JPH05102635A - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JPH05102635A JPH05102635A JP26347191A JP26347191A JPH05102635A JP H05102635 A JPH05102635 A JP H05102635A JP 26347191 A JP26347191 A JP 26347191A JP 26347191 A JP26347191 A JP 26347191A JP H05102635 A JPH05102635 A JP H05102635A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- electronic
- electronic component
- circuit board
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、自動車電話、携帯電話
等に利用する電子回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device used in a car phone, a mobile phone and the like.
【0002】[0002]
【従来の技術】図2は従来の電子回路装置の構成を示し
ている。図2において、1、2はプリント基板、3、
4、5、6は電子部品である。プリント基板1には電子
部品3、4が実装され、またプリント基板2にも電子部
品5、6が実装されている。プリント基板1、2は、非
実装面を接着剤で貼り合わせ、その全体が一体化されて
いる。2. Description of the Related Art FIG. 2 shows the configuration of a conventional electronic circuit device. In FIG. 2, 1 and 2 are printed circuit boards, 3,
4, 5, and 6 are electronic components. Electronic components 3 and 4 are mounted on the printed circuit board 1, and electronic components 5 and 6 are also mounted on the printed circuit board 2. The printed circuit boards 1 and 2 have their non-mounting surfaces bonded together with an adhesive, and are wholly integrated.
【0003】[0003]
【発明が解決しようとする課題】ところで、従来の電子
回路装置では、その全体の厚さは、プリント基板1、電
子部品4、プリント基板2および電子部品6の合計にな
る。したがって、この合計の厚さ以内の筐体内には、こ
のプリント基板1、2と電子部品3、4、5、6とから
なる電子回路装置は配置できず、換言すれば、筐体の厚
さが増大してしまうという欠点がある。By the way, in the conventional electronic circuit device, the total thickness thereof is the total of the printed circuit board 1, the electronic component 4, the printed circuit board 2 and the electronic component 6. Therefore, the electronic circuit device including the printed boards 1 and 2 and the electronic components 3, 4, 5, and 6 cannot be arranged in the housing within the total thickness, in other words, the thickness of the housing. Has the disadvantage that it increases.
【0004】本発明は、このような課題を解決するもの
であり、厚さを最低まで低減でき、且つ、電磁結合によ
る相互干渉を阻止して動作が安定し、また短絡を阻止で
きるとともに、容易に分離、取り外しができる優れた電
子回路装置を提供することを目的とする。The present invention is to solve such a problem, and can reduce the thickness to the minimum, prevent mutual interference due to electromagnetic coupling to stabilize the operation, and prevent a short circuit, and easily. It is an object of the present invention to provide an excellent electronic circuit device that can be separated and removed.
【0005】[0005]
【課題を解決するための手段】この目的を達成するため
に、本発明の電子回路装置は、高さが高い第1の電子部
品と、高さが低い第2の電子部品が同一面に実装される
第1のプリント基板と、第1のプリント基板の実装面に
対向した実装面に、第2の電子部品に対向して配置され
る高さが高い第3の電子部品と第1の電子部品に対向し
て配置される高さが低い第4の電子部品とが実装される
第2のプリント基板と、第1および第2の電子部品と第
3および第4の電子部品との間に配置される遮蔽部材
と、第1のプリント基板と第2のプリント基板とを着脱
可能、且つ、電気的機械的に接続するコネクタとを備え
るものである。In order to achieve this object, in an electronic circuit device of the present invention, a first electronic component having a high height and a second electronic component having a low height are mounted on the same surface. A first printed circuit board, a third electronic component having a high height and a first electronic circuit disposed on the mounting surface of the first printed circuit board facing the mounting surface of the first printed circuit board. Between a second printed circuit board on which a fourth electronic component having a low height and arranged to face the component is mounted, and between the first and second electronic components and the third and fourth electronic components It is provided with a shielding member arranged, and a connector for detachably and electrically and mechanically connecting the first printed circuit board and the second printed circuit board.
【0006】[0006]
【作用】したがって、本発明の電子回路装置によれば、
2枚のプリント基板に実装される高さが高い電子部品
と、高さが低い電子部品とを対向して配置し、またこの
間に表面を絶縁した遮蔽部材を配置するとともに、2枚
のプリント基板をコネクタで接続しているため、厚さを
最低まで低減でき、且つ、電磁結合による相互干渉を阻
止して動作が安定し、また短絡を阻止できるとともに容
易に分離、取り外しができるTherefore, according to the electronic circuit device of the present invention,
An electronic component having a high height and an electronic component having a low height, which are mounted on two printed circuit boards, are arranged so as to face each other, and a shielding member having an insulated surface is disposed between the two electronic circuit boards. Since it is connected with a connector, the thickness can be reduced to the minimum, and mutual interference due to electromagnetic coupling is prevented to stabilize the operation, short circuit can be prevented, and it can be easily separated and removed.
