JP2010171201A - Pickup apparatus, and method for manufacturing semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pickup apparatus for preventing the scatter and crack of a semiconductor chip, and to provide a manufacturing method for the pickup device. <P>SOLUTION: The pickup apparatus for picking up a desired semiconductor chip from among the plurality of semiconductor chips adhering to an adhesive sheet includes the apparatus body where a groove is formed on a contact surface in contact with the adhesive sheet, projections arranged inside the groove, a suction mechanism for vacuuming the inside of the groove and sucking the adhesive sheet, and a means for picking up the desired semiconductor chip. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a pickup device that picks up individual semiconductor chips attached to an adhesive sheet and a method for manufacturing the semiconductor chip, and more particularly to a pickup device that can prevent scattering and cracking of the semiconductor chip and a method for manufacturing the semiconductor chip. is there.

  Conventionally, a method of applying a semiconductor wafer to an adhesive sheet and then dividing the semiconductor wafer into a plurality of semiconductor chips and picking up the plurality of semiconductor chips from the adhesive sheet using a pickup device has been applied. In this method, an adhesive sheet is disposed on the groove provided on the contact surface of the pickup device, and the inside of the groove is evacuated and adhered while the semiconductor chip is supported by the protrusion in the groove via the adhesive sheet. The adhesive sheet is partially peeled from the semiconductor chip by sucking the adhesive sheet. This makes it easy to pick up the semiconductor chip from the adhesive sheet.

  As this method, a method of sucking the entire region of the adhesive sheet where a plurality of semiconductor chips are attached (see, for example, Patent Document 1), or a desired semiconductor chip in the plurality of semiconductor chips of the adhesive sheet is attached. A method of sucking only the attached region (for example, see Patent Document 2) is known.

JP 2000-299297 A JP 2001-196443 A

  In the method of sucking the entire area of the plurality of semiconductor chips described above, a groove having an opening as large as the entire area of the adhesive sheet on which the plurality of semiconductor chips are attached is used as the groove on the contact surface of the pickup device. Provide. The plurality of semiconductor chips are arranged on the groove portion via an adhesive sheet. And each semiconductor chip is picked up in order in the state which attracted | sucked the whole area | region where these semiconductor chips in the adhesive sheet were affixed. For this reason, all of the plurality of semiconductor chips are simultaneously peeled from the adhesive sheet. As a result, there has been a problem that semiconductor chips are scattered.

  On the other hand, in the method of sucking only a desired semiconductor chip region, a groove having an opening as large as the desired semiconductor chip is provided as a groove on the contact surface of the pickup device. Only a desired semiconductor chip is disposed on the groove portion via an adhesive sheet. At this time, a desired semiconductor chip is supported via an adhesive sheet by a planar portion outside the groove and a protrusion provided inside the groove. Then, while supporting the desired semiconductor chip in this way, only the desired semiconductor chip is picked up while sucking only the region of the adhesive sheet where the desired semiconductor chip is attached. For this reason, all of the plurality of semiconductor chips are not peeled from the adhesive sheet at the same time, and the above-described problem of scattering of the semiconductor chips does not occur. However, in this method, even in a state where the adhesive sheet is sucked, the adhesive sheet on the planar portion outside the groove remains adhered to the desired semiconductor chip. In general, an adhesive sheet adhered to a flat surface is difficult to peel off. For this reason, the adhesive sheet in the planar portion outside the groove may not be peeled from the desired semiconductor chip. As a result, there has been a problem that the semiconductor chip is broken.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a pickup device and a manufacturing method that can prevent scattering and cracking of a semiconductor chip.

  A pickup device according to a first invention is a pickup device that picks up a desired semiconductor chip from a plurality of semiconductor chips attached to an adhesive sheet, and a groove portion is formed on a contact surface in contact with the adhesive sheet. A main body part, a protrusion provided inside the groove part, a suction mechanism for evacuating the groove part to suck the adhesive sheet, and a means for picking up the desired semiconductor chip, The groove portion arranges a semiconductor chip selected from the plurality of semiconductor chips so as to include the desired semiconductor chip inside an outer periphery of an opening of the groove portion, and the semiconductor selected from the plurality of semiconductor chips. The remaining semiconductor chip excluding the chip is configured to be arranged outside the outer periphery, and the protrusion is the selected part. Was without the semiconductor chip is supported on the contact surface, it is characterized in that to support the selected semiconductor chip through the adhesive sheet.

