JPS5862497A - 放熱器の製造方法 - Google Patents
放熱器の製造方法Info
- Publication number
- JPS5862497A JPS5862497A JP16137881A JP16137881A JPS5862497A JP S5862497 A JPS5862497 A JP S5862497A JP 16137881 A JP16137881 A JP 16137881A JP 16137881 A JP16137881 A JP 16137881A JP S5862497 A JPS5862497 A JP S5862497A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- aluminum alloy
- copper plating
- radiator
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16137881A JPS5862497A (ja) | 1981-10-09 | 1981-10-09 | 放熱器の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16137881A JPS5862497A (ja) | 1981-10-09 | 1981-10-09 | 放熱器の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5862497A true JPS5862497A (ja) | 1983-04-13 |
| JPS6211972B2 JPS6211972B2 (enrdf_load_stackoverflow) | 1987-03-16 |
Family
ID=15733947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16137881A Granted JPS5862497A (ja) | 1981-10-09 | 1981-10-09 | 放熱器の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5862497A (enrdf_load_stackoverflow) |
-
1981
- 1981-10-09 JP JP16137881A patent/JPS5862497A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211972B2 (enrdf_load_stackoverflow) | 1987-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206542684U (zh) | 可连续接合的液冷换热片 | |
| CN112151481B (zh) | 一种表面强化沸腾散热结构 | |
| JP6576182B2 (ja) | 放熱器の製造方法 | |
| EP0539583A1 (en) | Method of producing heat pipe-type semiconductor cooling device | |
| US20240051051A1 (en) | Ultra-thin soldering gasket and preparation method therefor, soldering method, and semiconductor device | |
| US4061263A (en) | Method of bonding a dielectric substrate to a metallic carrier in a printed circuit assembly | |
| JPS5862497A (ja) | 放熱器の製造方法 | |
| US6116495A (en) | Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same | |
| JP4411123B2 (ja) | 放熱板の製造方法 | |
| TWI812442B (zh) | 玻璃通孔載板的填孔方法 | |
| JPS5866634A (ja) | 放熱器の製造方法 | |
| JPH02127970A (ja) | ヒートシンクの製造方法 | |
| JPH1070212A (ja) | パワーモジュール用基板 | |
| JPH025534A (ja) | ペースト塗布用ノズル及びペースト塗布方法 | |
| CN105458430A (zh) | 一种金属板接合体的制造方法 | |
| US20240186210A1 (en) | Electrical and/or electronic device | |
| JPH08288630A (ja) | バンプの形成方法およびバンプ付きチップの実装方法 | |
| JPS55140252A (en) | Header | |
| JP2816218B2 (ja) | ろう付け方法 | |
| CN119764195A (zh) | 一种集成电路键合工艺 | |
| US20200375066A1 (en) | Multi-device cooling structure having assembly alignment features | |
| CN118664005A (zh) | 集成电路微型金属块焊接工艺方法 | |
| JP2024531591A (ja) | ベーパーチャンバおよびその製造方法 | |
| JPS63130265A (ja) | リ−ドフレ−ムへの半田外装方法 | |
| JPS61104646A (ja) | 冷却器の製造方法 |