JPS62117396A - Mounting structure of circuit unit - Google Patents
Mounting structure of circuit unitInfo
- Publication number
- JPS62117396A JPS62117396A JP25653385A JP25653385A JPS62117396A JP S62117396 A JPS62117396 A JP S62117396A JP 25653385 A JP25653385 A JP 25653385A JP 25653385 A JP25653385 A JP 25653385A JP S62117396 A JPS62117396 A JP S62117396A
- Authority
- JP
- Japan
- Prior art keywords
- motherboard
- circuit unit
- terminal
- mounting structure
- frequency circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（目 次〕
・概要
・ 産業上の利用分野
・ 従来の技術
・ 発明が解決しようとする問題点
・ 問題点を解決するための手段
・作用
・ 実施例
・ 発明の効果
〔概 要〕
高周波回路ユニットのビン端子を受入れるジャック端子
をマザーボードの６にユニット搭載面側に入口部を突出
させて設け、該ユニット搭載面の反対面側には該ジャッ
ク端子を突出さゼず、これにより該ユニット搭載面の反
対面側に別の高周波回路ユニットを搭載可能とした回路
ユニットのマザーボード−ヒへの搭載構造。[Detailed description of the invention] (Table of contents) - Overview - Industrial application field - Conventional technology - Problems to be solved by the invention - Means and effects for solving the problems - Examples - Effects of the invention [Summary] A jack terminal for receiving a pin terminal of a high-frequency circuit unit is provided on the motherboard 6 with an inlet protruding from the side where the unit is mounted, and the jack terminal does not protrude from the side opposite to the unit mounting surface. A structure for mounting a circuit unit on a motherboard, thereby making it possible to mount another high-frequency circuit unit on the opposite side of the unit mounting surface.
本発明は、高周波回路ユニットのマザーボード」二への
搭載構造に関する。The present invention relates to a mounting structure for a high frequency circuit unit on a motherboard.
無線装置等で使用される高周波回路ユニ・７トは相互電
磁干渉を防ぐため個々にシールドされ、各機能ユニット
同士がマザーボードＪ−に搭載されマザーボードの配線
パターンを介して相互に信号、電源等が接続される。The high frequency circuit units used in wireless devices, etc. are individually shielded to prevent mutual electromagnetic interference, and each functional unit is mounted on the motherboard J-, and signals, power, etc. are transmitted to each other via the motherboard's wiring pattern. Connected.
従来の高周波ユニットの搭載構造を第２図に示す。高周
波回路ユニット１は、プリント基板（誘電体Ｘ板）２の
上面に配線パターン又は分布定数回路（図示しない）を
形成し複数の電子部品３を搭載して高周波回路を構成し
、この回路を電磁う・−ルド用金属ケース５で覆い、プ
リントＪ轟板士面にビン端子４を突出さ−Ｕだものであ
る。マザーボード６のスルーホール８にこのマザーボー
ｔ” 〔ｉの厚さ以１−の長さのジャックａ：１１子７
が挿入され、その底面をマザーボード１ぐ面に突出し”
（固定されている。従来は高周波回路コ、ニットｌのビ
ン端子４がこのようなマザーボードにのジャック端子７
に挿入されて高周波回路１ニツト１がマザーボード８−
トに搭載固定される構造であった。Figure 2 shows the mounting structure of a conventional high-frequency unit. The high-frequency circuit unit 1 forms a wiring pattern or a distributed constant circuit (not shown) on the top surface of a printed circuit board (dielectric X board) 2, mounts a plurality of electronic components 3, and configures a high-frequency circuit. It is covered with a metal case 5 for the wall, and the pin terminal 4 is protruded from the surface of the printed J-board. Insert this motherboard into the through hole 8 of the motherboard 6.
is inserted, and its bottom protrudes from the motherboard side.
(It is fixed. Conventionally, the pin terminal 4 of the high frequency circuit connector and knit l is the jack terminal 7 of such a motherboard.)
The high frequency circuit 1 is inserted into the motherboard 8-
The structure was such that it was mounted and fixed on the vehicle.
前記従来構造におい”ζは、装置の小型化のために高密
度実装が要求される無線装置等にＬ？い゛乙実装密度に
限界があり、特にマザーボード士面が無駄になり充分な
高密度実装が図れなかった。In the conventional structure described above, "ζ" is not suitable for wireless devices that require high-density mounting in order to miniaturize the device.There is a limit to the mounting density. I couldn't plan on implementing it.
