JPH0236319Y2 - - Google Patents
Info
- Publication number
- JPH0236319Y2 JPH0236319Y2 JP15887484U JP15887484U JPH0236319Y2 JP H0236319 Y2 JPH0236319 Y2 JP H0236319Y2 JP 15887484 U JP15887484 U JP 15887484U JP 15887484 U JP15887484 U JP 15887484U JP H0236319 Y2 JPH0236319 Y2 JP H0236319Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- hybrid
- protective layer
- resin
- shield film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、樹脂外装したハイブリツドICに
関する。[Detailed description of the invention] [Industrial application field] This invention relates to a hybrid IC coated with resin.
ハイブリツドICの外装型式には金属ケース外
装型と樹脂外装型とがあり、前者はシールド効果
が高く周囲の電界等からの影響を受けにくい利点
がある反面、形状が大型化しやすく、かつコスト
が高くなる欠点がある。これに対し、後者は安価
に製作できる反面シールド効果が得られない欠点
がある。
The exterior types of hybrid ICs include metal case exterior type and resin exterior type.The former has the advantage of having a high shielding effect and is less affected by surrounding electric fields, etc., but on the other hand, it tends to be larger in size and is more expensive. There is a drawback. On the other hand, although the latter can be manufactured at low cost, it has the disadvantage that it cannot provide a shielding effect.
そこで、樹脂外装型でシールド効果のあるもの
が要望され、その一例として、第５図及び第６図
に示すように、ハイブリツドIC本体１を被覆し
た絶縁性樹脂からなる保護層５の表面に導電性物
質を塗布してシールド膜６を形成するとともに、
このシールド膜６の一部をハイブリツドIC本体
１から突設されているグランド端子４ｇに接続す
るものが提案された。 Therefore, there is a demand for a resin-clad type with a shielding effect.As an example, as shown in FIGS. At the same time, a shielding film 6 is formed by applying a chemical substance, and
It has been proposed that a part of this shield film 6 is connected to a ground terminal 4g protruding from the hybrid IC body 1.
しかし、上記手段ではシールド膜６をグランド
端子４ｇ…に接続する際に、グランド端子以外の
リード端子４…を避けねばならず、導電物質の塗
布が面倒で自動化が困難であつた。又、グランド
端子４ｇとシールド膜６との接続は端子４ｇの変
形等によつて外れやすく、安定的な接地手段とは
いえないものであつた。
However, with the above means, when connecting the shield film 6 to the ground terminals 4g, it is necessary to avoid the lead terminals 4 other than the ground terminals, and the application of the conductive material is troublesome and automation is difficult. Further, the connection between the ground terminal 4g and the shield film 6 is easily disconnected due to deformation of the terminal 4g, etc., and cannot be said to be a stable grounding means.
この考案は、上記提案手段に見られた不具合が
なく、簡単にシールド膜を形成して、安定的なシ
ールド効果を発揮させることができる樹脂外装型
のハイブリツドICを提供しようとしたものであ
る。 This invention is an attempt to provide a resin-clad hybrid IC that does not have the problems seen in the above-mentioned proposed means and can easily form a shielding film and exhibit a stable shielding effect.
本考案の特徴とするところは、ハイブリツド
ICを構成する基板のグランドライン上に導電材
のチツプを取付け、このグランド用チツプを含め
てハイブリツドIC本体を全体的に絶縁性樹脂か
らなる保護層で被覆するとともに、グランド用チ
ツプの端部を保護層の表面に露出させ、リード端
子突出部を避けて保護層のほぼ全体に導電性物質
を塗布して、グランド用チツプの端部に接続され
たシールド膜を形成した点にある。
The feature of this invention is that it is a hybrid
A chip of a conductive material is attached to the ground line of the board that constitutes the IC, and the entire hybrid IC body, including this ground chip, is covered with a protective layer made of insulating resin, and the end of the ground chip is covered with a protective layer made of insulating resin. The shield film is formed by applying a conductive material to almost the entire surface of the protective layer exposed on the surface of the protective layer, avoiding the protruding parts of the lead terminals, and connected to the end of the grounding chip.
上記構成によると、導電性物質を塗布してシー
ルド膜を形成する場合、リード端子突出部にだけ
塗布しないよう注意しさえすればよいので、塗布
工程が簡単なものとなり、自動化も容易となる。
又、チツプとシールド膜との接続部は本来変形し
ない箇所であるから、接続が安定的なものとな
る。
According to the above configuration, when a shield film is formed by applying a conductive substance, it is only necessary to be careful not to apply the conductive substance only to the protruding portions of the lead terminals, so that the application process becomes simple and automation becomes easy.
Furthermore, since the connection between the chip and the shield film is a place that does not originally deform, the connection becomes stable.
第１図及び第２図に本考案による樹脂外装型ハ
イブリツドICが示される。ハイブリツドIC本体
１は、周知のように、プリント基板２の表面所定
位置に各種チツプ部品３ａ，３ｂ，…を取付ける
とともに、グランド端子４ｇを含んだ複数のリー
ド端子４…を取付けて構成されており、基板部分
全体が絶縁性樹脂からなる保護層５で被覆されて
いる。そして、この保護層５の表面に導電性物質
が塗布されて基板２上のグランドラインに接続さ
れたシールド膜６が形成されている。
1 and 2 show a resin-clad hybrid IC according to the present invention. As is well known, the hybrid IC main body 1 is constructed by attaching various chip parts 3a, 3b,... to predetermined positions on the surface of a printed circuit board 2, as well as a plurality of lead terminals 4... including a ground terminal 4g. The entire substrate portion is covered with a protective layer 5 made of insulating resin. A conductive material is coated on the surface of the protective layer 5 to form a shield film 6 connected to the ground line on the substrate 2.
