JPS62122153A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS62122153A
JPS62122153A JP26289885A JP26289885A JPS62122153A JP S62122153 A JPS62122153 A JP S62122153A JP 26289885 A JP26289885 A JP 26289885A JP 26289885 A JP26289885 A JP 26289885A JP S62122153 A JPS62122153 A JP S62122153A
Authority
JP
Japan
Prior art keywords
resin
heat
shielding body
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26289885A
Other languages
Japanese (ja)
Inventor
Haruo Funakoshi
船越　晴男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP26289885A priority Critical patent/JPS62122153A/en
Publication of JPS62122153A publication Critical patent/JPS62122153A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the extreme temperature rise of resin from occuring while restraining the heat rays from transmitting to resin at the time of fixing a semiconductor device on a substrate etc. using heat shielding body by a method wherein the heat shielding body is provided on the surface of resin in the semiconductor device resin-sealing a semiconductor element. CONSTITUTION:A heat shielding body 4 provided on the surface of resin body 1 is coated with white ink film. An indication 5 representing any model number etc. formed on the heat shielding body 4 is hollowed letters formed using stamps not to be coated with white ink when coating the surface with the white ink. When outer leading conductors 2 and interconnection such as semiconductor etc. are soldered using heat rays such as near infrared rays etc. to assemble a semiconductor thus constituted into the substrate etc., the temperature of resin 1 is restrained from rising up since the heat rays are reflected in the heat shielding body 4. Resultantly, the soldering process can be performed sufficiently preventing a semiconductor element from being broken down due to sufficient output of heat rays.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体素子を樹脂封止した半導体装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device in which a semiconductor element is sealed with resin.

〔従来の技術〕[Conventional technology]

第３図は従来のこの種の半導体装置を示すものであり９
図においてｆ１＋は半導体素子（図示せず）を封止する
樹脂で、一般に黒色である。（２）は上記半導体素子の
各電極と樹脂（１）内で電気的に接続され、樹脂（１）
外へ突出された外部リード導体、（３）は上記樹脂（１
）の上表面に型名等を表わす白インクで捺印された表示
である。Figure 3 shows a conventional semiconductor device of this type9.
In the figure, f1+ is a resin that seals a semiconductor element (not shown), and is generally black in color. (2) is electrically connected to each electrode of the semiconductor element in the resin (1);
The external lead conductor (3) protruding outward is the resin (1)
) is a display stamped in white ink indicating the model name, etc.

この様に構成された半導体装置は一般に基板等に組み込
まれるものであ、す１組み込む際には、外部リード導体
（３）と基板上の配線とを近赤外線等の熱線により実装
つま、りはんだ付けするものである。Semiconductor devices configured in this manner are generally incorporated into a board, etc., and when assembled, the external lead conductor (3) and the wiring on the board are mounted or soldered using a hot wire such as near infrared rays. It is something to attach.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかるに、この様に構成された半導体装置にあっては、
樹脂（１）が黒色であるため、半導体装置を基板に取り
付ける時に熱線を吸収して樹脂（１１の温度が上昇し、
熱膨張のため半導体素子が破壊して信頼度が低下すると
いう問題を有するものであった。However, in a semiconductor device configured in this way,
Since the resin (1) is black, when the semiconductor device is attached to the board, it absorbs heat rays and the temperature of the resin (11) rises.
There was a problem in that the semiconductor element was destroyed due to thermal expansion, resulting in a decrease in reliability.

一方、半導体素子の破壊を防ぐために熱線の出力を調整
して低下させると、外部リード導体（２）と基板等の配
線とのはんだ付けが不充分となシ、信頼度が落ちるとと
もに信頼度を高めるためＫは手直し等の工程を追加しな
ければならないという問題を有するものである。On the other hand, if the output of the hot wire is adjusted and lowered in order to prevent the destruction of the semiconductor element, the soldering between the external lead conductor (2) and the wiring on the board, etc. will be insufficient, and the reliability will decrease. In order to increase K, there is a problem in that additional steps such as rework must be added.

この発明は上記した点に鑑みてなされたものであ一す、
基板等に取り付ける際に熱線を受けても樹脂の極端な温
度上昇を防止でき、伯゛頼度の高い半導体装置を得ると
とを目的とするものである。This invention has been made in view of the above points.
The object of the present invention is to obtain a highly reliable semiconductor device that can prevent an extreme temperature rise of the resin even if it is exposed to hot rays when attached to a substrate or the like.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る半導体装置は、樹脂の表面に熱遮蔽体を
設けたものである。A semiconductor device according to the present invention has a heat shield provided on the surface of a resin.

〔作用〕[Effect]

この発明においては、熱遮蔽体が半導体装置を基板等に
取、り付ける際の熱線を樹脂に伝達するのを抑制し、樹
脂の極端な温度上昇を防止する。In this invention, the heat shield suppresses the transmission of heat rays to the resin when attaching the semiconductor device to a substrate or the like, thereby preventing an extreme temperature rise in the resin.

