JPS62142845U - - Google Patents

Info

Publication number
JPS62142845U
JPS62142845U JP1986029400U JP2940086U JPS62142845U JP S62142845 U JPS62142845 U JP S62142845U JP 1986029400 U JP1986029400 U JP 1986029400U JP 2940086 U JP2940086 U JP 2940086U JP S62142845 U JPS62142845 U JP S62142845U
Authority
JP
Japan
Prior art keywords
chip
fingers
suction cup
movable
gripping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986029400U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986029400U priority Critical patent/JPS62142845U/ja
Priority to US07/019,027 priority patent/US4753004A/en
Priority to DE8787400440T priority patent/DE3786273D1/en
Priority to CA000530781A priority patent/CA1298694C/en
Priority to EP87400440A priority patent/EP0235047B1/en
Publication of JPS62142845U publication Critical patent/JPS62142845U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案を具体化した一実施例を示す
斜視図、第２図はその縦断面図、第３図は他の一
対のフインガの取着状態を示す縦断面図、第４図
は作用を説明するための縦断面図、第５，６図は
フインガ、プツシユレバー、イコライザー、ばね
の取着状態を示す要部平面図、第７，８図はポジ
シヨナーの取着状態を示す斜視図である。 スリーブ…３、スプラインリーアベアリング…
４、吸気孔…５、スピンドル…６、上下連接板…
１０、エアシリンダ…１１、ローラ挾持部…１７
、ローラ…１８，１９、支柱…２０、摺動溝…２
１，２２、円板…２３，２４、ばね…２５、フイ
ンガ…２６，２７、ローラ…２８、ばね…２９、
プツシユレバー…３０，３１、イコライザー…３
２、ポジシヨナー…３４，３５、サツカーチユー
ブ…３６。 Fig. 1 is a perspective view showing an embodiment embodying this invention, Fig. 2 is a longitudinal sectional view thereof, Fig. 3 is a longitudinal sectional view showing the attached state of the other pair of fingers, and Fig. 4 is a longitudinal sectional view of the embodiment. 5 and 6 are plan views of essential parts showing how the finger, push lever, equalizer, and spring are attached, and FIGS. 7 and 8 are perspective views showing how the positioner is attached. be. Sleeve...3, Spline rear bearing...
4, Intake hole...5, Spindle...6, Upper and lower connecting plate...
10, Air cylinder...11, Roller clamping part...17
, rollers...18, 19, pillars...20, sliding grooves...2
1, 22, disc...23, 24, spring...25, finger...26, 27, roller...28, spring...29,
Push lever…30,31, Equalizer…3
2. Positioner...34, 35, Satsuka tube...36.

Claims (1)

【実用新案登録請求の範囲】 １ 半導体チツプ等のチツプを吸着可能にしたサ
ツカーを上下動可能に設けるとともに、そのサツ
カーの近傍において前記チツプを挾持する位置と
開放する位置とに往復移動可能でかつ上下動可能
な少なくとも一対のフインガ２６，２７を設け、
同フインガ２６，２７の往復移動が直線移動とな
るように案内する案内手段を設けたことを特徴と
するチツプマウンター。 ２ 前記フインガ２６，２７はサツカーチユーブ
３６の軸心を中心とする十字上に設けられている
ことを特徴とする実用新案登録請求の範囲第１項
に記載のチツプマウンター。 ３ 前記フインガ２６，２７はその先端にチツプ
を把持するためのポジシヨナー３４，３５が把持
方向への位置調節可能に取着していることを特徴
とする実用新案登録請求の範囲第１項または第２
項に記載のチツプマウンター。[Claims for Utility Model Registration] 1. A suction cup capable of adsorbing a chip such as a semiconductor chip is provided so as to be movable up and down, and the suction cup is capable of reciprocating between a position where the chip is clamped and a position where the chip is released in the vicinity of the suction cup. Provided with at least a pair of fingers 26 and 27 that are movable up and down,
A chip mounter characterized in that a guide means is provided for guiding the fingers 26 and 27 so that the reciprocating movement is a straight line movement. 2. The chip mounter according to claim 1, wherein the fingers 26 and 27 are arranged in the shape of a cross centered on the axis of the suction tube 36. 3. The fingers 26, 27 have positioners 34, 35 attached to their tips for gripping the chip so that their positions in the gripping direction can be adjusted. 2
Chip mounter as described in section.
JP1986029400U 1986-02-28 1986-02-28 Pending JPS62142845U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1986029400U JPS62142845U (en) 1986-02-28 1986-02-28
US07/019,027 US4753004A (en) 1986-02-28 1987-02-26 Chip mounter
DE8787400440T DE3786273D1 (en) 1986-02-28 1987-02-27 DEVICE FOR EQUIPMENT WITH CHIPS.
CA000530781A CA1298694C (en) 1986-02-28 1987-02-27 Chip mounter
EP87400440A EP0235047B1 (en) 1986-02-28 1987-02-27 Chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986029400U JPS62142845U (en) 1986-02-28 1986-02-28

Publications (1)

Publication Number Publication Date
JPS62142845U true JPS62142845U (en) 1987-09-09