本発明は−１−記従来技術の欠点に鑑みなされたもので
あって、マザーボーＦ ’Ｆ面を有効に利用し゛Ｃ実装
密度の増加を図った高ｌｈＩ波回１路の搭載構造の提供
を目的とする。The present invention has been made in view of the shortcomings of the prior art described in -1-, and aims to provide a mounting structure for a single high-IhI wave circuit, which effectively utilizes the motherboard F'F surface and increases the mounting density of the circuit. purpose.
この目的を達成するため、本発明では、マザーボードの
スルーホールに該マザーボードの厚さ以セの長さのジャ
ック端子を挿入して固定し、プリン１〜板トに形成した
回路と、該回路を覆う金属ケースと、該プリント板Ｆ面
に突出するビン端子とからなる回路ユニットの一ト記ビ
ン端子を」二記ジャック端子に挿入して該マザーポート
−］二に回路ユニットを搭載する回路ユニットの搭載構
造において、マザーボード上面に搭載する回路ユニット
用ジャック端子をその底面が該マザーボード下面とほぼ
一致した状態でスルーホール内に装着し、該マザーボー
ト表面に搭載する回路ユニット用ジャック端子をその底
面が該マザーボード上面とほぼ一致した状態でスルーホ
ール内に装着し、−Ｆ記金属ケース十−縁は、回路ユニ
ット装着時にマザーボート表面にほぼ達する程度にプリ
ント板の下面に突出させている。In order to achieve this object, in the present invention, a jack terminal having a length longer than the thickness of the motherboard is inserted into a through hole of the motherboard and fixed, and the circuit formed on the printed circuit board 1 to the board 1 and the circuit are connected to each other. A circuit unit consisting of a metal case to cover and a pin terminal protruding from the F side of the printed board, and a circuit unit in which the pin terminal is inserted into the jack terminal and the circuit unit is mounted on the mother port. In the mounting structure, the jack terminal for the circuit unit to be mounted on the top surface of the motherboard is installed in the through hole with its bottom surface almost aligned with the bottom surface of the motherboard, and the jack terminal for the circuit unit to be mounted on the surface of the motherboard is mounted in the through hole with its bottom surface almost aligned with the bottom surface of the motherboard. is mounted in the through-hole in a state that is substantially aligned with the top surface of the motherboard, and the edge of the metal case 10-F is made to protrude from the bottom surface of the printed board to the extent that it almost reaches the surface of the motherboard when the circuit unit is mounted.
高周波回路ユニットを把持するジャック端子はマザーボ
ードのそのユニットの搭載面側に人１」部を突出させ、
反対面側には底面を突出させないようにスルーホール内
に固定する。従っ°乙ユニット搭載面の反対面側に別の
ユニットの搭載がｉｉＪ能になる。The jack terminal that grips the high frequency circuit unit has a 1" part protruding from the side where the unit is mounted on the motherboard,
Fix it in the through hole so that the bottom does not protrude on the opposite side. Therefore, it becomes possible to mount another unit on the side opposite to the unit mounting surface.
第１図は本発明の一実施例の断面図である。プリント板
１２の両面に電子部品１３が搭載され高周波回路が形成
される。プリント板１２の両面には図示しない配線パタ
ーン又は分布定数回路等が設けられている。プリント板
１２のド面には電源、信号等の′入出力用ビン端子１４
が突出する。プリント板１２の」−下両面の電子部品１
３およびビン端子１４を覆う電磁シールド用金属ケース
１５がプリント板全体を覆って設し」られる。従って、
この金属ケース１５の下縁はプリンＩ（Ｎ ｌ ２の下
面に突出する。このようなプリント板１２とピン端子１
４と金属ケース１５とにより高周波回路ユニット１１を
構成する。マザーボード１６のスルーボール１９には、
高周波回路ユニット１１のビン端子１４を受入れるため
の、内部に接触ハネ端子をイｊする円筒形状のジャック
端子１７が挿入されハンダ１８により固定されている。FIG. 1 is a sectional view of an embodiment of the present invention. Electronic components 13 are mounted on both sides of the printed board 12 to form a high frequency circuit. A wiring pattern, a distributed constant circuit, etc. (not shown) are provided on both sides of the printed board 12. On the bottom side of the printed board 12 are input/output pin terminals 14 for power, signals, etc.
stands out. "Electronic components 1 on both sides of the printed board 12"-lower side
An electromagnetic shielding metal case 15 is provided to cover the entire printed board. Therefore,
The lower edge of this metal case 15 protrudes from the lower surface of the printed board 12 and the pin terminal 1.
