JPS62142856U - - Google Patents
Info
- Publication number
- JPS62142856U JPS62142856U JP1986029312U JP2931286U JPS62142856U JP S62142856 U JPS62142856 U JP S62142856U JP 1986029312 U JP1986029312 U JP 1986029312U JP 2931286 U JP2931286 U JP 2931286U JP S62142856 U JPS62142856 U JP S62142856U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- electrode
- semiconductor device
- lid
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986029312U JPS62142856U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-02-28 | 1986-02-28 | |
| DE19873706480 DE3706480A1 (de) | 1986-02-28 | 1987-02-27 | Halbleitereinrichtung |
| US07/019,561 US4796076A (en) | 1986-02-28 | 1987-02-27 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986029312U JPS62142856U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-02-28 | 1986-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62142856U true JPS62142856U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-09-09 |
Family
ID=12272699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986029312U Pending JPS62142856U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-02-28 | 1986-02-28 |
Country Status (3)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016195216A (ja) * | 2015-04-01 | 2016-11-17 | 富士電機株式会社 | 半導体モジュール及び半導体装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3481735B2 (ja) * | 1995-07-26 | 2003-12-22 | 株式会社東芝 | 半導体装置 |
| JP3491481B2 (ja) * | 1996-08-20 | 2004-01-26 | 株式会社日立製作所 | 半導体装置とその製造方法 |
| US8198712B2 (en) * | 2006-06-07 | 2012-06-12 | International Rectifier Corporation | Hermetically sealed semiconductor device module |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3311791A (en) * | 1964-08-04 | 1967-03-28 | Sprague Electric Co | Micromodule |
| US3705258A (en) * | 1971-12-23 | 1972-12-05 | Floyd M Minks | Electrical terminal structure |
| US3877064A (en) * | 1974-02-22 | 1975-04-08 | Amp Inc | Device for connecting leadless integrated circuit packages to a printed-circuit board |
| US4038678A (en) * | 1976-10-04 | 1977-07-26 | Texas Instruments Incorporated | Power transistor and thyristor adapter |
| US4181384A (en) * | 1978-02-06 | 1980-01-01 | Amp Incorporated | Flat cable connector having wire deployment means |
| FR2503526A1 (fr) * | 1981-04-03 | 1982-10-08 | Silicium Semiconducteur Ssc | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
| FR2503932A1 (fr) * | 1981-04-08 | 1982-10-15 | Thomson Csf | Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication |
| US4516148A (en) * | 1982-08-30 | 1985-05-07 | The Board Of Trustees Of The Leland Stanford, Jr. University | Semiconductor device having improved lead attachment |
| JPS59200452A (ja) * | 1983-04-27 | 1984-11-13 | Mitsubishi Electric Corp | 半導体装置 |
| DE3332293A1 (de) * | 1983-09-07 | 1985-03-21 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Elektronisches oder elektrisches bauelement |
| US4591950A (en) * | 1983-09-09 | 1986-05-27 | American Manufacturing Company, Inc. | Circuit board-terminal-housing assembly |
| US4630174A (en) * | 1983-10-31 | 1986-12-16 | Kaufman Lance R | Circuit package with external circuit board and connection |
| DE3345285A1 (de) * | 1983-12-14 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | Leistungs-halbleiteranordnung |
| US4547755A (en) * | 1984-03-27 | 1985-10-15 | Watkins Johnson Company | Microwave circuit structure and method of mounting |
| US4657325A (en) * | 1986-02-27 | 1987-04-14 | Amp Incorporated | Electrical connector |
-
1986
- 1986-02-28 JP JP1986029312U patent/JPS62142856U/ja active Pending
-
1987
- 1987-02-27 US US07/019,561 patent/US4796076A/en not_active Expired - Fee Related
- 1987-02-27 DE DE19873706480 patent/DE3706480A1/de not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016195216A (ja) * | 2015-04-01 | 2016-11-17 | 富士電機株式会社 | 半導体モジュール及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4796076A (en) | 1989-01-03 |
| DE3706480A1 (de) | 1987-09-03 |