JPS62139867A - Formation of thin film onto long-sized body - Google Patents

Abstract

PURPOSE:To surely form a thin film having a uniform thickness on the surface of a long-sized body by disposing a cylindrical body for heating in a traveling route of the long-sized body and passing a gas for forming the thin film into such cylindrical body. CONSTITUTION:The formation of the thin film is executed in the cylindrical body 15 disposed to enclose the long-sized body 11 in part of the traveling route of the long-sized body 11. The gas for vapor deposition is first supplied from an aperture 15a at the bottom end of the cylindrical body 15 in a direction Z and a blast fan 16 is run by the gaseous flow thereof to maintain the uniform concn. of the gas for vapor deposition in the cylindrical body 15. The gas for vapor deposition is discharged from a discharge port 15c. The cylindrical body 15 is preliminarily heated by a heater 18. The thin film having the uniform thickness is formed on the outside peripheral face of the long-sized body 11 when the long-sized body 11 is progressed in this state. The gaseous flow is passed in the progressing direction or backward direction of the long-sized body 11 at this time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to improvements in methods for forming thin films in a gas phase, such as vacuum evaporation or ion blating. This invention relates to improvements in methods for forming thin films in the gas phase.

[Prior art] Conventionally, as a method for forming a thin film on the surface of a long body, the third
The method shown in the figure is adopted.

Here, a thin film is formed in the gas phase while the wire rod 1 as a long body is run from the supply reel 2 to the take-up reel 3. The thin film is formed by adhering the evaporation gas supplied from the evaporation source 4 disposed on a part of the traveling route of the wire 1 to the outer surface of the wire 1.

In Fig. 3, numeral 5 indicates a boat that supports the evaporation source, and 6 indicates a heater for heating the evaporation source. The entire Mffi is typically housed in a vacuum chamber to remove impurities.

By the way, in the vapor deposition method shown in FIG.
A thin film is formed on the outer circumferential surface of the wire rod 1 before it is wound up by the take-up reel 3, and the vapor deposition gas supplied from the vapor deposition source 4 is placed on one side of the wire rod 1.

Therefore, it is difficult to form a uniform thin film. Therefore,
Conventionally, when it is necessary to form a uniform thin film on the outer peripheral surface of the wire 1, the supply reel 2 and the take-up reel 3 are rotated in the six directions shown by the arrows in FIG. (rotated as an axis).

[Problems to be Solved by the Invention] However, as described above, if the supply reel 2 and the take-up reel 3 are to be rotated around the direction of movement of the wire 1 as the central axis, the apparatus will become extremely large. I end up. Further, since the supply reel 2 and the take-up reel 3 must be enclosed within a vacuum chamber, the vacuum chamber itself must be extremely large. Therefore, the entire thin film forming apparatus becomes large and extremely expensive.

In addition, the wire rod 1 is transferred to the supply reel 2 and the take-up reel 3.
Even if the evaporation source 4 is rotated including the evaporation source 4, the contact time with the evaporation gas cannot be sufficiently removed because the evaporation source 4 is disposed only in a part of the traveling path of the wire 1. Therefore, it was not possible to reliably form a uniform thin film on the surface of the wire 1.

Therefore, an object of the present invention is to provide a method that can reliably form a thin film of uniform thickness on the surface of a long body.

Means for Solving Problem E] The method of forming a lit film on a long body according to the present invention is carried out in a gas phase, and includes the following steps.

That is, the elongated body is moved along its longitudinal direction, a heating cylindrical body is placed in a part of the traveling path of the elongated body so as to surround a part of the elongated body, and the heated cylindrical body is placed inside the cylindrical body. The method includes steps of supplying a thin film forming gas to the cylindrical body, and causing the thin film forming gas to flow in the direction of movement of the elongated body or in the direction opposite to the direction of movement of the elongated body.

[Function] In the thin film forming method of the present invention, a gas serving as a WI film forming source is caused to flow through a heating cylindrical body disposed in a part of the travel path of the elongated body. Therefore, the thin film forming gas is uniformly adhered to the surface of the elongated body within the cylindrical body. Furthermore, since the thin film forming gas is flowed in the cylindrical body in the direction of movement of the elongate body or in the direction opposite to the direction of movement of the elongate body, it is brought into contact with the surface of the elongate body for a sufficient period of time. Therefore, a thin film can be reliably formed on the surface of the elongated body.

[Description of Examples] FIG. 1 is a schematic diagram showing an example of an apparatus for carrying out the thin film forming method of the present invention. A supply reel 12 for supplying the elongated body 11 and a take-up reel 13 for winding up the elongated body 11 on which a thin film is formed are arranged in a vacuum chamber indicated by a dashed line B. In this device, a supply reel 12 and a take-up reel 13 feed out the elongated body 11,
Moreover, it is simply configured so that it can be rotated in the directions of arrows X and Y in order to wind it up. That is, since it is not configured to be rotated about the direction in which the elongated body 11 travels, it is not provided with a rotation drive device of any size.

The elongated body 11 is unwound from a supply reel 12, passes through a guide roller 14, and is taken up by a take-up reel 13. A thin film is formed between the guide roller 14 and the supply reel 12.

Thin film formation is performed in a cylindrical body 15 arranged so as to surround the elongated body 11 in a part of the travel path of the elongated body 11 . That is, the opening 15a at the lower end of the cylindrical body 15
The thin film forming gas is supplied in the two directions indicated by the arrows. A blower fan 16 is provided in the lower part of the cylindrical body 15.