  According to a second aspect of the present invention, there is provided a semiconductor chip manufacturing method that uses the pickup device according to the first aspect to pick up the desired semiconductor chip from the plurality of semiconductor chips attached to the adhesive sheet. A method for manufacturing a chip, wherein the selected semiconductor chip and the remaining semiconductor chips are arranged inside and outside the outer periphery of the opening of the groove, respectively, and after the arranging step, the selected semiconductor chip And picking up the desired semiconductor chip by the pickup means in a state where the adhesive sheet is sucked by the suction mechanism while the semiconductor chip is supported by the protrusion via the adhesive sheet. It is a feature.

  According to a third aspect of the present invention, there is provided a semiconductor chip manufacturing method that uses the pickup device according to the first aspect to pick up the desired semiconductor chip from the plurality of semiconductor chips attached to the adhesive sheet. A method of manufacturing a chip, comprising: a first placement step of placing the selected semiconductor chip and the remaining semiconductor chips inside and outside the outer periphery of the opening of the groove portion; and Thereafter, the adhesive sheet is sucked by the suction mechanism while the desired semiconductor chip and the adjacent semiconductor chip are supported by the first protrusion and the second protrusion through the adhesive sheet, respectively. In the state, a first pick-up step for picking up the desired semiconductor chip by the pick-up means, and the first pick-up step. A second placement step of placing the adjacent semiconductor chip inside the outer periphery of the opening of the groove portion after the up step; and, after the second placement step, placing the adjacent semiconductor chip into the first protrusion. A second pick-up step of picking up the adjacent semiconductor chip by the pick-up means in a state in which the pressure-sensitive adhesive sheet is sucked by the suction mechanism while being supported by the portion through the pressure-sensitive adhesive sheet. It is what.

  According to the present invention, scattering and cracking of a semiconductor chip can be prevented.

1 is a perspective view showing an entire pickup device according to Embodiment 1. FIG. It is the figure which looked at the stage for dicing frames shown in FIG. 1 from the lower side. It is a top view of a holder. It is sectional drawing in AA 'shown in FIG. It is sectional drawing in BB 'shown in FIG. FIG. 6 is a process diagram illustrating the method for manufacturing the semiconductor chip according to the first embodiment. FIG. 6 is a process diagram illustrating the method for manufacturing the semiconductor chip according to the first embodiment. FIG. 6 is a process diagram illustrating the method for manufacturing the semiconductor chip according to the first embodiment. 6 is a cross-sectional view of a holder according to Embodiment 2. FIG. 10 is a top view of a holder according to Embodiment 3. FIG. It is sectional drawing of the holder which concerns on Embodiment 4. FIG. It is sectional drawing of the holder which concerns on Embodiment 4. FIG. 10 is a top view of a holder according to Embodiment 5. FIG.

Embodiment 1 FIG.
The first embodiment relates to a pickup device that picks up individual semiconductor chips attached to an adhesive sheet and a method for manufacturing the semiconductor chip.

  The configuration of the pickup device will be described below. FIG. 1 is a perspective view showing the entire pickup apparatus according to the first embodiment. The pickup device includes a dicing frame stage 10, a tray stage 12, a collet 14, and a holder (not shown, described later). The dicing frame stage 10 includes a dicing frame 16. The dicing frame 16 includes an opening 18 in the center portion. The space from the opening 18 to the lower space of the dicing frame stage 10 is hollow. The dicing frame 16 includes an expanding protrusion 20 on the outer periphery of the opening 18. An adhesive sheet 24 having a plurality of semiconductor chips 22 attached thereto is attached to the dicing frame 16. The plurality of semiconductor chips 22 are disposed inside the opening 18. The dicing frame stage 10 is supported by a dicing frame stage X axis (not shown) and a dicing frame stage Y axis 26, and can move in the X direction and the Y direction shown in FIG.

