JPS62140729U - - Google Patents
Info
- Publication number
- JPS62140729U JPS62140729U JP1986028402U JP2840286U JPS62140729U JP S62140729 U JPS62140729 U JP S62140729U JP 1986028402 U JP1986028402 U JP 1986028402U JP 2840286 U JP2840286 U JP 2840286U JP S62140729 U JPS62140729 U JP S62140729U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- hanging pin
- semiconductor
- semiconductor pellet
- metal wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028402U JPS62140729U (enrdf_load_stackoverflow) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986028402U JPS62140729U (enrdf_load_stackoverflow) | 1986-02-27 | 1986-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140729U true JPS62140729U (enrdf_load_stackoverflow) | 1987-09-05 |
Family
ID=30831327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986028402U Pending JPS62140729U (enrdf_load_stackoverflow) | 1986-02-27 | 1986-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140729U (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498571A (en) * | 1978-01-20 | 1979-08-03 | Kyushu Nippon Electric | Lead frame for semiconductor device |
| JPS55113357A (en) * | 1979-02-23 | 1980-09-01 | Hitachi Ltd | Lead frame |
| JPS5648163A (en) * | 1979-09-28 | 1981-05-01 | Hitachi Ltd | Lead frame |
-
1986
- 1986-02-27 JP JP1986028402U patent/JPS62140729U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5498571A (en) * | 1978-01-20 | 1979-08-03 | Kyushu Nippon Electric | Lead frame for semiconductor device |
| JPS55113357A (en) * | 1979-02-23 | 1980-09-01 | Hitachi Ltd | Lead frame |
| JPS5648163A (en) * | 1979-09-28 | 1981-05-01 | Hitachi Ltd | Lead frame |