JPS62124146A - Polyphenylene oxide resin composition - Google Patents

Abstract

PURPOSE:To obtain the titled crosslinkable composition having improved chemical resistance, heat-resistance, etc., by compounding a polyphenylene oxide resin with a styrene-based thermoplastic polymer, an epoxy compound and a catalyst and/or a curing agent. CONSTITUTION:The objective composition can be produced by compounding (A) a polyphenylene oxide resin, e.g. poly(2,6-dimethyl-1,4-phenylene oxide) with (B) a styrene-based thermoplastic polymer, preferably polystyrene and/or styrene- butadiene copolymer, (C) an epoxy compound, preferably an alicyclic epoxy compound and (D) a catalyst (e.g. 2-methylimidazole) and/or a curing agent (e.g. m-phenylenediamine). The obtained composition is dissolved in a solvent, cast on or applied to a carrier film for casting, etc., and dried to obtain a film.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the technical field for improving physical properties such as chemical resistance and heat resistance of polyphenylene oxide resins.

[Background technology]

Polyphenylene oxide (hereinafter abbreviated as PPO) resin has excellent mechanical and thermal properties. However, it has the disadvantage of extremely poor chemical resistance. Depending on the application, further improvements in not only chemical resistance but also mechanical and thermal properties are desired.

One way to meet these demands is to crosslink resins. This is because modifying the resin by crosslinking is the most effective and reliable means.

However, no specific and excellent crosslinking method has yet been proposed for PPO resins.

[Purpose of the invention]

In view of the above circumstances, an object of the present invention is to provide a PPO resin composition in which the physical properties of PPO resin are further improved.

[Disclosure of the invention]

In order to achieve the above object, the present invention involves blending a PPO and di-styrenic plastic polymer, an epoxy compound, a catalyst and/or a curing agent, and performing crosslinking in order to obtain a Ppo-based resin composition. It is something. This will be explained in detail below.

The PPO resin used in this invention is, for example, one represented by the following general formula, and examples thereof include:
Poly(2,6-dimethyl-1,4-phenylene oxide) is mentioned.

Such PP○ is, for example, USP4059568
It can be synthesized by the method disclosed in the specification. There are no particular limitations on odor (for example, molecular weight (
A polymer with M w ) of 50,000 and Mw/M n =4.2 is used.

The epoxy compounds used in this invention are not particularly limited, but include, for example, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, glycerol diglycidyl ether, glycerol triglycidyl ether, and diglycerol po-IJ glycidyl ether. , sorbitol polyglycidyl ether, allyl glycidyl ether, (bori ethylene glycol diglycidyl ether, polymer.

Robidine glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1.6 hexanediol diglycidyl ether, glycerin polyglycidyl ether, diglycerin polyglycidyl ether, trimethylol pronomanbo glycidyl ether,
Terephthalic acid diglycidyl ester, spiroglycol diglycidyl ether, 3,4 epoxycyclohexylmethyl (3,4-epoxycyclohexane) carboxylate, bis 13,4-epoxy-(cyclohexylmethyl) adipate, 3,4 epoxy-6 Methylcyclohexylmethyl 3.4epoxy-6methylcyclohexanecarboxylate, bis(epoxy-6methylcyclohexanecarboxylate, bis(3,4-epoxy-6
Examples include methylcyclohexylmethyl)adipate.

Catalysts used in this invention include, but are not particularly limited to, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-ethylimidazole, 2.4dimethylimidazole, dimethylaminomethylphenol, tris Examples include (dimethylaminomethyl)phenol.

The curing agent used in this invention is not particularly limited, but includes metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone,
meta-xylene diamine, meta-aminobenzylamine, benzidine, 4-chloro-O-phenylene diamine, bis(3,4-diaminophenyl) sulfone, 2.6-diaminopyridine, phthalic anhydride, tetrahydrophthalic anhydride, hexahydro anhydride Examples include phthalic acid, methyl nadic anhydride, dodecenyl succinic anhydride, clodine desoxic anhydride, trimellitic anhydride, and pyromellitic anhydride.