4 and the metal case 15 constitute a high frequency circuit unit 11. The through ball 19 of the motherboard 16 has
A cylindrical jack terminal 17 having a contact spring terminal therein for receiving the pin terminal 14 of the high frequency circuit unit 11 is inserted and fixed with solder 18 .
マザーボード１６の４−面に搭載する高周波回路ユニッ
ト用のジャック端子１７はその人口部がマザーボード１
６の子方に突出し、その低部はマザーボード】６の下面
とほぼ揃えられている。マザーボーＦ′１６にはさらに
このマザーボードの下面に搭載するための高周波回路ユ
ニソｌ−（図示しない）用のジャ・７り端子１７ａが装
着されている。このジャック端子１７ａはその人「１部
がマザーボーＦ下面に突出し、その底面はマザーホード
上面にほぼ揃えられている。The jack terminal 17 for the high frequency circuit unit mounted on the 4th side of the motherboard 16 is connected to the motherboard 1.
It protrudes toward the lower side of the motherboard 6, and its lower part is almost aligned with the bottom surface of the motherboard 6. The motherboard F'16 is further equipped with a jack terminal 17a for a high frequency circuit (not shown) to be mounted on the bottom surface of the motherboard. A portion of this jack terminal 17a protrudes from the bottom surface of the motherboard F, and its bottom surface is almost aligned with the top surface of the motherboard.
このような構成において、各ジャック端子１７．１７ａ
に高同波回路ユニット１１のビン端子１４を挿入すれば
、マザーボード１６の一ト下両面に高周波回路が搭載さ
れる。なお、金属ケース１５の下縁１５ａは、高周波回
路ユニット１１をマザーボード１６に装着した際、マザ
ーボート−１−面に当接してプリント板上下の電子部品
１３およびビン端子１４をシールドするように形成され
る。従ってジャック端子１７の突出量により（即ら、マ
ザーボードの厚さにより）、金属ケース１５の下縁突出
量は変るが通常の場合はビン端子１４と同程度の長さで
よい。In such a configuration, each jack terminal 17.17a
By inserting the pin terminals 14 of the high frequency circuit unit 11 into the motherboard 16, high frequency circuits are mounted on both sides of the bottom of the motherboard 16. Note that the lower edge 15a of the metal case 15 is formed so that when the high frequency circuit unit 11 is mounted on the motherboard 16, it comes into contact with the motherboard-1 surface and shields the electronic components 13 and the pin terminals 14 on the top and bottom of the printed board. be done. Therefore, the amount of protrusion of the lower edge of the metal case 15 varies depending on the amount of protrusion of the jack terminal 17 (that is, depending on the thickness of the motherboard), but in normal cases, the length may be about the same as that of the pin terminal 14.
なお、各高周波回路ユニット同士の接続は、ジャック端
子間をマザーボード内層又は表面のパターン、（図示し
ない）により接続し−Ｃ行う。The high-frequency circuit units are connected to each other by connecting the jack terminals using a pattern (not shown) on the inner layer or surface of the motherboard.
以上説明したように、本発明においては、ジャック端子
の人口部をマザーボード七に突出させ、各ジャック端子
の底面はマザーボードの反対面側に突出しないようにス
ルーホール内に挿入されているため、マザーボードの両
面に高周波回路ユニットの搭載が可能になり実装密度が
大きくなる。As explained above, in the present invention, the artificial part of the jack terminal protrudes into the motherboard 7, and the bottom surface of each jack terminal is inserted into the through hole so as not to protrude to the opposite side of the motherboard. It is possible to mount high-frequency circuit units on both sides of the board, increasing the packaging density.
また、各高周波回路ユニットのプリント板についても両
面実装が可能となるためユニット小型化が図られる。ま
た金属ケースがビン端子を覆うため、ユニット取扱中の
ビン端子保護が図られる。Further, since the printed circuit board of each high frequency circuit unit can be mounted on both sides, the unit size can be reduced. Additionally, since the metal case covers the bin terminal, the bin terminal is protected while the unit is being handled.
