JPS6212946U - - Google Patents

Info

Publication number
JPS6212946U
JPS6212946U JP10436685U JP10436685U JPS6212946U JP S6212946 U JPS6212946 U JP S6212946U JP 10436685 U JP10436685 U JP 10436685U JP 10436685 U JP10436685 U JP 10436685U JP S6212946 U JPS6212946 U JP S6212946U
Authority
JP
Japan
Prior art keywords
wafer
utility
semiconductor manufacturing
model registration
heat source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10436685U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10436685U priority Critical patent/JPS6212946U/ja
Publication of JPS6212946U publication Critical patent/JPS6212946U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図…本考案の第一実施例の縦断面図、第2
図…本考案の第2実施例の一部分の縦面図、第3
図…従来例と本考案のウエハー表面の温度分布を
示す比較グラフ。 1…熱処理容器、2…ウエハー、3…主熱源、
4…副熱源。
Fig. 1...Longitudinal sectional view of the first embodiment of the present invention, Fig. 2
Figure: Vertical view of a portion of the second embodiment of the present invention, third
Figure: Comparison graph showing the temperature distribution on the wafer surface of the conventional example and the present invention. 1... Heat treatment container, 2... Wafer, 3... Main heat source,
4...Secondary heat source.

Claims (1)

【実用新案登録請求の範囲】 (1) 熱処理容器内にウエハーを配置し、ウエハ
ーの両面に正対してウエハー加熱用の主熱源を配
設し、ウエハーの周囲を取り囲むようにウエハー
の周縁部を加熱する副熱源を配設して成る事を特
徴とする半導体製造装置の均一加熱構造。 (2) 副熱源として環状のプリズムを使用する事
を特徴とする実用新案登録請求の範囲第1項に記
載の半導体製造装置の均一加熱構造。 (3) 副熱源として高周波加熱装置を使用するこ
とを特徴とする実用新案登録請求の範囲第1項に
記載の半導体製造装置の均一加熱構造。 (4) ウエハーに正対して熱処理容器に通光窓を
設け、熱処理容器の外部に主熱源を設けて成る事
を特徴とする実用新案登録請求の範囲第1項に記
載の半導体製造装置の均一加熱構造。 (5) 主熱源をハロゲンランプとして成る事を特
徴とする実用新案登録請求の範囲第4項に記載の
半導体製造装置の均一加熱構造。
[Claims for Utility Model Registration] (1) A wafer is placed in a heat treatment container, main heat sources for heating the wafer are placed directly opposite both sides of the wafer, and the peripheral edge of the wafer is placed so as to surround the wafer. A uniform heating structure for semiconductor manufacturing equipment characterized by being provided with an auxiliary heat source for heating. (2) A uniform heating structure for semiconductor manufacturing equipment according to claim 1 of the utility model registration, characterized in that an annular prism is used as an auxiliary heat source. (3) A uniform heating structure for semiconductor manufacturing equipment according to claim 1 of the utility model registration, characterized in that a high-frequency heating device is used as an auxiliary heat source. (4) The uniformity of the semiconductor manufacturing apparatus as set forth in claim 1 of the utility model registration claim, characterized in that a light-transmitting window is provided in the heat treatment container directly facing the wafer, and a main heat source is provided outside the heat treatment container. heating structure. (5) The uniform heating structure for semiconductor manufacturing equipment according to claim 4 of the utility model registration, characterized in that the main heat source is a halogen lamp.
JP10436685U 1985-07-08 1985-07-08 Pending JPS6212946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10436685U JPS6212946U (en) 1985-07-08 1985-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10436685U JPS6212946U (en) 1985-07-08 1985-07-08

Publications (1)

Publication Number Publication Date
JPS6212946U true JPS6212946U (en) 1987-01-26

Family

ID=30977797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10436685U Pending JPS6212946U (en) 1985-07-08 1985-07-08

Country Status (1)

Country Link
JP (1) JPS6212946U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59178718A (en) * 1983-03-29 1984-10-11 Sony Corp Semiconductor substrate processing apparatus
JPS60104367A (en) * 1984-08-17 1985-06-08 Nec Corp Medium discriminator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59178718A (en) * 1983-03-29 1984-10-11 Sony Corp Semiconductor substrate processing apparatus
JPS60104367A (en) * 1984-08-17 1985-06-08 Nec Corp Medium discriminator

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