〔実施例〕〔Example〕

以下にこの発明の一実施例を第１図に基づいて説明する
と１図において（４）は樹脂＋１１の上表面に設けられ
た熱遮蔽体で、白インクを膜状に塗布したものである。An embodiment of the present invention will be described below with reference to FIG. 1. In FIG. 1, (4) is a heat shield provided on the upper surface of the resin +11, which is coated with a film of white ink.

（５）はこの熱遮蔽体に形成された型番等を表わす表示
部で、白インクを塗布する際に白インクが塗布されない
ようにして形成された白抜黒字である。Reference numeral (5) is a display section formed on this heat shielding body to indicate the model number, etc., and is a white black character formed to prevent white ink from being applied when white ink is applied.

この様に構成された半導体装置を基板等に組み込むため
、外部リード導体（２）と基板等の配線とを近赤外線等
の熱線によ−りはんだ付けした場合、熱線は熱蔽蔽体（
４）によ、り反射されるので、樹脂（りの温度上昇は抑
えられる。従って充分な熱線の出力によってはんだ付け
できるため、はんだ付けが不充分となることはなく、か
つ半導体素子の破壊も防止でき、信頼度の高い半導体装
置が得られるものである。In order to incorporate the semiconductor device configured in this way into a board, etc., when the external lead conductor (2) and the wiring of the board, etc. are soldered using hot wires such as near-infrared rays, the hot wires pass through the heat shield (
4) Since it is reflected by the resin, the temperature rise of the resin can be suppressed. Therefore, since soldering can be performed with sufficient output of the hot wire, the soldering will not be insufficient, and the semiconductor elements will not be destroyed. This can be prevented and a highly reliable semiconductor device can be obtained.

第２図はこの発明の他の実施例を示すものであり、熱遮
蔽体（４）として白色系統のラベルを用いたものであり
、このラベルを樹脂（１１の上表面に貼着したものであ
り１表示部（３）がラベル上に黒インクで捺印されてい
るものである。この実施例のものにおいても上記実施例
と同様の効果を奏するものである。FIG. 2 shows another embodiment of the present invention, in which a white label is used as the heat shield (4), and this label is attached to the upper surface of the resin (11). The dovetail 1 display portion (3) is stamped on the label with black ink.This embodiment also provides the same effects as the above embodiment.

なお、上記実施例においては、熱線の開封を一番受ける
樹脂（１１の上表面にのみ熱遮蔽体（４）を設けたもの
としたが、さらに樹脂ｆｉｌの下表面にも、あるいは全
表面に熱遮蔽体を設けたものとすれば。In the above embodiment, the heat shield (4) was provided only on the upper surface of the resin (11) that is most susceptible to opening by the heat rays, but the heat shield (4) was also provided on the lower surface of the resin film or on the entire surface. Assuming a heat shield is provided.

一層の効果が得られるものである。This provides even greater effects.

〔発明の効果〕〔Effect of the invention〕

この発明は以上述べたように、樹脂の表面に熱遮蔽体を
設けたので、半導体装置を基板等に取付ける際の熱線に
よる樹脂の温度上昇を抑制でき。As described above, in this invention, since a heat shield is provided on the surface of the resin, it is possible to suppress the rise in temperature of the resin due to hot rays when attaching a semiconductor device to a substrate or the like.

半導体素子の破壊を防止でき、信頼性の高い半導体装置
が得られるという効果を有する。This has the effect that destruction of semiconductor elements can be prevented and a highly reliable semiconductor device can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の一実施例を示す一部断面側面図、第
２図はこの発明の他の実施例を示す一部断面側面図、第
３図は従来の半導体装置を示す一部断面側面図である。 図において（１１は樹脂、（４）は熱遮蔽体である。 なお、各図中同一符号は同−又は相当部分を示す。FIG. 1 is a partially sectional side view showing one embodiment of the present invention, FIG. 2 is a partially sectional side view showing another embodiment of the invention, and FIG. 3 is a partially sectional side view showing a conventional semiconductor device. FIG. In the figures, (11 is a resin, and (4) is a heat shield. In each figure, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 半導体素子を樹脂封止した半導体装置において、上記樹
脂の表面に熱遮蔽体を設けたことを特徴とする半導体装
置。1. A semiconductor device in which a semiconductor element is sealed with a resin, characterized in that a heat shield is provided on the surface of the resin.
JP26289885A 1985-11-21 1985-11-21 Semiconductor device Pending JPS62122153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26289885A JPS62122153A (en) 1985-11-21 1985-11-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26289885A JPS62122153A (en) 1985-11-21 1985-11-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS62122153A true JPS62122153A (en) 1987-06-03

Family

ID=17382147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26289885A Pending JPS62122153A (en) 1985-11-21 1985-11-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS62122153A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415851U (en) * 1990-05-30 1992-02-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415851U (en) * 1990-05-30 1992-02-07

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