第１図は本発明に係る高周波回路ユニットの搭載構造の
断面図、第２図は従来の高周波回路ユニットの搭載構造
の断面図である。
１１・・・高周波回路ユニット、
１２・・・プリント板、
１３・・・電子部品、
１４・・・ビン端子、
１５・・・金属ケース、
１６・・・マザーボード、
１７、１７３・・・ジャック端子、
１９・・・スルーボール。
本発明構造の断面図
ｓ１図
従来の構造の断面図FIG. 1 is a sectional view of a mounting structure for a high frequency circuit unit according to the present invention, and FIG. 2 is a sectional view of a conventional mounting structure for a high frequency circuit unit. DESCRIPTION OF SYMBOLS 11... High frequency circuit unit, 12... Printed board, 13... Electronic component, 14... Bin terminal, 15... Metal case, 16... Motherboard, 17, 173... Jack terminal , 19...Through ball. Cross-sectional view of the structure of the present invention s1 Figure Cross-sectional view of the conventional structure
Claims (1)
マザーボードの厚さ以上の長さのジャック（１７、１７
ａ）端子を挿入して固定し、プリント板（１２）上に形
成した回路と、該回路を覆う金属ケース（１５）と、該
プリント板下面に突出するピン端子（１４）とからなる
回路ユニット（１１）の上記ピン端子（１４）を上記ジ
ャック端子に挿入して該マザーボード上に回路ユニット
を搭載する回路ユニットの搭載構造において、マザーボ
ード上面に搭載する回路ユニット用ジャック端子（１７
）をその底面が該マザーボード（１６）下面とほぼ一致
した状態でスルーホール内に装着し、該マザーボード（
１６）下面に搭載する回路ユニット用ジャック端子（１
７ａ）をその底面が該マザーボード（１６）上面とほぼ
一致した状態でスルーホール（１９）内に装着し、上記
金属ケース（１５）下縁は、回路ユニット装着時にマザ
ーボード表面にほぼ達する程度にプリント板（１２）の
下面に突出させたことを特徴とする回路ユニットの搭載
構造。 ２、前記回路ユニットのプリント板（１２）はその両面
に電子部品が搭載されたことを特徴とする特許請求の範
囲第１項記載の回路ユニットの搭載構造。[Claims] 1. A through hole (19) of the motherboard (16) has a jack (17, 17
a) A circuit unit consisting of a circuit formed on a printed board (12) by inserting and fixing a terminal, a metal case (15) that covers the circuit, and a pin terminal (14) protruding from the bottom surface of the printed board. (11) In the circuit unit mounting structure in which the circuit unit is mounted on the motherboard by inserting the pin terminal (14) into the jack terminal, the circuit unit jack terminal (17) mounted on the top surface of the motherboard is provided.
) into the through-hole with its bottom surface almost aligned with the bottom surface of the motherboard (16), and then
16) Jack terminal for the circuit unit mounted on the bottom (1
7a) into the through hole (19) with its bottom surface almost aligned with the top surface of the motherboard (16), and the lower edge of the metal case (15) is printed to the extent that it almost reaches the surface of the motherboard when the circuit unit is installed. A mounting structure for a circuit unit characterized by protruding from the bottom surface of a plate (12). 2. The circuit unit mounting structure according to claim 1, wherein the printed board (12) of the circuit unit has electronic components mounted on both sides thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25653385A JPS62117396A (en) | 1985-11-18 | 1985-11-18 | Mounting structure of circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25653385A JPS62117396A (en) | 1985-11-18 | 1985-11-18 | Mounting structure of circuit unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62117396A true JPS62117396A (en) | 1987-05-28 |
Family
ID=17293944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25653385A Pending JPS62117396A (en) | 1985-11-18 | 1985-11-18 | Mounting structure of circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62117396A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8004852B2 (en) | 2007-12-28 | 2011-08-23 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| JP2019161036A (en) * | 2018-03-14 | 2019-09-19 | 株式会社リニア・サーキット | Substrate unit and substrate system using the same |
-
1985
- 1985-11-18 JP JP25653385A patent/JPS62117396A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8004852B2 (en) | 2007-12-28 | 2011-08-23 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| JP2019161036A (en) * | 2018-03-14 | 2019-09-19 | 株式会社リニア・サーキット | Substrate unit and substrate system using the same |
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