JPS6211972B2 - - Google Patents
Info
- Publication number
- JPS6211972B2 JPS6211972B2 JP16137881A JP16137881A JPS6211972B2 JP S6211972 B2 JPS6211972 B2 JP S6211972B2 JP 16137881 A JP16137881 A JP 16137881A JP 16137881 A JP16137881 A JP 16137881A JP S6211972 B2 JPS6211972 B2 JP S6211972B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum alloy
- copper plating
- radiator
- manufacturing
- masking agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】
この発明は放熱器の製造方法に係るものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a heat sink.
最近、電子部品の高密度実装により多量の熱を
機器内部で放熱するになつている。これらの放熱
器として従来、ヒート・シンク、放熱板を利用し
てエアーを媒体として機器内部で発生した熱を冷
却していたが、冷却効率が悪く高密度実装に適さ
ない。 Recently, due to the high-density mounting of electronic components, a large amount of heat has become dissipated inside the device. Conventionally, these heat sinks and heat sinks have been used to cool down the heat generated inside devices using air as a medium, but these have poor cooling efficiency and are not suitable for high-density packaging.
この発明はこのような従来の放熱器の問題点の
改善を図るもので、所要形状のアルミニウム合金
製の板に銅めつき、マスキング剤を塗布し、溶解
して所要パターンの冷媒の流路を形成し、冷媒が
漏れないように、ハンダめつきで所要形状の平板
を接合させることを特徴とする放熱効率のよい放
熱器の製造方法を提案するものである。 This invention aims to improve the problems of conventional heat sinks, and involves copper plating an aluminum alloy plate in a desired shape, applying a masking agent, and melting it to form refrigerant flow paths in a desired pattern. The present invention proposes a method for manufacturing a radiator with high heat dissipation efficiency, which is characterized by joining flat plates of a desired shape with solder to prevent refrigerant from leaking.
以下、図によつてこの発明による方法を説明す
る。 The method according to the invention will be explained below with reference to the figures.
第１図はこの発明による製造工程を示したもの
である。 FIG. 1 shows the manufacturing process according to the present invention.
素材にはアルミニウム合金を用い、銅めつきを
行い、所要パターンのマスキング剤を塗布後、不
要部分の銅めつきを溶解し、マスキング剤を剥離
し、ハンダめつきを行う。その後、所要の溶液に
浸漬してアルミニウム合金を溶解し、冷媒の流路
を形成する。ハンダめつきを行つた所要形状のア
ルミニウム合金の平板を載せて加温、圧着する
と、平板がハンダにより接合されて放熱器が製造
される。 The material is aluminum alloy, and after copper plating is applied, a masking agent in the desired pattern is applied, the copper plating on unnecessary parts is dissolved, the masking agent is peeled off, and solder is applied. Thereafter, it is immersed in a required solution to dissolve the aluminum alloy and form a coolant flow path. When a solder-plated aluminum alloy flat plate of a desired shape is placed, heated, and crimped, the flat plates are joined by solder and a radiator is manufactured.
第２図は接合前の状態を示すもので、１は端
部、２は冷賠の流路、３は冷媒の流れを変えるパ
ターンである。 FIG. 2 shows the state before joining, where 1 is the end, 2 is the flow path of the refrigerant, and 3 is the pattern for changing the flow of the refrigerant.
第３図は接合後の第２図のＡ−A′の断面を示
すもので、４は銅めつき属、５はハンダめつき
層、そして冷媒が漏れないようにアルミニウム合
金の板６を接合している。 Figure 3 shows the cross section taken along line A-A' in Figure 2 after joining, where 4 is the copper plating layer, 5 is the solder plating layer, and aluminum alloy plate 6 is joined to prevent refrigerant from leaking. are doing.
この発明は以上のようになつているから、再現
性のよい放熱器が得られ、しかも量産が可能であ
る。しかも冷媒が流路の中を均一に流れるように
なつているため放熱効率のよい放熱器が得られ
る。 Since the present invention is constructed as described above, a heat sink with good reproducibility can be obtained and mass production is possible. Moreover, since the refrigerant flows uniformly through the flow path, a radiator with high heat radiation efficiency can be obtained.
第１図はこの発明による放熱器の製造工程を示
す図、第２図はこの発明によつて得られた放熱器
の接合前の状態を示す図、第３図はこの発明の方
法による放熱器における第２図Ａ−A′面の断面
を示す図で、図中１は端部、２は流路、３は冷媒
の流れを変えるパターン、４は銅めつき層、５は
ハンダめつき層、６はアルミニウム合金の平板で
ある。なお、図中、同一あるいは相当部分には同
一符号を付して示してある。
FIG. 1 is a diagram showing the manufacturing process of a heat sink according to the present invention, FIG. 2 is a diagram showing the state of the heat sink obtained by the present invention before bonding, and FIG. 3 is a diagram showing the heat sink obtained by the method of the present invention. 2 is a cross-sectional view taken along plane A-A' in FIG. , 6 are aluminum alloy flat plates. In the drawings, the same or corresponding parts are denoted by the same reference numerals.
Claims (1)
所要形状のアルミニウム合金製の板に銅めつきを
行い、所要パターンのマスキング剤を塗布し、そ
の後硝酸溶液に浸漬し、上記銅めつき膜の不要部
分を溶解し、上記マスキング剤の剥離を行つた
後、上記不溶解部分の銅めつき膜上にハンダめつ
きを行い、次に所要の溶液に浸漬して所要の深さ
にアルミニウム合金を溶解させ、ハンダめつきを
行つた所要形状のアルミニウム合金の平板を載せ
て加温圧着して接合することを特徴とする放熱器
の製造方法。1. In a method for manufacturing a radiator using a refrigerant,
Copper plating is performed on an aluminum alloy plate of the desired shape, a masking agent is applied in the desired pattern, and then immersed in a nitric acid solution to dissolve unnecessary parts of the copper plating film, and the masking agent is removed. After soldering, solder is applied on the undissolved copper plating film, and then the aluminum alloy is immersed in the required solution to dissolve the aluminum alloy to the required depth. A method for manufacturing a radiator, characterized by placing a flat plate of alloy on it and joining it by heat-pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16137881A JPS5862497A (en) | 1981-10-09 | 1981-10-09 | Manufacture of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16137881A JPS5862497A (en) | 1981-10-09 | 1981-10-09 | Manufacture of radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5862497A JPS5862497A (en) | 1983-04-13 |
| JPS6211972B2 true JPS6211972B2 (en) | 1987-03-16 |
Family
ID=15733947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16137881A Granted JPS5862497A (en) | 1981-10-09 | 1981-10-09 | Manufacture of radiator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5862497A (en) |
-
1981
- 1981-10-09 JP JP16137881A patent/JPS5862497A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5862497A (en) | 1983-04-13 |
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