  The collet 14 picks up the semiconductor chips 22 one by one from the adhesive sheet 24 affixed to the dicing frame 16. The collet 14 is supported by the collet X-axis 28 and the collet Z-axis 30 and can move in the X direction and the Z direction shown in FIG. The collet 14 cannot move in the Y direction shown in FIG. 1, and the position in the Y direction is fixed.

  The tray stage 12 includes a positioning pin 32, a tray press 34, and a tray 36. In the tray stage 12, the tray 36 is positioned by positioning pins 32 and fixed by a tray presser 34. The tray stage 12 is supported by a tray stage X axis (not shown) and a tray stage Y axis 38, and can move in the X direction and the Y direction shown in FIG. The pickup device also includes a pickup camera 40 provided above the dicing frame 16 and a place camera 42 provided above the tray stage 12.

  FIG. 2 is a perspective view of the dicing frame stage shown in FIG. 1 as viewed from below. The XYZ direction shown in FIG. 2 indicates the same direction as the XYZ direction shown in FIG. As shown in FIG. 2, the pickup device includes a holder 44 below the dicing frame stage 10. The holder 44 is supported by a holder Z axis (not shown) and can move in the Z direction shown in FIGS. 1 and 2. The holder 44 cannot move in the X direction and the Y direction shown in FIGS. 1 and 2, and is arranged so that the position in the Y direction is the same as that of the collet 14.

  FIG. 3 is a top view of the holder. The XY direction shown in FIG. 3 indicates the same direction as the XY direction shown in FIGS. 4 and 5 correspond to cross-sectional views taken along lines AA ′ and BB ′ shown in FIG. 3, respectively. The YZ direction shown in FIG. 4 indicates the same direction as the YZ direction shown in FIGS.

  The holder 44 includes a main body 46. A groove portion 50 is formed on the contact surface 48 that contacts the adhesive sheet 24 of the main body portion 46. The groove part 50 is a semiconductor chip 54 selected so as to include a semiconductor chip a (desired semiconductor chip) 52 from a plurality of semiconductor chips affixed to the adhesive sheet 24, inside the outer periphery of the opening part 56 of the groove part 50. And the remaining semiconductor chip 58 (not shown in FIGS. 4 and 5) excluding the selected semiconductor chip 54 can be arranged outside the outer periphery of the opening 56. Yes. A first protrusion 60 and a second protrusion 62 are provided inside the groove 50.

  The selected semiconductor chip 54 includes a semiconductor chip b (adjacent semiconductor chip) 64 adjacent to the semiconductor chip a52. The semiconductor chip a52 and the semiconductor chip b64 are supported by the first protrusion 60 and the second protrusion 62 via the adhesive sheet 24 without being supported by the outer contact surface 48 of the groove 50. The

  Further, the holder 44 has a suction hole 66 for vacuuming the inside of the groove portion 50 to suck the adhesive sheet 24 and a push-up needle 68 for pushing up the semiconductor chip a52 supported by the first projection portion 60 from the inside of the groove portion 50. Prepare. Further, the collet 14 picks up the semiconductor chip a52 supported by the first protrusion 60 via the adhesive sheet 24 as shown in FIG.

  Next, a method for manufacturing a semiconductor chip according to this embodiment will be described. 6 to 8 are process diagrams showing the method for manufacturing the semiconductor chip according to the first embodiment. The YZ direction shown in FIG. 8 indicates the same direction as the YZ direction shown in FIGS.

  First, as shown in FIG. 6, the semiconductor wafer 70 is attached to the adhesive sheet 24. Next, as shown in FIG. 7, the semiconductor wafer 70 is divided into individual semiconductor chips 22. In addition, as the adhesive sheet 24, it is preferable to use the sheet | seat which has the characteristic that adhesive force falls by an ultraviolet-ray.