このシールド膜６と基板上グランドラインとの
接続は次のような手順による。 The connection between this shield film 6 and the ground line on the substrate is performed by the following procedure.
つまり、基板２上のグランドラインには予め第
４図に示すような形状の導電材からなるチツプ７
を取付け、このチツプ７を含めてハイブリツド
IC本体１の基板部全体を先ず第３図に示すよう
にデイツプ手段または流動浸漬手段等で樹脂外装
して前記保護層５を形成する。次に、第３図のＡ
−Ａ線でチツプ７の突出部分を切除し、チツプ７
の先端を保護層５の表面に露出させる。その上
で、リード端子４群の突出部位を避けて保護層５
の表面のほぼ全体に導電性物質を塗布し、チツプ
７を介して基板２上のグランドラインとシールド
層６とを電気的に接続するのである。 In other words, a chip 7 made of a conductive material having a shape as shown in FIG.
and install the hybrid including this chip 7.
As shown in FIG. 3, the entire substrate portion of the IC body 1 is first coated with resin by dipping means or fluid dipping means to form the protective layer 5. Next, A in Figure 3
- Cut out the protruding part of tip 7 with line A, and
The tip of the protective layer 5 is exposed on the surface of the protective layer 5. On top of that, protect the protective layer 5 while avoiding the protruding parts of the 4 groups of lead terminals.
A conductive substance is applied to almost the entire surface of the substrate 2, and the ground line on the substrate 2 and the shield layer 6 are electrically connected via the chip 7.
尚、前記チツプ７は必ずしもブロツク片である
必要はなく、形状や材質も任意であり、例えば金
属端子片を半田付けしたものでもよい。 Incidentally, the chip 7 does not necessarily have to be a block piece, and may have any shape or material, for example, it may be a metal terminal piece soldered.
以上説明したように、本考案による樹脂外装型
のハイブリツドICは、安価に製作できる樹脂外
装型の特徴を生かしながら金属ケース外装型に匹
適するシールド効果を備えさせることができた。
As explained above, the resin-clad hybrid IC according to the present invention was able to take advantage of the characteristics of the resin-clad type, which can be manufactured at low cost, while providing a shielding effect comparable to that of the metal case-clad type.
しかも、シールド膜を基板のグランドライン上
にチツプを介して接続する形態をとつたので、第
５図及び第６図に示すようにグランド端子を利用
してグランド接続する手段に比較してシールド膜
形成のための導電性物質の塗布が簡単で、塗布工
程の自動化も容易であり、実用上の効果が高い。
又、シールド膜６とチツプ７との接続部には原則
的に外力が加わらないため外れるおそれがなく、
シールド効果を安定的に維持できる。 Moreover, since the shield film is connected to the ground line of the board through the chip, the shield film is Application of the conductive material for formation is easy, automation of the application process is also easy, and the practical effect is high.
In addition, since no external force is applied to the connection between the shield film 6 and the chip 7 in principle, there is no risk of it coming off.
The shield effect can be stably maintained.
第１図は本考案にかゝる樹脂外装型ハイブリツ
ドICの縦断側面図、第２図はその正面図、第３
図は製作過程の縦断側面図、第４図は構成部品の
斜視図、第５図は先に考えられたシールド膜付き
ハイブリツドICの正面図、第６図は第５図にお
けるＢ−Ｂ線断面図である。
１……ハイブリツドIC本体、２……基板、５
……保護層、６……シールド膜、７……グランド
用チツプ。
Figure 1 is a vertical side view of a resin-clad hybrid IC according to the present invention, Figure 2 is its front view, and Figure 3 is its front view.
The figure is a vertical side view of the manufacturing process, Figure 4 is a perspective view of the component parts, Figure 5 is a front view of the previously conceived hybrid IC with a shield film, and Figure 6 is a cross section taken along the line B-B in Figure 5. It is a diagram. 1...Hybrid IC main body, 2...Substrate, 5
...protective layer, 6...shielding film, 7...ground chip.
Claims (1)
ランドライン上に導電材のチツプを取付け、この
グランド用チツプ７を含めてハイブリツドIC本
体１全体を絶縁性樹脂からなる保護層５で被覆す
るとともに、前記グランド用チツプ７の端部を保
護層５表面に露出させ、リード端子突出部を避け
て保護層５のほぼ全体に導電性物質を塗布して、
グランド用チツプ７の端部に接続されたシールド
膜６を形成してある樹脂外装型のハイブリツド
IC。 A chip of a conductive material is attached to the ground line of the substrate 2 constituting the hybrid IC main body 1, and the entire hybrid IC main body 1, including this grounding chip 7, is covered with a protective layer 5 made of insulating resin. The end of the chip 7 for use is exposed on the surface of the protective layer 5, and a conductive substance is applied to almost the entire protective layer 5, avoiding the protruding parts of the lead terminals.
A resin-clad hybrid with a shield film 6 connected to the end of the grounding chip 7.
I C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15887484U JPH0236319Y2 (en) | 1984-10-19 | 1984-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15887484U JPH0236319Y2 (en) | 1984-10-19 | 1984-10-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6175192U JPS6175192U (en) | 1986-05-21 |
| JPH0236319Y2 true JPH0236319Y2 (en) | 1990-10-03 |
Family
ID=30716841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15887484U Expired JPH0236319Y2 (en) | 1984-10-19 | 1984-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236319Y2 (en) |
-
1984
- 1984-10-19 JP JP15887484U patent/JPH0236319Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6175192U (en) | 1986-05-21 |
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