JPS62128596A - リジッド型多層プリント回路基板の製造方法 - Google Patents

リジッド型多層プリント回路基板の製造方法

Info

Publication number
JPS62128596A
JPS62128596A JP26839585A JP26839585A JPS62128596A JP S62128596 A JPS62128596 A JP S62128596A JP 26839585 A JP26839585 A JP 26839585A JP 26839585 A JP26839585 A JP 26839585A JP S62128596 A JPS62128596 A JP S62128596A
Authority
JP
Japan
Prior art keywords
layer
manufacturing
circuit board
printed circuit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26839585A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0353796B2 (enrdf_load_html_response
Inventor
志賀　章二
須田　英男
吉章 荻原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP26839585A priority Critical patent/JPS62128596A/ja
Publication of JPS62128596A publication Critical patent/JPS62128596A/ja
Publication of JPH0353796B2 publication Critical patent/JPH0353796B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP26839585A 1985-11-30 1985-11-30 リジッド型多層プリント回路基板の製造方法 Granted JPS62128596A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26839585A JPS62128596A (ja) 1985-11-30 1985-11-30 リジッド型多層プリント回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26839585A JPS62128596A (ja) 1985-11-30 1985-11-30 リジッド型多層プリント回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS62128596A true JPS62128596A (ja) 1987-06-10
JPH0353796B2 JPH0353796B2 (enrdf_load_html_response) 1991-08-16

Family

ID=17457877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26839585A Granted JPS62128596A (ja) 1985-11-30 1985-11-30 リジッド型多層プリント回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS62128596A (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0312994A (ja) * 1989-06-02 1991-01-21 Internatl Business Mach Corp <Ibm> 多層配線板の製造方法
JPH04119696A (ja) * 1990-09-11 1992-04-21 Denki Kagaku Kogyo Kk 金属板ベース多層回路基板
JP2017108044A (ja) * 2015-12-11 2017-06-15 株式会社Ｄａｉｗａ 配線基板積層体及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0312994A (ja) * 1989-06-02 1991-01-21 Internatl Business Mach Corp <Ibm> 多層配線板の製造方法
JPH04119696A (ja) * 1990-09-11 1992-04-21 Denki Kagaku Kogyo Kk 金属板ベース多層回路基板
JP2017108044A (ja) * 2015-12-11 2017-06-15 株式会社Ｄａｉｗａ 配線基板積層体及びその製造方法

Also Published As

Publication number Publication date
JPH0353796B2 (enrdf_load_html_response) 1991-08-16

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Legal Events

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