  Next, as shown in FIG. 1, the adhesive sheet 24 is attached to the dicing frame 16. At this time, the semiconductor chip 22 attached to the adhesive sheet 24 is arranged inside the opening 18 of the dicing frame 16. Further, the adhesive sheet 24 is extended and expanded outward by the expanding projection 20. Thereby, the space | interval of each semiconductor chip 22 becomes wide, and it prevents that semiconductor chips 22 interfere with when picking up.

  Next, the holder 44 is arranged at the position of the semiconductor chip a52 by moving the dicing frame stage 10 in the X and Y directions and moving the holder 44 in the Z direction. Then, as shown in FIG. 3, the semiconductor chip 54 selected to include the semiconductor chip a (desired semiconductor chip) 52 and the semiconductor chip b (adjacent semiconductor chip) 64 is formed on the contact surface 48 of the holder 44. It arrange | positions inside the outer periphery of the opening part 56 of the groove part 50 made. Further, the remaining semiconductor chips 58 excluding the selected semiconductor chip 54 are arranged outside the outer periphery of the opening 56.

  Next, as shown in FIGS. 4 and 5, the semiconductor chip a <b> 52 and the semiconductor chip b <b> 64 are not supported by the contact surface 48 on the outer side of the groove part 50, but by the first protrusion part 60 and the second protrusion part 62, respectively. It supports through the adhesive sheet 24. In this way, while supporting the semiconductor chip a52 and the semiconductor chip b64, the inside of the groove 50 is evacuated by the suction hole 66 and the adhesive sheet 24 is sucked. Thereby, the adhesive sheet 24 other than the portions supported by the first protrusions 60 and the second protrusions 62 is peeled from both the semiconductor chip a52 and the semiconductor chip b64. At this time, the adhesive sheet 24 does not peel from the remaining semiconductor chips 58 arranged outside the groove 50.

  Next, as shown in FIG. 8, the semiconductor chip a <b> 52 is pushed up by the push-up needle 68 while the adhesive sheet 24 is sucked. Thereby, the adhesive sheet 24 is further peeled from the semiconductor chip a52.

  Next, the collet 14 is moved in the Z direction and lowered to a position where the semiconductor chip a52 can be sucked. Then, the semiconductor chip a52 is sucked by the collet 14 from the stage before the semiconductor chip a52 is pushed up by the push-up needle 68 and completely peeled off from the adhesive sheet 24. The semiconductor chip a52 is picked up by the collet 14 at the moment when the semiconductor chip a52 is completely peeled from the adhesive sheet 24.

  After picking up the semiconductor chip a52, the push-up needle 68 is returned to the original position, and the suction of the adhesive sheet 24 is stopped. Thereafter, a step of picking up the semiconductor chip b64 is executed.

  In the step of picking up the semiconductor chip b64, first, the dicing frame stage 10 is moved, and the semiconductor chip selected to include the semiconductor chip b64 is rearranged inside the outer periphery of the opening 56 of the groove 50. At this time, the semiconductor chip b <b> 64 is disposed at a place where the first protrusion 60 is provided, and is supported by the first protrusion 60 via the adhesive sheet 24.

  Next, as in FIG. 4, the semiconductor chip b <b> 64 is supported by the first protrusion 60 via the adhesive sheet 24 without being supported by the outer contact surface 48 of the groove 50. In this way, while the semiconductor chip b64 is supported, the inside of the groove 50 is evacuated by the suction hole 66 and the adhesive sheet 24 is sucked. Thereby, the adhesive sheet 24 other than the portion supported by the first protrusion 60 is peeled from the semiconductor chip b64. When the adhesive sheet 24 is sucked and peeled from the semiconductor chip a52 in the above-described process, the adhesive sheet 24 is also peeled from the semiconductor chip b64. Therefore, in this step, the adhesive sheet 24 peeled from the semiconductor chip b64 is peeled in a wider range.

  Next, as in FIG. 8, the semiconductor chip b <b> 64 is pushed up by the push-up needle 68 while the adhesive sheet 24 is sucked. Thereby, the adhesive sheet 24 is further peeled from the semiconductor chip b64.

