JPS62124774U - - Google Patents
Info
- Publication number
- JPS62124774U JPS62124774U JP1986012164U JP1216486U JPS62124774U JP S62124774 U JPS62124774 U JP S62124774U JP 1986012164 U JP1986012164 U JP 1986012164U JP 1216486 U JP1216486 U JP 1216486U JP S62124774 U JPS62124774 U JP S62124774U
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- insulating
- leads
- periphery
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011295 pitch Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986012164U JPS62124774U (zh) | 1986-01-29 | 1986-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986012164U JPS62124774U (zh) | 1986-01-29 | 1986-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124774U true JPS62124774U (zh) | 1987-08-07 |
Family
ID=30800041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986012164U Pending JPS62124774U (zh) | 1986-01-29 | 1986-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124774U (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832195A (ja) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | 複合プリント基板の接続構造 |
| JP2006277971A (ja) * | 2005-03-28 | 2006-10-12 | Alps Electric Co Ltd | 接点基板及びその製造方法 |
| WO2019146252A1 (ja) * | 2018-01-23 | 2019-08-01 | 株式会社村田製作所 | 基板接合構造、および基板の接合方法 |
-
1986
- 1986-01-29 JP JP1986012164U patent/JPS62124774U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832195A (ja) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | 複合プリント基板の接続構造 |
| JP2006277971A (ja) * | 2005-03-28 | 2006-10-12 | Alps Electric Co Ltd | 接点基板及びその製造方法 |
| JP4541205B2 (ja) * | 2005-03-28 | 2010-09-08 | アルプス電気株式会社 | 接点基板及びその製造方法 |
| WO2019146252A1 (ja) * | 2018-01-23 | 2019-08-01 | 株式会社村田製作所 | 基板接合構造、および基板の接合方法 |
| JPWO2019146252A1 (ja) * | 2018-01-23 | 2020-12-17 | 株式会社村田製作所 | 基板接合構造、および基板の接合方法 |
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