【0007】[0007]
【実施例】次に、本発明の電子回路装置の実施例を図面
を参照して説明する。Embodiments of the electronic circuit device of the present invention will be described below with reference to the drawings.
【0008】図1は実施例の構成を示している。図1に
おいて、11はプリント基板(第1のプリント基板に対
応)、13、15はプリント基板11に実装される電子
部品であり電子部品13(第1の電子部品に対応)は最
も高さが高く、電子部品15(第2の電子部品に対応)
は最も高さが低い形状である。12は、プリント基板
(第2のプリント基板に対応)であり、14、16はプ
リント基板12に実装される電子部品であり、電子部品
14(第3の電子部品に対応)は最も高さが高く、電子
部品16(第4の電子部品に対応)は最も高さが低い形
状である。17は、両面を絶縁加工した金属導体板(遮
蔽部材に対応)である。18、19は着脱可能なコネク
タであり、プリント基板11、12を電気的に接続し、
且つ、機械的に保持している。FIG. 1 shows the configuration of the embodiment. In FIG. 1, 11 is a printed circuit board (corresponding to the first printed circuit board), 13 and 15 are electronic components mounted on the printed circuit board 11, and the electronic component 13 (corresponding to the first electronic circuit) has the highest height. High, electronic component 15 (corresponding to the second electronic component)
Is the lowest height. 12 is a printed circuit board (corresponding to the second printed circuit board), 14 and 16 are electronic parts mounted on the printed circuit board 12, and the electronic part 14 (corresponding to the third electronic part) has the highest height. The height is high, and the electronic component 16 (corresponding to the fourth electronic component) has the lowest height. Reference numeral 17 denotes a metal conductor plate (corresponding to a shielding member) whose both surfaces are insulated. Denoted at 18 and 19 are detachable connectors for electrically connecting the printed circuit boards 11 and 12,
Moreover, it is mechanically held.
【0009】次に、この構成の機能について説明する。
プリント基板11に実装される最も高さが高い電子部品
13に対向してプリント基板12に実装される最も高さ
が低い電子部品16が配置されている。また、同様に電
子部品14に対向して電子部品15が配置されている。Next, the function of this configuration will be described.
An electronic component 16 having the lowest height mounted on the printed board 12 is arranged so as to face the electronic component 13 having the highest height mounted on the printed board 11. Similarly, the electronic component 15 is arranged so as to face the electronic component 14.
【0010】プリント基板11、12および電子部品1
3、15と電子部品14、16と間に、両面が絶縁加工
された金属導体板17が配置され、電磁結合による相互
干渉と、短絡を阻止している。Printed circuit boards 11 and 12 and electronic component 1
A metal conductor plate 17 whose both surfaces are insulated is arranged between 3, 15 and the electronic components 14, 16 to prevent mutual interference due to electromagnetic coupling and short circuit.
【0011】プリント基板11、12とは、コネクタ1
8、19により電気的に接続されるとともに、機械的に
保持されている。The printed circuit boards 11 and 12 refer to the connector 1
It is electrically connected by 8 and 19 and is mechanically held.
【0012】このように、プリント基板11に実装され
る電子部品13、15とプリント基板12に実装される
電子部品14、16の高さを考慮し、すなわち、最も高
さが高い電子部品13、14と、最も高さが低い電子部
品15、16をそれぞれ対向して配置するようにしてい
るため、厚さを最低まで低減できる。As described above, considering the heights of the electronic components 13 and 15 mounted on the printed circuit board 11 and the electronic components 14 and 16 mounted on the printed circuit board 12, that is, the electronic component 13 having the highest height, Since 14 and the electronic components 15 and 16 having the lowest height are arranged to face each other, the thickness can be reduced to the minimum.
【0013】また金属導体板17をプリント基板11、
12との間に配置しているため、電磁結合による相互干
渉を阻止し、安定に動作するとともに、電子部品13、
15と電子部品14、16との間の短絡を阻止できる。The metal conductor plate 17 is attached to the printed circuit board 11,
Since it is arranged between the electronic parts 13 and 12, it prevents mutual interference due to electromagnetic coupling and operates stably,
A short circuit between 15 and the electronic components 14, 16 can be prevented.
【0014】さらに、プリント基板11、12を着脱可
能なコネクタ18、19で接続しているので容易に分
離、取り外しができ、以降の保守が容易になる。Furthermore, since the printed circuit boards 11 and 12 are connected by the removable connectors 18 and 19, they can be easily separated and removed, and the subsequent maintenance becomes easy.
