JPS6211972B2 - - Google Patents
Info
- Publication number
- JPS6211972B2 JPS6211972B2 JP16137881A JP16137881A JPS6211972B2 JP S6211972 B2 JPS6211972 B2 JP S6211972B2 JP 16137881 A JP16137881 A JP 16137881A JP 16137881 A JP16137881 A JP 16137881A JP S6211972 B2 JPS6211972 B2 JP S6211972B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum alloy
- copper plating
- radiator
- manufacturing
- masking agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16137881A JPS5862497A (ja) | 1981-10-09 | 1981-10-09 | 放熱器の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16137881A JPS5862497A (ja) | 1981-10-09 | 1981-10-09 | 放熱器の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5862497A JPS5862497A (ja) | 1983-04-13 |
JPS6211972B2 true JPS6211972B2 (enrdf_load_stackoverflow) | 1987-03-16 |
Family
ID=15733947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16137881A Granted JPS5862497A (ja) | 1981-10-09 | 1981-10-09 | 放熱器の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5862497A (enrdf_load_stackoverflow) |
-
1981
- 1981-10-09 JP JP16137881A patent/JPS5862497A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5862497A (ja) | 1983-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN206542684U (zh) | 可连续接合的液冷换热片 | |
US7731079B2 (en) | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled | |
JP2004115337A (ja) | アルミニウム−セラミックス接合体 | |
JPH0680756B2 (ja) | 液冷集積回路パツケ−ジ | |
CN110763059A (zh) | 一种超薄均温板及其制造方法 | |
JP5029139B2 (ja) | 車載用半導体装置及び車載用半導体装置の製造方法 | |
CN111448654A (zh) | 用于电子部件的散热器、具有这种散热器的电子组件和制造这种散热器的方法 | |
EP0539583A1 (en) | Method of producing heat pipe-type semiconductor cooling device | |
WO2024093695A1 (zh) | 一种三维蒸气腔元件嵌入式的液冷散热模组 | |
JP2017059713A (ja) | 放熱器の製造方法 | |
CN112103252A (zh) | 一种基于金属微流道的制冷型ltcc微系统及其制备方法 | |
CN107195603A (zh) | 一种基于高导热相变材料相变散热技术的封装结构的制备方法 | |
WO2022127748A1 (zh) | 一种超薄焊接垫片及制备方法、焊接方法与半导体器件 | |
CN101465330A (zh) | 金属热界面材料及含有该材料的散热模块与封装微电子 | |
JPS6211972B2 (enrdf_load_stackoverflow) | ||
CN209029363U (zh) | 芯片散热结构、芯片结构、电路板和超算设备 | |
CN117894689A (zh) | 一种新型半导体散热一体化封装结构的制作方法 | |
JPS5866634A (ja) | 放熱器の製造方法 | |
JP2005294366A (ja) | 放熱板の製造方法およびこの放熱板を用いた半導体装置 | |
JPS58199546A (ja) | 半導体冷却装置 | |
CN110493954A (zh) | 一种qfn器件内埋pcb结构及其制作方法 | |
JPS61115666A (ja) | 熱交換体の製造法 | |
JPS63184397A (ja) | 電子部品放熱装置 | |
US11439043B2 (en) | Multi-device cooling structure having assembly alignment features | |
JP2870506B2 (ja) | バンプ付きワークの半田付け方法 |