  Next, the collet 14 is moved in the Z direction and lowered to a position where the semiconductor chip b64 can be sucked. Then, the semiconductor chip b64 is adsorbed by the collet 14 from the stage before the semiconductor chip b64 is completely peeled from the adhesive sheet 24 by being pushed up by the push-up needle 68. The semiconductor chip b64 is picked up by the collet 14 at the moment when the semiconductor chip b64 is completely peeled off from the adhesive sheet 24.

  As described above, in this embodiment, only the semiconductor chip 54 selected so as to include the semiconductor chip a52 and the semiconductor chip b64 from the semiconductor chips 22 attached to the adhesive sheet 24 is used as the opening of the groove 50. It arrange | positions inside 56 outer periphery. Then, the pressure-sensitive adhesive sheet 24 is sucked by evacuating the inside of the groove 50, and the pressure-sensitive adhesive sheet 24 is peeled off from the selected semiconductor chip 54. The adhesive sheet 24 does not peel off from the remaining semiconductor chips 58 arranged outside the groove 50. Therefore, scattering of the semiconductor chip can be prevented.

  In the present embodiment, the semiconductor chip a52 is not supported by the contact surface 48 outside the groove portion 50 via the adhesive sheet 24, and the adhesive sheet 24 is sucked while being supported only by the first protrusion 60. To do. Thus, the adhesive sheet 24 other than the portion supported by the first protrusion 60 is peeled from the semiconductor chip a52, and the semiconductor chip a52 is picked up by the collet 14. Therefore, when picking up, it is not necessary to peel off the adhesive sheet 24 in the planar portion outside the groove 50 from the semiconductor chip a52 as in the prior art. For this reason, the crack of a semiconductor chip can be prevented.

  In the present embodiment, the adhesive sheet 24 is sucked and peeled off, and then the semiconductor chip a52 is pushed up by the push-up needle 68 and picked up. For this reason, compared with the case where the semiconductor chip a52 is pushed up by the push-up needle 68 and picked up without sucking the adhesive sheet 24, the height at which the push-up needle 68 is pushed up can be lowered. For this reason, the crack of a semiconductor chip can be prevented.

  Further, in the present embodiment, when the semiconductor chip a52 is picked up, the adhesive sheet 24 is sucked and peeled from the semiconductor chip b64 together with the semiconductor chip a52. For this reason, after the semiconductor chip a52 is picked up, when the adhesive sheet 24 is sucked when the semiconductor chip b64 is picked up, the adhesive sheet 24 can be peeled from the semiconductor chip b64 in a wider range. Thereby, the crack of a semiconductor chip can be prevented. And a semiconductor chip can be picked up in a short time. Therefore, the productivity of the semiconductor chip can be improved.

  It should be noted that the semiconductor chip is imaged only when the surface pattern of the semiconductor chip attached to the adhesive sheet is picked up by the pickup camera 40 and the binarized value of the photographed image is within a preset threshold range. It is also possible to pick up after determining that the product is non-defective.

  In addition, it is possible to transfer information about a semiconductor chip that has been inspected and determined as a defective product in the process prior to the semiconductor chip manufacturing process according to the present embodiment to the pickup device according to the present embodiment. . For this reason, in this embodiment, it is possible not to pick up a defective semiconductor chip based on the information.

Furthermore, it is also possible to take a picture of the semiconductor chip picked up by the collet 14 and placed on the tray 36 of the tray stage 12 by the place camera 42. From the photographed image, it can be confirmed whether or not the chip is stored in a pocket (not shown) provided on the tray 36. It is also possible to determine whether or not the semiconductor chip is a non-defective product based on whether or not the value after binarization processing of the image of the surface pattern of the captured semiconductor chip is within a preset threshold range.
The pickup device includes coaxial illumination and epi-illumination illumination as illumination.

Embodiment 2. FIG.
Only the differences from the first embodiment will be described below with respect to the pickup device and the semiconductor chip manufacturing method of the second embodiment.

