JPS62118601A - Microwave integrated circuit - Google Patents

Microwave integrated circuit

Info

Publication number
JPS62118601A
JPS62118601A JP60259975A JP25997585A JPS62118601A JP S62118601 A JPS62118601 A JP S62118601A JP 60259975 A JP60259975 A JP 60259975A JP 25997585 A JP25997585 A JP 25997585A JP S62118601 A JPS62118601 A JP S62118601A
Authority
JP
Japan
Prior art keywords
integrated circuit
microwave integrated
terminals
carrier
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60259975A
Other languages
Japanese (ja)
Other versions
JPH0824241B2 (en
Inventor
Shigetaka Aramaki
荒巻 成孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60259975A priority Critical patent/JPH0824241B2/en
Publication of JPS62118601A publication Critical patent/JPS62118601A/en
Publication of JPH0824241B2 publication Critical patent/JPH0824241B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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  • Waveguides (AREA)

Abstract

PURPOSE:To eliminate the need for the removal of a through-capacitor and electronic component terminals and to mount a microwave integrated circuit to a prescribed position of a case for product immediately in removing the microwave integrated circuit finished separatedly for the adjustment and check in a case for test by providing the 1st side wall for connecting input/output terminals and the 2nd side wall for connecting electronic components except said terminals separately among the side walls each made of a metallic body provided at the side face of a combined body. CONSTITUTION:A metal incorporated with a carrier 17 made of a metal and fixed to the rear face of a dielectric plate 21 is provided to the side face of a microwave integrated circuit 1 not being the input/output connection section of a microwave signal in the carrier 17 in a direction orthogonal to the dielectric plate, or a metal other than the carrier is fixed to the carrier, and through- capacitors 7, 8, electric components and terminals 15, 16 are arranged to the metallic plate 18. The microwave integrated circuit finished in the adjustment and check in the test use casing is moved to a prescribed position of the case for product without removing the through-capacitors, electronic components and terminals.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はマイクロ波集積回路に係シ、特にキャリア方式
によるマイクロ波集積回路の構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a microwave integrated circuit, and more particularly to the structure of a carrier type microwave integrated circuit.

〔従来の技術〕[Conventional technology]

近年、マイクロ波帯以上の周波数で使用され石デバイス
などには誘電体板の上面に導体層及び薄膜抵抗等を設け
、さらにトランジスタやダイオード、コンデンサなどの
個別の部品を積載して、回路を構成するマイクロ波集積
回路が多く用いられている。
In recent years, in stone devices used at frequencies above the microwave band, a conductor layer, thin film resistor, etc. are provided on the top surface of a dielectric plate, and individual components such as transistors, diodes, and capacitors are mounted to form a circuit. Microwave integrated circuits are widely used.

このマイクロ波集積回路の構造として、誘電体板の裏面
の導体面に金属体を半田等で固着するキャリア方式が多
く使用されている。
As the structure of this microwave integrated circuit, a carrier method is often used in which a metal body is fixed to the conductor surface on the back side of a dielectric plate by soldering or the like.

この金属体には誘電体板と線膨張係数がほぼ等しい金属
が使用される。例えば、誘電体板として線膨張係数4乃
至6X10  am/℃のアルミナを使用する場合、金
属体には線膨張係数4乃至5×10  cm/℃のコバ
ー、あるいは3.7乃至5.3×to  am/℃のモ
リブデン、その他が選ばれる。
For this metal body, a metal whose linear expansion coefficient is approximately the same as that of the dielectric plate is used. For example, if alumina with a linear expansion coefficient of 4 to 6 x 10 am/°C is used as the dielectric plate, the metal body may be made of covar with a linear expansion coefficient of 4 to 5 x 10 cm/°C, or 3.7 to 5.3 x to am/°C molybdenum, and others are selected.

