JPS62135432U - - Google Patents

Info

Publication number
JPS62135432U
JPS62135432U JP2358586U JP2358586U JPS62135432U JP S62135432 U JPS62135432 U JP S62135432U JP 2358586 U JP2358586 U JP 2358586U JP 2358586 U JP2358586 U JP 2358586U JP S62135432 U JPS62135432 U JP S62135432U
Authority
JP
Japan
Prior art keywords
die
plunge
head
wafer
push
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2358586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2358586U priority Critical patent/JPS62135432U/ja
Publication of JPS62135432U publication Critical patent/JPS62135432U/ja
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の第1の実施例を示す断面図、
第2図はダイ突き上げ時の状態を示す拡大説明図
、第3図は第1,2図におけるプランジアツプヘ
ツドの斜視図、第4図及び第5図は本考案の第2
の実施例及び第3の実施例におけるプランジアツ
プヘツドの斜視図、第6図はプランジアツプヘツ
ド上に横たわるノンエキスパンドウエハの平面図
、第7図は従来のプランジアツプヘツド等を示す
第6図におけるA―A断面図、第8図はダイ突き
上げ時の状態を示す拡大説明図である。 1……ノンエキスパンドウエハ、2……シート
、3……ウエハ、4……ダイ、4a……ダイ、5
……プランジアツプヘツド、5a……上面、6…
…ツール、7……突き上げピン、8……空間、9
……真空吸引用穴、10……環状フレーム、11
……環状部材、12……穴、13……ダイの側端
面、14……ダイの側端面、15……エツジ部、
16……エツジ部、20,20′,20″……平
面、21……円錐面(テーパ面)、22,22′
……角錐面(テーパ面)、23……稜線、24…
…環状溝。
FIG. 1 is a sectional view showing a first embodiment of the present invention;
Figure 2 is an enlarged explanatory view showing the state when the die is pushed up, Figure 3 is a perspective view of the plunge head in Figures 1 and 2, and Figures 4 and 5 are the second part of the present invention.
FIG. 6 is a plan view of a non-expandable wafer lying on the plunge top, and FIG. 7 is a perspective view of the plunge top in the third embodiment and FIG. The AA sectional view and FIG. 8 are enlarged explanatory views showing the state when the die is pushed up. 1...Non-expanded wafer, 2...Sheet, 3...Wafer, 4...Die, 4a...Die, 5
...Plunge top head, 5a...Top surface, 6...
...Tool, 7...Push-up pin, 8...Space, 9
...Vacuum suction hole, 10...Annular frame, 11
... Annular member, 12 ... Hole, 13 ... Side end surface of die, 14 ... Side end surface of die, 15 ... Edge portion,
16... Edge portion, 20, 20', 20''... Plane, 21... Conical surface (tapered surface), 22, 22'
...Pyramidal surface (tapered surface), 23...Ridge line, 24...
...Annular groove.

Claims (1)

【実用新案登録請求の範囲】 シート2上に貼着したウエハ3を極めて僅かな
隙間△をもつて複数個のダイ4に切断、分割して
なるノンエキスパンドウエハ1を、プランジアツ
プヘツド5の上面にて支持し、各分割された1個
のダイ4を順次、プランジアツプヘツドの内部に
設けられた突き上げピン7で突き上げるとともに
、該突き上げピンの真上にあるツール6で吸着し
てシート2から剥離するようにしたダイボンダに
おいて、 前記プランジアツプヘツドの上端部の形状を、
1個のダイ4とほぼ等しい辺もしくは直径をもつ
平面20と、その平面20の周辺に続くテーパ面
21とを有する形状とし、さらにテーパ面21に
は、前記吸着すべきダイ4に隣設されているダイ
の吸着用の環状溝24を設けたことを特徴とする
ダイボンダのプランジアツプヘツド。
[Claims for Utility Model Registration] A non-expandable wafer 1 obtained by cutting and dividing a wafer 3 stuck onto a sheet 2 into a plurality of dies 4 with an extremely small gap △ is placed on the top surface of a plunge head 5. Each divided die 4 is successively pushed up with a push-up pin 7 provided inside the plunge up head, and is sucked with a tool 6 located directly above the push-up pin and removed from the sheet 2. In a die bonder designed to peel off, the shape of the upper end of the plunge up head is as follows:
It has a shape having a flat surface 20 having approximately the same side or diameter as one die 4, and a tapered surface 21 that continues around the periphery of the flat surface 20. A plunge head for a die bonder, characterized in that it is provided with an annular groove 24 for suctioning a die.
JP2358586U 1986-02-20 1986-02-20 Pending JPS62135432U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2358586U JPS62135432U (en) 1986-02-20 1986-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2358586U JPS62135432U (en) 1986-02-20 1986-02-20

Publications (1)

Publication Number Publication Date
JPS62135432U true JPS62135432U (en) 1987-08-26

Family

ID=33446616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2358586U Pending JPS62135432U (en) 1986-02-20 1986-02-20

Country Status (1)

Country Link
JP (1) JPS62135432U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109729A (en) * 1987-10-22 1989-04-26 Fujitsu Ltd Whole-surface cut chip release device
JPH01158746A (en) * 1987-12-15 1989-06-21 Matsushita Electron Corp Semiconductor chip pickup device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611842B2 (en) * 1980-05-26 1986-01-21 Hitachi Cable

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611842B2 (en) * 1980-05-26 1986-01-21 Hitachi Cable

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109729A (en) * 1987-10-22 1989-04-26 Fujitsu Ltd Whole-surface cut chip release device
JPH01158746A (en) * 1987-12-15 1989-06-21 Matsushita Electron Corp Semiconductor chip pickup device

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