【0015】[0015]
【発明の効果】以上の説明から明らかなように、本発明
の電子回路基板装置は、2枚のプリント基板に実装され
る高さが高い電子部品と、高さが低い電子部品とを対向
して配置し、またこの間に表面を絶縁した遮蔽部材を配
置するとともに、2枚のプリント基板をコネクタで接続
しているため、厚さを最低まで低減でき、且つ、電磁結
合による相互干渉を阻止して動作が安定し、また短絡を
阻止できるとともに容易に分離、取り外しができるとい
う効果を有する。As is apparent from the above description, in the electronic circuit board device of the present invention, an electronic component having a high height mounted on two printed circuit boards and an electronic component having a low height are opposed to each other. And the shielding member whose surface is insulated is placed between them, and since the two printed circuit boards are connected by the connector, the thickness can be reduced to the minimum and mutual interference due to electromagnetic coupling is prevented. The operation is stable, a short circuit can be prevented, and it can be easily separated and removed.
【図1】本発明の電子回路装置の実施例の構成を示す側
面図FIG. 1 is a side view showing a configuration of an embodiment of an electronic circuit device of the present invention.
【図2】従来の電子回路装置の構成を示す側面図FIG. 2 is a side view showing the configuration of a conventional electronic circuit device.
11、12 プリント基板 13、14、15、16 電子部品 17 金属導体板 18、19 コネクタ 11, 12 Printed circuit board 13, 14, 15, 16 Electronic component 17 Metal conductor plate 18, 19 Connector
Claims (1)
第2の電子部品が同一面に実装される第1のプリント基
板と、前記第1のプリント基板の実装面に対向した実装
面に、前記第2の電子部品に対向して配置される高さが
高い第3の電子部品と前記第1の電子部品に対向して配
置される高さが低い第4の電子部品とが実装される第2
のプリント基板と、前記第1および第2の電子部品と前
記第3および第4の電子部品との間に配置される遮蔽部
材と、前記第1のプリント基板と第2のプリント基板と
を着脱可能、且つ、電気的機械的に接続するコネクタと
を備える電子回路装置。1. A first printed board on which a first electronic component having a high height and a second electronic component having a low height are mounted on the same surface, and a mounting surface of the first printed board facing each other. On the mounting surface, a third electronic component having a high height arranged to face the second electronic component and a fourth electronic component having a low height arranged to face the first electronic component. The second where and are implemented
The printed circuit board, the shielding member arranged between the first and second electronic components and the third and fourth electronic components, and the first printed circuit board and the second printed circuit board. An electronic circuit device that includes a connector that can be electrically and mechanically connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26347191A JPH05102635A (en) | 1991-10-11 | 1991-10-11 | Electronic circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26347191A JPH05102635A (en) | 1991-10-11 | 1991-10-11 | Electronic circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05102635A true JPH05102635A (en) | 1993-04-23 |
Family
ID=17389974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26347191A Pending JPH05102635A (en) | 1991-10-11 | 1991-10-11 | Electronic circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05102635A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5740527A (en) * | 1994-11-24 | 1998-04-14 | Nec Corporation | Transceiver |
CN102882995A (en) * | 2011-07-13 | 2013-01-16 | Lg电子株式会社 | Mobile terminal |
JP2019009214A (en) * | 2017-06-22 | 2019-01-17 | カシオ計算機株式会社 | Electronic apparatus |
JP2019009213A (en) * | 2017-06-22 | 2019-01-17 | カシオ計算機株式会社 | Substrate structure |
JP2022018269A (en) * | 2020-07-15 | 2022-01-27 | コーセル株式会社 | Power supply device with insulating cover and manufacturing method thereof |
-
1991
- 1991-10-11 JP JP26347191A patent/JPH05102635A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5740527A (en) * | 1994-11-24 | 1998-04-14 | Nec Corporation | Transceiver |
CN102882995A (en) * | 2011-07-13 | 2013-01-16 | Lg电子株式会社 | Mobile terminal |
JP2013021671A (en) * | 2011-07-13 | 2013-01-31 | Lg Electronics Inc | Mobile terminal |
US8976540B2 (en) | 2011-07-13 | 2015-03-10 | Lg Electronics Inc. | Mobile terminal |
JP2019009214A (en) * | 2017-06-22 | 2019-01-17 | カシオ計算機株式会社 | Electronic apparatus |
JP2019009213A (en) * | 2017-06-22 | 2019-01-17 | カシオ計算機株式会社 | Substrate structure |
JP2022018269A (en) * | 2020-07-15 | 2022-01-27 | コーセル株式会社 | Power supply device with insulating cover and manufacturing method thereof |
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