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15358285A JPS6214492A (en) | 1985-07-11 | 1985-07-11 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214492A true JPS6214492A (en) | 1987-01-23 |
Family
ID=15565638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15358285A Pending JPS6214492A (en) | 1985-07-11 | 1985-07-11 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214492A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009288451A (en) * | 2008-05-28 | 2009-12-10 | Toshiba Tec Corp | Commodity information display system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53146169A (en) * | 1977-05-25 | 1978-12-19 | Canon Kk | Electric circuit board unit |
| JPS585375B2 (en) * | 1973-10-03 | 1983-01-31 | サンキスト グロワ−ズ インコ−ポレ−テツド | Hearted fruit automatic sorting device |
-
1985
- 1985-07-11 JP JP15358285A patent/JPS6214492A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585375B2 (en) * | 1973-10-03 | 1983-01-31 | サンキスト グロワ−ズ インコ−ポレ−テツド | Hearted fruit automatic sorting device |
| JPS53146169A (en) * | 1977-05-25 | 1978-12-19 | Canon Kk | Electric circuit board unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009288451A (en) * | 2008-05-28 | 2009-12-10 | Toshiba Tec Corp | Commodity information display system |
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