The feeding fan 16 is driven and rotated by the supplied thin film forming gas, thereby causing the thin film forming gas to flow within the cylindrical body 15 in a direction opposite to the traveling direction of the elongated body 11. The thin film forming gas flowing inside the cylindrical body 15 is
It is discharged from an exhaust port 15b formed at the upper end of the .

Note that a heater 18 is arranged around the outer periphery of the cylindrical body 15, and the cylindrical body 15 is heated by the heater 18 to a temperature at which the thin film forming gas does not condense on the circumferential surface of the cylindrical body 15.

An example of a process for forming a thin film using the apparatus shown in FIG. 1 will be described using vapor deposition as a representative example.

First, a vapor deposition source (not shown) is heated in a vacuum chamber to obtain a vapor deposition gas, and the vapor deposition gas is supplied from the opening 15a at the lower end of the cylindrical body 15 in the direction of arrow Z, and is blown by the vapor deposition gas flow. Rotate the fan 16.

This keeps the deposition gas concentration within the cylindrical body 15 uniform. The deposition gas is exhausted to the outside of the cylindrical body 15 (into the vacuum chamber) through the exhaust port 15c. At this time, the cylindrical body 15 needs to be heated in advance by the heater 18. The reason for this is to prevent the deposition gas from condensing on the cylindrical body 15, as described above.

Next, the supply reel 12 and the take-up reel 13 are driven to advance the elongated body 11 while maintaining the state in which the vapor deposition gas is circulated within the cylindrical body 15 . In this case, since the deposition gas concentration within the cylindrical body 15 is kept uniform, the elongated body 11 is
The entire area passing through the cylindrical body 15 is contacted with a deposition gas having a uniform concentration for a sufficient period of time. Therefore, a thin film of uniform thickness is reliably formed on the outer peripheral surface of the elongated body 11.

FIG. 2 is a schematic configuration diagram showing an example of an apparatus for carrying out the thin film forming method of the present invention. Also in this device, in order to run the elongated body 21, the supply reel 22,
A take-up reel 23 and guide rollers 24 are provided. However, here, a boat 27b supporting a vapor deposition source 27a is arranged at the lower end of the cylindrical body 25. A heater 28 for heating the vapor deposition source 27a is arranged below the boat 27b. Then, the vapor deposition gas heated by the heater 28 and given from the vapor source 27a is applied to the cylindrical body 25.
The cylindrical body 25 is
be distributed internally. The other configurations are not particularly different from the device d shown in FIG. 1, so their explanation will be omitted.

Next, specific experimental results conducted using the apparatus shown in FIG. 2 will be explained.

All was vacuum-deposited on the surface of a Cu wire with a diameter of 5IllIl to form an Au thin film with a thickness of 10 μm. Thin film formation is
The test was carried out under five conditions shown in Table 1 below.

That is, in Nos. 16 and 3, the cylindrical body 25 is heated, and in Nos. 001 and 2, the fans 26a, 26b are heated.
did not rotate. In N084, the cylindrical body 25 was heated and the fans 26a and 26b were rotated. Table 1 also shows the variation in film thickness, growth rate, and yield of the ΔuWJ film formed by such a method.

Further, as a comparative example, an Au thin film was formed using the conventional method described with reference to FIG. Regarding this result,
It is also shown in Table 1 as N015.

From the results in Table 1, it can be seen that in Nos. 2 to 4, the variation in fil thickness is extremely small at ±0.4 μ-.

It can also be seen that the growth rate and yield of the thin film are much faster and higher than in the conventional method.

Although the above description has been made using vapor deposition as a representative example, the thin film forming method of the present invention is generally applicable to methods for forming thin films in a vapor phase. Moreover, it can be used not only for various vapor deposition methods such as CVD and PVD, but also for ion blating.

Further, the elongated body is not limited to a wire rod, and various shapes such as an elongated tube or strip can be used.

[Effects of the Invention] In the present invention, a heating cylindrical body surrounding a part of the elongated body is disposed in a part of the travel path of the elongated body, and a thin film forming gas is heated in the elongated body in the cylindrical body. Since the gas for forming a thin film is uniformly dispersed within the cylindrical body because it is flowed in the advancing direction or the opposite direction of the body, and when the elongated body is sufficiently IXl1wI within the cylindrical body,
It will come into contact with the film-forming gas. Therefore, it is possible to reliably form [lI] with a uniform thickness on the surface of the elongated body.

It should be pointed out that the present invention can be used in various technical fields such as forming a thin film on the surface of a metal wire and forming a cladding layer of an optical fiber.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram for explaining an example of an apparatus for carrying out the present invention. FIG. 2 is a schematic configuration diagram for explaining another example of an apparatus for carrying out the present invention. FIG. 3 is a schematic configuration diagram for explaining a conventional thin film forming method. In the figure, 11 is a long body, 15 is a cylindrical body, and 16 is a blower fan.

Claims (3)

[Claims] (1) A method of forming a thin film on the surface of an elongated body in a gas phase, in which the elongated body is moved along its longitudinal direction, and a part of the elongated body is placed in a part of the traveling path of the elongated body. A heating cylindrical body is arranged so as to surround the elongated body, a thin film forming gas is supplied into the cylindrical body, and the thin film forming gas is supplied in the cylindrical body in the traveling direction or the traveling direction of the elongated body. A method for forming a thin film on a long body, comprising steps of flowing in opposite directions. (2) In order to flow the thin film forming gas inside the cylindrical body in the traveling direction of the elongated body or in the opposite direction to the traveling direction, a blower fan provided inside the cylindrical body is used, according to claim 1. A method for forming a thin film on a long body. (3) A method for forming a thin film on an elongated body according to claim 2, wherein the blower fan is driven by a gas flow for forming a thin film.