このキャリア方式によるマイクロ波集積回路は、組立後
、個別に調整及び検査をするため、まず別の金属よりな
る試験用筐体に納められる。この試験用筐体は、マイク
ロ波信号の外部への漏れを防ぐ目的で四方を側壁で囲み
、また側壁の一部にはマイクロ波集積回路上のトランジ
スタあるいはダイオードにバイアスをかけるための貫通
形コンデンサが取シ付けられ、貫通形コンデンサにバイ
アス用の個別部品よシなる電気部品例えば抵抗、コンデ
ンサ、コイル等が接続される。
After assembly, microwave integrated circuits using this carrier method are first placed in a test case made of another metal in order to be individually adjusted and inspected. This test case is surrounded by side walls on all sides to prevent microwave signals from leaking to the outside, and part of the side walls are equipped with feed-through capacitors to bias the transistors or diodes on the microwave integrated circuit. is attached to the feedthrough capacitor, and electrical components such as individual components for biasing, such as resistors, capacitors, coils, etc., are connected to the feedthrough capacitor.

試験用筐体によシ別個に調整及び検査を終えたマイクロ
波集積回路は、試験用筐体よシマイクロ波集積回路、貫
通形コンデンサ、電気部品及び端子が取りはすされ、次
に製品用筐体の所定の位置に移しかえられる。
The microwave integrated circuit, which has been individually adjusted and inspected, is placed in a test casing, and the microwave integrated circuit, feedthrough capacitor, electrical components, and terminals are removed, and then placed in a product. It is moved to a predetermined position in the housing.

第4図は一般のマイクロ波集積回路として構成される1
段形のGaAsFET 増幅器の回路図であ同図におい
て、マイクロ波集積回路本体1は、入力回路2及び出力
回路3と、上に積載されているGaAs FET 4と
、入力回路2の中の入力端子5と、出力回路3の中の出
力端子6とを有する。貫通形コンデンサ9及び10は、
GaAs FET 4のゲートにバイアスをかけるだめ
の分圧抵抗で、端子15の負電圧が分圧される。抵抗1
1はGaAs FET 4のドレインにバイアスをかけ
るため、コンデンサ12は発振防止のために必要で、端
子16に正電圧が印加される。線材13及び14は、マ
イクロ波集積回路本体1上のGaAa FEI:T 4
のゲートあるいはドレインと貫通形コンデンサ7.8と
を結ぶために必要である。
Figure 4 shows 1 configured as a general microwave integrated circuit.
This is a circuit diagram of a stepped GaAsFET amplifier. In the same figure, a microwave integrated circuit main body 1 includes an input circuit 2, an output circuit 3, a GaAs FET 4 mounted above, and an input terminal in the input circuit 2. 5 and an output terminal 6 in the output circuit 3. The feedthrough capacitors 9 and 10 are
The negative voltage at the terminal 15 is divided by a voltage dividing resistor that biases the gate of the GaAs FET 4. resistance 1
1 biases the drain of the GaAs FET 4, the capacitor 12 is necessary to prevent oscillation, and a positive voltage is applied to the terminal 16. The wires 13 and 14 are GaAa FEI:T 4 on the microwave integrated circuit body 1.
It is necessary to connect the gate or drain of the feedthrough capacitor 7.8 to the feedthrough capacitor 7.8.

さて、第5図は第4図の回路を従来のマイクロ波集積回
路で構成した斜視図である。同図において、第4図の回
路の符号に相当するものは同一番号を付しである。この
他に、マイクロ波集積回路本体1を構成する誘電体板2
1と、この誘電体板21の裏面に固着されている金属よ
シなるキャリア51が示されている。従来のマイクロ波
集積回路の場合、マイクロ波信号の漏れを阻止する貫通
形コンデンサ、バイアス用抵抗、コンデンサは、マイク
ロ波集積回路本体とは一体となっていないので、このま
までは増幅器の回路として完全ではない。
Now, FIG. 5 is a perspective view of the circuit shown in FIG. 4 constructed from a conventional microwave integrated circuit. In the same figure, parts corresponding to the reference numerals of the circuits in FIG. 4 are given the same numbers. In addition, a dielectric plate 2 constituting the microwave integrated circuit main body 1
1 and a carrier 51 made of metal fixed to the back surface of the dielectric plate 21. In the case of conventional microwave integrated circuits, the feedthrough capacitors, bias resistors, and capacitors that prevent leakage of microwave signals are not integrated into the main body of the microwave integrated circuit, so they cannot be used as a complete amplifier circuit as is. do not have.

