JPS6390839U - - Google Patents

Info

Publication number
JPS6390839U
JPS6390839U JP18746386U JP18746386U JPS6390839U JP S6390839 U JPS6390839 U JP S6390839U JP 18746386 U JP18746386 U JP 18746386U JP 18746386 U JP18746386 U JP 18746386U JP S6390839 U JPS6390839 U JP S6390839U
Authority
JP
Japan
Prior art keywords
pellet
stage
tape
semiconductor
thrusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18746386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18746386U priority Critical patent/JPS6390839U/ja
Publication of JPS6390839U publication Critical patent/JPS6390839U/ja
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案の第１の実施例の平面図
及びＡ―Ａ′線断面図、第２図ａ，ｂは第２の実
施例の平面図及びＢ―Ｂ′線断面図、第３図ａ，
ｂは従来の半導体ペレツト突上げ機構を説明する
ための平面図及びＣ―Ｃ′線断面図である。 １…ペレツト、２…テープ、３…突上げ針、４
，４Ａ…ペレツトステージ、５…ペレツト吸着孔
、１０…円筒形ガイド。 Figures 1a and b are a plan view and a cross-sectional view taken along the line A-A' of the first embodiment of the present invention, and Figures 2 a and b are a plan view and a cross-sectional view taken along the line B-B' of the second embodiment. , Figure 3a,
b is a plan view and a sectional view taken along the line CC' for explaining a conventional semiconductor pellet thrusting mechanism. 1... Pellet, 2... Tape, 3... Push-up needle, 4
, 4A... Pellet stage, 5... Pellet suction hole, 10... Cylindrical guide.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上面に複数個の半導体ペレツトが張付けられた
テープを下面から保持するペレツトステージと、
該ペレツトステージに設けられた複数個のペレツ
ト吸着孔より前記テープをペレツトステージ表面
に吸引保持する吸引手段と、前記ペレツトステー
ジの中央部のペレツト吸着孔より前記半導体ペレ
ツトを突き上げ前記テープより半導体ペレツトを
離脱させるペレツト突上げ手段とを含むことを特
徴とする半導体ペレツト突上げ機構。 a pellet stage that holds a tape on which a plurality of semiconductor pellets are attached from the bottom surface;
suction means for suctioning and holding the tape on the pellet stage surface through a plurality of pellet suction holes provided in the pellet stage; 1. A semiconductor pellet thrusting mechanism comprising pellet thrusting means for releasing semiconductor pellets.
JP18746386U 1986-12-04 1986-12-04 Pending JPS6390839U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18746386U JPS6390839U (en) 1986-12-04 1986-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18746386U JPS6390839U (en) 1986-12-04 1986-12-04

Publications (1)

Publication Number Publication Date
JPS6390839U true JPS6390839U (en) 1988-06-13

Family

ID=31137966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18746386U Pending JPS6390839U (en) 1986-12-04 1986-12-04

Country Status (1)

Country Link
JP (1) JPS6390839U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171201A (en) * 2009-01-22 2010-08-05 Mitsubishi Electric Corp Pickup apparatus, and method for manufacturing semiconductor chip
JP4649066B2 (en) * 2001-06-14 2011-03-09 太平洋セメント株式会社 Vacuum chuck

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4649066B2 (en) * 2001-06-14 2011-03-09 太平洋セメント株式会社 Vacuum chuck
JP2010171201A (en) * 2009-01-22 2010-08-05 Mitsubishi Electric Corp Pickup apparatus, and method for manufacturing semiconductor chip

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