A method for manufacturing a sheet of a PPO resin composition is, for example, as described above, by dissolving the raw materials in a solvent, mixing them, casting or coating them on an appropriate material to form a thin layer, and then drying to remove the solvent. (casting method). According to this production method, sheets can be produced at low temperatures without using the costly calendar method.

To describe the casting method in detail, the mixture obtained by mixing the raw materials with a solvent is cast (or , coating) and thoroughly drying to remove the solvent to obtain a sheet. The carrier film for casting is not particularly limited, but polyethylene terephthalate (hereinafter, PE
Those that are insoluble in the above-mentioned solvents, such as T) film, polyethylene film, polypropylene film, and polyimide film, are preferable, and those that have been subjected to mold release treatment are preferable. The solvent is removed from the PPO resin composition cast (or coated) on the carrier film for casting by air drying and/or drying with hot air.

The upper limit of the set temperature during drying is preferably lower than the boiling point of the solvent or lower than the heat resistance temperature of the carrier film for casting (when drying is performed on a carrier film for casting), and the lower limit is lower than the boiling point of the solvent or lower than the heat resistance temperature of the carrier film for casting. For example, when using trichlorethylene as a solvent and using PET film as a carrier film for casting, the temperature range is preferably from room temperature to 80°C, and if the temperature is raised within this range, drying will occur. It becomes possible to shorten the time.

The sheet thus produced is crosslinked at room temperature or by applying heat.

Next, examples and comparative examples will be described.

(Example) In a reactor equipped with a defoaming device No. 21, 85 g of PPO, 10 g of an epoxy compound, and styrene data diene prosocopolymer (sBs) as a crosslinkable polymer were placed in a reactor equipped with a defoaming device in the proportions shown in Table 1. Add 5 g of and 0.2 g of 2-ethyl-4methylimidazole as a catalyst, and further,
Add 4°Og of trichlorethylene (Toagosei Kagaku Kogyo Co., Ltd.) and add enough i1j to make a homogeneous solution.
Stir to mix. After that, defoaming was performed, and the obtained PPO
A solution of the raw material for the resin composition was coated onto a PET film to a thickness of 500 Ilm using a coating machine. After drying it at 50°C, the resulting film was released from the PET film and further dried at 120'C for 20 minutes. The thickness of the film after drying was 100 μm. This film was processed at 250°C for 15 minutes. As for the physical properties of the film, the solubility in trichlene is ○, hardly soluble ○,
The results are shown in Table 1 along with the raw material formulation of the PPo resin composition.

(Comparative Example 1) A film was obtained in the same manner as in the example, using a ratio of 85 g of PPO, 55 g of SB, and 360 g of trichlene. The results are also shown in Table 1.

As shown in Table 1, PPO and SBS alone are not as good as the examples in terms of chemical resistance and tensile strength at room temperature and high temperature.

[Effects of the Invention] As seen above, by adding a styrene thermoplastic polymer, an epoxy compound, and a curing agent and/or catalyst to PPO according to the present invention, chemical resistance and heat resistance can be effectively improved. It is possible to obtain a PPO-based resin composition that provides an improved cured product.

[Margin below]

= 工（l :1：O○ 0=IJ O−011 001l; Two; ツψψ豐I、IP+ nee〇−〇： 工I N=O−O

Claims (4)

[Claims] (1) For polyphenylene oxide resin, styrene thermoplastic polymer, epoxy compound and
A polyphenylene oxide resin composition characterized by containing a catalyst and/or a curing agent. (2) The polyphenylene oxide resin composition according to claim 1, wherein the styrenic thermoplastic polymer is polystyrene and/or styrene-butadiene copolymer. (3) The polyphenylene oxide resin composition according to claim 1 or 2, wherein the resin composition is in the form of a film. (4) The polyphenylene oxide resin composition according to claim 1, wherein the epoxy compound is an alicyclic epoxy compound.