Family

ID=12275089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986029400U Pending JPS62142845U (en) 1986-02-28 1986-02-28

Country Status (5)

Country Link
US (1) US4753004A (en)
EP (1) EP0235047B1 (en)
JP (1) JPS62142845U (en)
CA (1) CA1298694C (en)
DE (1) DE3786273D1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844324A (en) * 1987-09-29 1989-07-04 Todd Thomas W Solder system and method of using same
US5497983A (en) * 1987-10-16 1996-03-12 Tenryu Technics Co., Ltd. Work positioner of chip mounter for monitoring a chip-shaped electronic part onto a substrate
US4883300A (en) * 1988-10-13 1989-11-28 Intelmatec Corporation End effector for IC chip handling
US4950011A (en) * 1988-10-24 1990-08-21 Nicky Borcea Tool for precisely positioning a workpiece
DE3904587A1 (en) * 1989-02-16 1990-08-23 Arnold & Richter Kg MOUNTING HEAD FOR HANDLING EQUIPMENT
DE8904031U1 (en) * 1989-04-01 1989-05-18 Ses Electronics Gmbh, 8860 Noerdlingen, De
US5106138A (en) * 1989-06-05 1992-04-21 Hewlett-Packard Company Linear tweezers
US4987676A (en) * 1989-08-23 1991-01-29 Quad Systems Corporation End effector for a robotic system
EP0500246B1 (en) * 1991-02-20 1996-05-08 Matsumoto Giken Co., Ltd. Chuck for positioning chip electronic elements
US5160181A (en) * 1991-09-09 1992-11-03 Intelmatec Corporation Pick-up head assembly
US5315189A (en) * 1991-09-25 1994-05-24 Systems, Machines, Automation Corporation Actuator with translational and rotational control
US5284413A (en) * 1992-08-05 1994-02-08 Intelmatec Corporation Apparatus for loading and unloading thin integrated circuits into and from carriers
JPH06224595A (en) * 1993-01-19 1994-08-12 Juki Corp Head device for sucking and loading component
DE4430381C2 (en) * 1993-08-31 1997-02-27 Smc Kk Suction pipette
DE19500416A1 (en) * 1995-01-10 1996-07-11 Atg Test Systems Gmbh Holding device for flat test specimens
US5697658A (en) * 1995-05-05 1997-12-16 Samsung Electronics Co., Ltd. Centering apparatus for component mounting device
US6139078A (en) * 1998-11-13 2000-10-31 International Business Machines Corporation Self-aligning end effector for small components
FR2859197B1 (en) * 2003-09-02 2006-10-13 Commissariat Energie Atomique DEVICE FOR HANDLING FUT
US9258936B2 (en) * 2011-12-27 2016-02-09 Hanwha Techwin Co., Ltd. Adsorption head for surface mounting device
CN102632638A (en) * 2012-03-16 2012-08-15 安徽德力日用玻璃股份有限公司 Automatic suction cup mechanism of pressing machine
ITFI20120233A1 (en) * 2012-10-29 2014-04-30 Esanastri S R L MICRO-EXPLORATION DEVICE OF PLASTIC OR PAPER FILMS WITH ONE OR MORE LAYERS OF SELF-ADHESIVE, BIADESIVIZED OR ELECTROSTATIC MATCHED WITH AN NON-STICK SUPPORT LINER
CN108275466A (en) * 2018-03-30 2018-07-13 青岛元启智能机器人科技有限公司 A kind of liquid crystal display grabbing device
CN108674968B (en) * 2018-05-29 2020-05-12 江西绣丽织带有限公司 Automatic bobbin feeding and discharging equipment for weaving machine
CN110729217A (en) * 2019-10-22 2020-01-24 江苏佳晟精密设备科技有限公司 Device for mounting semiconductor chip
CN113644019B (en) * 2021-08-09 2024-03-19 恩纳基智能科技无锡有限公司 Composite feeding device of semiconductor chip mounter
CN115092683A (en) * 2021-10-22 2022-09-23 苏州联讯仪器有限公司 Automatic material conveying module for chip testing
CN115372243B (en) * 2022-10-21 2023-02-03 东营华亚国联航空燃料有限公司 Copper sheet corrosion test equipment for aviation fuel test

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438559A (en) * 1980-06-27 1984-03-27 Fuji Machine Mfg. Co. Ltd. Apparatus for automatically mounting non-lead electronic components on printed-circuit
JPS59224279A (en) * 1983-06-01 1984-12-17 富士機械製造株式会社 Method and device for positioning and holding electronic part
WO1985003404A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Head for handling electrical components
DE3411125A1 (en) * 1984-03-26 1985-10-03 Alfred 8000 München Lemmer DEVICE FOR GRAPPING ELECTRONIC COMPONENTS, IN PARTICULAR IC'S

Also Published As

Publication number Publication date
EP0235047B1 (en) 1993-06-23
EP0235047A2 (en) 1987-09-02
CA1298694C (en) 1992-04-14
EP0235047A3 (en) 1989-09-06
DE3786273D1 (en) 1993-07-29
US4753004A (en) 1988-06-28

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