JPS62138461U - - Google Patents
Info
- Publication number
- JPS62138461U JPS62138461U JP2526586U JP2526586U JPS62138461U JP S62138461 U JPS62138461 U JP S62138461U JP 2526586 U JP2526586 U JP 2526586U JP 2526586 U JP2526586 U JP 2526586U JP S62138461 U JPS62138461 U JP S62138461U
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric device
- package structure
- light shielding
- utility
- photoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図はこの考案に係るパツケージ構造の一実
施例を示す断面図、第２図はアレー状のパツケー
ジ構造の断面図、第３図はアレー状のパツケージ
構造の端子接続列を示す断面図、第４図は従来例
を示す斜視図である。 図中、１…光電素子チツプ、３…レンズ面、４
…透光体、５…遮光体、６ａ，６ｂ…端子、７…
境界面。
施例を示す断面図、第２図はアレー状のパツケー
ジ構造の断面図、第３図はアレー状のパツケージ
構造の端子接続列を示す断面図、第４図は従来例
を示す斜視図である。 図中、１…光電素子チツプ、３…レンズ面、４
…透光体、５…遮光体、６ａ，６ｂ…端子、７…
境界面。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 光電素子チツプの発受光面の前面のレンズ
機能を有する透明体と、該光電素子チツプの発受
光を防げない上記透明体の周面の遮光体と、該遮
光体に埋設された光電素子の端子とよりなる光電
素子のパツケージ構造。 (2) 上記遮光体の透明体との境界線が反対面と
なつている実用新案登録請求の範囲第(1)項に記
載の光電素子のパツケージ構造。 (3) 上記遮光体部分を複数一体に成形して、線
状あるいは平面状のフレーム上に光電素子チツプ
を配列させた実用新案登録請求の範囲第(2)項に
記載の光電素子のパツケージ構造。 (4) 上記端子が目的に応じてフレーム内で接続
されている実用新案登録請求の範囲第３項に記載
の光電素子のパツケージ構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2526586U JPS62138461U (ja) | 1986-02-24 | 1986-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2526586U JPS62138461U (ja) | 1986-02-24 | 1986-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62138461U true JPS62138461U (ja) | 1987-09-01 |
Family
ID=30825254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2526586U Pending JPS62138461U (ja) | 1986-02-24 | 1986-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62138461U (ja) |
-
1986
- 1986-02-24 JP JP2526586U patent/JPS62138461U/ja active Pending