  FIG. 9 is a cross-sectional view of the holder according to the second embodiment. FIG. 9 corresponds to FIG. 4 according to the first embodiment. Unlike the configuration of the holder 44 of the first embodiment, the holder 72 includes a plurality of push-up needles 74 that push up different positions of the semiconductor chip. In the present embodiment, when picking up the semiconductor chip a52, different positions of the semiconductor chip a52 are pushed up by the plurality of push-up needles 74. Therefore, the stress due to the push-up needle does not concentrate on one place of the semiconductor chip a52. Thereby, the crack of a semiconductor chip can be prevented.

Embodiment 3 FIG.
Only the differences from the first embodiment will be described below with respect to the pickup device and the semiconductor chip manufacturing method of the present embodiment.

  FIG. 10 is a top view of the holder according to the third embodiment. In the holder 76, the arrangement positions of the first protrusion 60 and the second protrusion 78 provided inside the groove 50 are different from each other.

  In the present embodiment, similarly to the first embodiment, when the semiconductor chip a (desired semiconductor chip) 52 is picked up, it is supported from the semiconductor chip b (adjacent semiconductor chip) 64 by the second protrusion 78. The adhesive sheet 24 other than the removed portion is sucked and peeled off. Then, after picking up the semiconductor chip a52, when picking up the semiconductor chip b64, the adhesive sheet 24 other than the portion supported by the first protrusion 60 is sucked and peeled from the semiconductor chip b64. At this time, since the arrangement positions of the first protrusions 60 and the second protrusions 78 are different from each other, the adhesive sheet 24 at a place different from when the semiconductor chip a52 is picked up is peeled off.

  Therefore, in the present embodiment, the semiconductor chip b64 can be picked up after the adhesive sheet 24 is peeled off in a wider range than in the first embodiment. For this reason, the crack of a semiconductor chip can be prevented. Further, since the semiconductor chip can be picked up in a short time, the productivity of the semiconductor chip can be improved.

Embodiment 4 FIG.
Only the differences from the first embodiment will be described below with respect to the pickup device and the semiconductor chip manufacturing method of the present embodiment.

  11 and 12 are cross-sectional views of the holder according to the fourth embodiment. 11 and 12 correspond to FIGS. 4 and 5 according to the first embodiment, respectively. In the holder 80, the first protrusion 82 is formed higher than the second protrusion 84.

  In the present embodiment, as in the first embodiment, when the semiconductor chip a52 is picked up, the adhesive sheet 24 other than the portion supported by the second protrusion 84 is sucked and peeled from the semiconductor chip b64. Then, after picking up the semiconductor chip a52, when picking up the semiconductor chip b64, the adhesive sheet 24 other than the portion supported by the first protrusion 82 is sucked and peeled from the semiconductor chip b64.

  Thus, when peeling the adhesive sheet 24, since the 1st projection part 82 is formed higher than the 2nd projection part 84, the adhesive sheet 24 can be peeled little by little from semiconductor chip b64. . For this reason, compared with Embodiment 1, the adhesive force which the semiconductor chip b64 receives from the adhesive sheet 24 can be relieved. Therefore, cracking of the semiconductor chip can be prevented.

Embodiment 5 FIG.
Only the differences from the first embodiment will be described below with respect to the pickup device and the semiconductor chip manufacturing method according to the fifth embodiment.

  FIG. 13 is a top view of the holder according to the fifth embodiment. The XY direction shown in FIG. 13 indicates the same direction as the XY direction shown in FIGS. Unlike the holder 44 of the first embodiment, the holder 86 includes a groove 88 that expands in the X direction. The central portion of the groove portion 88 is expanded in the X direction. A protrusion 92 is provided inside the groove 88 so as to support semiconductor chips 90 of different sizes. For this reason, the pressure-sensitive adhesive sheet 24 can be sucked while the semiconductor chips 90 having different sizes are supported by the protrusions 92 via the pressure-sensitive adhesive sheet 24 without being supported by the contact surface 94 outside the groove portion 88. In this sucked state, semiconductor chips 90 of different sizes can be picked up by a collet.