第6図は第5図の従来のマイクロ波集積回路を調整及び
検査のために試験用筐体に実装した場合の一部切裁斜視
図である。同図において、第4図の回路の符号に相当す
るものは同一番号を付しである。この他に、金属よシな
る試験用筐体(一部切裁)61と、金属の試験用蓋(一
部切裁)62と、入力コネクタ63とが示されている。
FIG. 6 is a partially cutaway perspective view of the conventional microwave integrated circuit of FIG. 5 mounted in a test case for adjustment and inspection. In the same figure, parts corresponding to the reference numerals of the circuits in FIG. 4 are given the same numbers. In addition, a test case made of metal (partially cut) 61, a metal test lid (partly cut) 62, and an input connector 63 are shown.

試験用筐体61は、マイクロ波信号の外部への漏れを防
ぐため、四方を側壁で囲んでいる。また、マイクロ波集
積回路本体1の調整及び検査をするためKは、GaAa
 FET 4にバイアスをかける必要があり、試験用筐
体61の入出力コネクタが取シつかない面に1貫通形コ
ンデンサ7.8が取り付けられ、抵抗9.10,11、
コンデンサ12及び端子15゜16が配置され、配線さ
れる。この状態で、増幅器としての回路が完全になシ、
調整及び検査が可能になる。
The test case 61 is surrounded by side walls on all sides to prevent microwave signals from leaking to the outside. In addition, in order to adjust and inspect the microwave integrated circuit main body 1, K is a GaAa
It is necessary to apply a bias to FET 4, so a single feedthrough capacitor 7.8 is attached to the side of the test case 61 where the input/output connector cannot be attached, and resistors 9, 10, 11,
A capacitor 12 and terminals 15 and 16 are placed and wired. In this state, the amplifier circuit is completely
Adjustment and inspection become possible.

第7図は第6図の試験用筺体内のものを従来のマイクロ
波集積回路として製品用筐体に実装した場合の一部切裁
斜視図である。同図において、第4図の回路の符号に相
当するものは同一番号を付しである。この他に、製品用
筐体(一部切裁)71と、製品用蓋(一部切凌)72と
、隣接するマイクロ波集積回路本体73.74例えばア
イソレータや増幅器、ミキサー等が示さnている。さら
に、さらに、製品用筐体71に設けられた側壁75は、
マイクロ波信号の外部への@九を防ぐ。ここに、貫通形
コンデンサ7、−8が取り付けられ、抵抗9゜10.1
1、コンデンサ12、及び端子15.16が配置され、
配線される。
FIG. 7 is a partially cutaway perspective view of the case where the test case of FIG. 6 is mounted as a conventional microwave integrated circuit in a product case. In the same figure, parts corresponding to the reference numerals of the circuits in FIG. 4 are given the same numbers. In addition, a product casing (partially cut) 71, a product lid (partially cut) 72, and an adjacent microwave integrated circuit main body 73, 74 such as an isolator, an amplifier, a mixer, etc. are shown. There is. Furthermore, the side wall 75 provided in the product casing 71 is
Prevent microwave signals from going outside. Here, feedthrough capacitors 7 and -8 are attached, and a resistance of 9°10.1
1, a capacitor 12, and terminals 15 and 16 are arranged,
Wired.

しかしながら、第6図の試験用筐体61からマイクロ波
集積回路本体1を第7図の製品用筐体71に移しかえる
ためには、試験用筐体61より貫通形コンデンサ7.8
、抵抗9,10,11、コンデンサ12及び端子15.
16をばらばらにして取シはすし、再度製品筐体71に
組立てるという不都合がある。
However, in order to transfer the microwave integrated circuit main body 1 from the test case 61 in FIG. 6 to the product case 71 in FIG.
, resistors 9, 10, 11, capacitor 12 and terminal 15.
There is an inconvenience in that the product 16 must be disassembled, removed, and then reassembled into the product casing 71.

〔発明が解決しようとする間頑点〕 前述した従来のマイクロ波集積回路の構造では、試験用
筐体によシ調整及び検査を終えたマイクロ波集積回路は
試験用筐体よシマイクロ波集積回路、貫通形コンデンサ
、電気部品及び端子を4!シ外し、製品用筐体の所定の
位置に移しかえるという作業を特徴とする特に貫通形コ
ンデンサ及び電気部品は一度配線したものをばらばらに
して取りはずし、また製品用筐体において再度組立てる
という作業上の不都合のみならず、信頼上の不都合を生
ずるという欠点がある。
[The problem that the invention is trying to solve] In the structure of the conventional microwave integrated circuit described above, the microwave integrated circuit after adjustment and inspection is placed in the test case. 4 circuits, feedthrough capacitors, electrical components and terminals! In particular, feed-through capacitors and electrical components are characterized by the work of removing the wires and moving them to the specified position in the product casing. This method has the drawback of not only being inconvenient but also causing problems with respect to reliability.

本発明の目的は、前記欠点が解決され、試験用筐体で個
別に調整及び検査を終えたマイクロ波集積回路を取りは
ずす時、貫通形コンデンサや電気部品端子等を取シ外す
必要がなく、直ちに製品用筐体の所定の位置に移すこと
が可能なキャリア方式によるマイクロ波集積回路を提供
することにある。
An object of the present invention is to solve the above-mentioned drawbacks, and to eliminate the need to remove feedthrough capacitors, electrical component terminals, etc. when removing a microwave integrated circuit that has been individually adjusted and inspected in a test case. An object of the present invention is to provide a carrier-based microwave integrated circuit that can be moved to a predetermined position in a product casing.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

本発明の構成は、金属体からなるキャリアと誘電体との
重ね合せ体を備えたマイクロ波集積回路において、前記
重ね合せ体の側面に各々設けた金属体からなる側壁の中
で、入出力端子を接続する第1の側壁と、前記端子を除
く電子部品を接続する第2の側壁とを別々に設けたこと
を特徴とする。
According to the configuration of the present invention, in a microwave integrated circuit including a stacked body of a carrier made of a metal body and a dielectric body, input/output terminals are provided in side walls made of a metal body provided on the sides of the stacked body. The device is characterized in that a first side wall that connects the terminals and a second side wall that connects electronic components other than the terminals are provided separately.

〔実施例〕〔Example〕

次に本発明を図面によシ詳細に説明する。 Next, the present invention will be explained in detail with reference to the drawings.

第1図は本発明の実施例のマイクロ波集積回路で、第4
図の回路を構成した斜視図である。同図において、第4
図の回路の符号に相当するものは同一番号を付しである
。この他に、マイクロ波集積回路本体1を構成する誘電
体板21と、誘電体板21の裏面に固着されている金属
よシなるキャリア17と、誘電体板21と直角の方向に
、キャリア17と一体で設けられた、あるいはキャリア
17とは別の金属をキャリア17に固定した金属板18
とが示されている。この金属板18には、貫通形コンデ
ンサ7.8が取シ付けられ、抵抗9゜10.11、コン
デンサ12、端子15.16が配置され、配線される。
FIG. 1 shows a microwave integrated circuit according to an embodiment of the present invention.
FIG. 2 is a perspective view configuring the circuit shown in the figure. In the same figure, the fourth
Components corresponding to the reference numerals of the circuits in the figure are given the same numbers. In addition, a dielectric plate 21 constituting the microwave integrated circuit main body 1, a carrier 17 made of metal fixed to the back surface of the dielectric plate 21, and a carrier 17 in a direction perpendicular to the dielectric plate 21. A metal plate 18 that is provided integrally with the carrier 17 or has a metal different from the carrier 17 fixed to the carrier 17.
is shown. A feedthrough capacitor 7.8 is attached to this metal plate 18, and a resistor 9.10.11, a capacitor 12, and terminals 15.16 are arranged and wired.

第2図は第1図の本発明の実施例のマイクロ波集積回路
を調整及び検査のために試験用筐体に実装した場合の一
部切裁斜視図である。同図において、第4図の回路の符
号に相当するものは同一番号を付しである。第2図で、
金属よシなる試験用筐体(一部切裁)21と、金属の試
験用蓋(一部切裁)22と、入力コネクタ23とが示さ
れている。マイクロ波信号の外部への漏れを防ぐために
、試験用筐体21の三方の側壁と、マイクロ波集積回路
本体1の金属板18とが、その役目を果す。
FIG. 2 is a partially cutaway perspective view of the microwave integrated circuit of the embodiment of the present invention shown in FIG. 1 mounted in a test case for adjustment and inspection. In the same figure, parts corresponding to the reference numerals of the circuits in FIG. 4 are given the same numbers. In Figure 2,
A test case made of metal (partially cut) 21, a test lid made of metal (partly cut) 22, and an input connector 23 are shown. In order to prevent leakage of the microwave signal to the outside, the three side walls of the test case 21 and the metal plate 18 of the microwave integrated circuit body 1 play the role.

また、金属板18には、第1図に示す如く、貫通形コン
デンサ7.8、抵抗9,10,11、コンデンサ12、
及び端子15.16が既に取り付けられ、配線されてい
るため、新たに配線工事を行なう必要はない。
Further, as shown in FIG. 1, the metal plate 18 includes a feedthrough capacitor 7.8, resistors 9, 10, 11, a capacitor 12,
Since the terminals 15 and 16 have already been installed and wired, there is no need to perform new wiring work.

第3図は第1図の本発明のマイクロ波集積回路を製品用
筐体に実装した場合の一部切裁斜視図である。同図にお
いて、第4図の回路の符号に相当するものは同一番号を
付しである。この他に、製品用筐体(一部切裁)31と
、製品用蓋(一部切裁)32と、33及び34は隣接す
るマイクロ波集積回路本体33.34例えばアイソレー
タや増幅器、ミキサー等とが示されている。第2図の試
験用筺体21からマイクロ波集積回路本体1を製品用筐
体31に移しかえる時は、貫通形コンデンサ7.8、抵
抗9,10,11、コンデンサ12及び端子15,16
を取)はずすことなく、これらと共にマイクロ波集積回
路本体lをそのまま取シはずして、移すだけで良い。
FIG. 3 is a partially cutaway perspective view of the microwave integrated circuit of the present invention shown in FIG. 1 mounted in a product casing. In the same figure, parts corresponding to the reference numerals of the circuits in FIG. 4 are given the same numbers. In addition, a product casing (partially cut) 31, a product lid (partially cut) 32, and adjacent microwave integrated circuit bodies 33 and 34, such as isolators, amplifiers, mixers, etc. is shown. When transferring the microwave integrated circuit main body 1 from the test case 21 shown in FIG.
All you have to do is remove the microwave integrated circuit main body l along with these components and move it.

このように、本実施例では、誘電体板の裏面に固着され
ている金属よりな゛るキャリアに、マイクロ波集積回路
のマイクロ波信号の入出力接続部とならない側面に、誘
電体板と直角の方向にキャリアと一体の金属を設けるか
、あるhはキャリアとは別の金属をキャリアに固定して
、金属板に貫通形コンデンサや電気部品及び端子等を配
置する構造にすることKより、試験用筐体で調整及び検
査を終えたマイクロ派集積回路を貫通形コンデンサや電
気部品及び端子等を取シはずすことなく、製品用筐体の
所定の位置に移すことができ、作業上及び信頼性上非常
に有効である。なお、本発明では増幅器の場合を例とし
たが、能動素子にバイアスをかけるデバイス例えば発振
器や逓倍器、ミ即サー、減衰器などのマイクロ波集積回
路にも非常に有効である。
As described above, in this embodiment, a carrier made of metal fixed to the back surface of a dielectric plate is provided with a wire at right angles to the dielectric plate on the side surface that does not become the input/output connection part of the microwave signal of the microwave integrated circuit. From K, a metal plate integrated with the carrier should be provided in the direction of , or a metal separate from the carrier should be fixed to the carrier, and the feedthrough capacitor, electrical components, terminals, etc. should be arranged on the metal plate. Micro integrated circuits that have been adjusted and inspected in the test casing can be moved to the specified position in the product casing without removing feedthrough capacitors, electrical components, terminals, etc., improving workability and reliability. It is very effective in terms of gender. Although the present invention uses an amplifier as an example, the present invention is also very effective for devices that apply bias to active elements, such as microwave integrated circuits such as oscillators, multipliers, amplifiers, and attenuators.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明によれば、作業能率が向上
し、信頼性も向上するという効果が得られる。
As explained above, according to the present invention, it is possible to obtain the effects of improving work efficiency and improving reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例のマイクロ波集積回路の斜視図
、第2図は第1図のマイクロ波集積回路を試験用筐体に
実装した場合の一部切裁斜視図、第3図は第1図のマイ
クロ波集積回路を製品用筐体に実装した場合の一部切載
斜視図、第4図は一般のマイクロ波集積回路を構成する
1段形GaAsFETの増幅器の回路図、第5図は従来
のスイクロ波集積回路の斜視図、第6図は従来のマイク
ロ波集積回路を試験用筐体に実装した場合の一部切裁斜
視図、第7図は従来のマイクロ波集積回路を製品用筐体
に実装した場合の一部切截斜視図である。 1・・・・・・マイクロ波集積回路本体、2・・・・・
・入力回路、3・・・・・・出力回路、4・・・・・・
GaAsFET、5・・・・・・入力端子、6・・・・
・・出力端子、7,8・・・・・・貫通形コンデンサ、
9,10.11・・・・・・抵抗、12・・・・・・コ
ンデンサ、13.14・・・・・・線材、15・・・・
−・負電圧端子、16・・・・・・正電圧端子、17.
51・・・・・・キャリア、18・・・・・・金属板、
21・・・・・・誘電体板、31,61・・・・・・試
験用筐体、22.62・・・・・・試験用蓋、31,7
1・・・・・・製品用筐体、32.72・・・・・・製
品用蓋、33,34゜73.74・・・−・・隣接する
マイクロ波集積回路本体。 イ 41!! −第 71!T 手続補正書く自発) 61.6.27 昭和  年  月  日 1、事件の表示 昭和60年特許願第259975号2
、発明の名称 マイクロ波集積回路 3、補正をする者 事件との関係       出 願 人東京都港区芝五
丁目33番1号 (423)  日本電気株式会社 代表者 関本忠弘 4、代理人 〒108東京都港区芝五丁目37番8号住友三田ビル 日本電気株式会社内 (連絡先 日本電気株式会社 特許部)5、補正の対象 明細書の「特許請求の範囲」、「発明の詳細な説明」の
各欄。 6、補正の内容 (1)明細書の特許請求の範囲を別紙のとおり補正゛る
。 (2)明細書第7頁第19行目[前に重ね合せ体」]降
同第8頁第2行目「設けた」までを次文のと。 り補正する。
Fig. 1 is a perspective view of a microwave integrated circuit according to an embodiment of the present invention, Fig. 2 is a partially cutaway perspective view of the microwave integrated circuit of Fig. 1 mounted in a test case, and Fig. 3 1 is a partially cutaway perspective view of the microwave integrated circuit shown in FIG. 1 mounted in a product casing, FIG. 4 is a circuit diagram of a single-stage GaAsFET amplifier that constitutes a general microwave integrated circuit, and FIG. Figure 5 is a perspective view of a conventional microwave integrated circuit, Figure 6 is a partially cutaway perspective view of a conventional microwave integrated circuit mounted in a test case, and Figure 7 is a conventional microwave integrated circuit. FIG. 2 is a partially cutaway perspective view of the product mounted in a product casing. 1...Microwave integrated circuit body, 2...
・Input circuit, 3... Output circuit, 4...
GaAsFET, 5... Input terminal, 6...
... Output terminal, 7, 8... Feedthrough capacitor,
9,10.11...Resistance, 12...Capacitor, 13.14...Wire, 15...
- Negative voltage terminal, 16...Positive voltage terminal, 17.
51...Carrier, 18...Metal plate,
21...Dielectric plate, 31,61...Test casing, 22.62...Test lid, 31,7
1... Product casing, 32.72... Product lid, 33, 34° 73.74... Adjacent microwave integrated circuit body. I 41! ! -No. 71! T Voluntary amendment to the procedure) 61.6.27 Showa year, month, day 1, case description 1985 patent application No. 259975 2
, Title of the invention: Microwave integrated circuit 3, Relationship to the person making the amendment: Applicant: 5-33-1 Shiba, Minato-ku, Tokyo (423) NEC Corporation Representative: Tadahiro Sekimoto 4, Agent: 108 Tokyo 5, Sumitomo Sanda Building, NEC Corporation, 37-8 Shiba 5-chome, Miyakominato-ku (contact information: Patent Department, NEC Corporation) 5, "Claims" and "Detailed Description of the Invention" of the specification to be amended. