JPS62128141A - ウエハの位置合わせ装置 - Google Patents

ウエハの位置合わせ装置

Info

Publication number
JPS62128141A
JPS62128141A JP26750185A JP26750185A JPS62128141A JP S62128141 A JPS62128141 A JP S62128141A JP 26750185 A JP26750185 A JP 26750185A JP 26750185 A JP26750185 A JP 26750185A JP S62128141 A JPS62128141 A JP S62128141A
Authority
JP
Japan
Prior art keywords
wafer
sensor
roller
actuator member
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26750185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334214B2 (enrdf_load_stackoverflow
Inventor
Koji Arai
荒井　幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Canon Marketing Japan Inc
Original Assignee
Canon Inc
Canon Hanbai KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Canon Hanbai KK filed Critical Canon Inc
Priority to JP26750185A priority Critical patent/JPS62128141A/ja
Publication of JPS62128141A publication Critical patent/JPS62128141A/ja
Publication of JPH0334214B2 publication Critical patent/JPH0334214B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)
JP26750185A 1985-11-29 1985-11-29 ウエハの位置合わせ装置 Granted JPS62128141A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26750185A JPS62128141A (ja) 1985-11-29 1985-11-29 ウエハの位置合わせ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26750185A JPS62128141A (ja) 1985-11-29 1985-11-29 ウエハの位置合わせ装置

Publications (2)

Publication Number Publication Date
JPS62128141A true JPS62128141A (ja) 1987-06-10
JPH0334214B2 JPH0334214B2 (enrdf_load_stackoverflow) 1991-05-21

Family

ID=17445725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26750185A Granted JPS62128141A (ja) 1985-11-29 1985-11-29 ウエハの位置合わせ装置

Country Status (1)

Country Link
JP (1) JPS62128141A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145037U (ja) * 1983-03-17 1984-09-28 日本電子株式会社 ウエハの位置合わせ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145037U (ja) * 1983-03-17 1984-09-28 日本電子株式会社 ウエハの位置合わせ装置

Also Published As

Publication number Publication date
JPH0334214B2 (enrdf_load_stackoverflow) 1991-05-21

Similar Documents

Publication Publication Date Title
KR100885082B1 (ko) 버퍼링 성능을 가진 에지 그립 얼라이너
US6468022B1 (en) Edge-gripping pre-aligner
JP4408351B2 (ja) アライメント装置
JPH0610775B2 (ja) 円形基板の位置決め装置
US6554560B2 (en) Method for aligning wafers in a cassette
JPH0225254B2 (enrdf_load_stackoverflow)
JP4835826B2 (ja) 液晶配向膜用真空蒸着装置およびその成膜方法
JPS62128141A (ja) ウエハの位置合わせ装置
JPH0334216B2 (enrdf_load_stackoverflow)
TW201243991A (en) Wafer holding mechanism
JPH01169939A (ja) 半導体ウエハのセンタ合せ装置
JP4015762B2 (ja) 半導体ウェーハの厚さ測定装置
JPH0727957B2 (ja) 半導体製造装置
WO2001096836A1 (en) Device for positioning disk-shaped objects
JP2826300B2 (ja) 円形部材の外径測定装置
JPH08255821A (ja) シリコンウェハー搬送装置
JPH08255822A (ja) シリコンウェハー搬送装置
KR100411617B1 (ko) 씨씨디카메라에 의한 문자열 인식기능을 갖춘 반도체웨이퍼정렬장치
JPH06334026A (ja) オリエンテーションフラット合わせ機内蔵型ウエハ収納装置
TWI887663B (zh) 搬運機器人以及機器人系統
KR102844901B1 (ko) 포고핀의 외관 검사 장치
JPH0280908A (ja) 摩擦送り機構
JPH0722495A (ja) ウェーハ姿勢合わせ装置
CN118486643B (zh) 一种微转动载台及芯片巨量转移设备
JP2589671Y2 (ja) 眼鏡レンズ枠形状測定装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term