  Therefore, unlike the first embodiment, it is not necessary to change the holder when the size of the semiconductor chip picked up by the pickup device changes. For this reason, the pick-up process of the semiconductor chip can be executed during a time period in which the pick-up device is conventionally stopped for the setup change. As a result, cracking of the semiconductor chip can be prevented and the productivity of the semiconductor chip can be improved.

24 Adhesive sheets 44, 72, 76, 80, 86 Holder
46 Main body 48 Contact surface 50, 88 Groove 52 Desired semiconductor chip 54 Selected semiconductor chip 56 Opening 58 Remaining semiconductor chips 60, 82 First protrusions 62, 78, 84 Second protrusion 64 Adjacent Semiconductor chip 66 Suction holes 68, 74 Push-up needle 70 Semiconductor wafer 90 Semiconductor chip 92 of different size Projection

Claims (9)

A pickup device for picking up a desired semiconductor chip from a plurality of semiconductor chips attached to an adhesive sheet,
A main body having a groove formed on a contact surface that contacts the adhesive sheet;
A protrusion provided inside the groove,
A suction mechanism that evacuates the groove and sucks the adhesive sheet;
Means for picking up the desired semiconductor chip;
With
The groove portion arranges a semiconductor chip selected from the plurality of semiconductor chips so as to include the desired semiconductor chip inside an outer periphery of an opening of the groove portion, and the semiconductor selected from the plurality of semiconductor chips. The remaining semiconductor chip excluding the chip is configured to be arranged outside the outer periphery,
The pickup device supports the selected semiconductor chip via the adhesive sheet without the selected semiconductor chip being supported by the contact surface. The selected semiconductor chip includes a semiconductor chip adjacent to the desired semiconductor chip;
The pickup device according to claim 1, wherein the protrusion includes a first protrusion that supports the desired semiconductor chip and a second protrusion that supports the adjacent semiconductor chip.   3. The pickup device according to claim 2, further comprising means for pushing up the desired semiconductor chip supported by the first protrusion from the inside of the groove.   4. The pickup device according to claim 3, wherein the push-up means pushes up different positions of the desired semiconductor chip by a plurality of push-up needles.   5. The position supported by the first protrusion in the desired semiconductor chip is different from the position supported by the second protrusion in the adjacent semiconductor chip. 2. The pickup device according to item 1.   The pickup device according to claim 2, wherein the first protrusion is formed higher than the second protrusion.   The pickup device according to claim 1, wherein the protrusion can support a semiconductor chip having a different size as the selected semiconductor chip. Manufacturing of a semiconductor chip that picks up the desired semiconductor chip from the plurality of semiconductor chips attached to the adhesive sheet using the pickup device according to any one of claims 1 to 7. A method,
Disposing the selected semiconductor chip and the remaining semiconductor chip inside and outside the outer periphery of the opening of the groove, respectively.
After the step of placing, the pickup unit picks up the desired semiconductor chip in a state in which the adhesive sheet is sucked by the suction mechanism while the selected semiconductor chip is supported by the protrusion through the adhesive sheet. Picking up by means;
A method of manufacturing a semiconductor chip, comprising: Manufacturing of the semiconductor chip which picks up the said desired semiconductor chip from the said several semiconductor chip affixed on the said adhesive sheet using the pick-up apparatus described in any one of Claims 2-6. A method,
A first arrangement step of arranging the selected semiconductor chip and the remaining semiconductor chips inside and outside the outer periphery of the opening of the groove, respectively.
After the first arrangement step, the adhesive sheet while supporting the desired semiconductor chip and the adjacent semiconductor chip by the first protrusion and the second protrusion through the adhesive sheet, respectively. A first pickup step of picking up the desired semiconductor chip by the pickup means in a state of being sucked by the suction mechanism;
A second placement step of placing the adjacent semiconductor chip inside the outer periphery of the opening of the groove after the first pickup step;
After the second arrangement step, the adjacent semiconductor in a state where the adhesive sheet is sucked by the suction mechanism while the adjacent semiconductor chip is supported by the first protrusion through the adhesive sheet. And a second pick-up step for picking up the chip by the pick-up means.

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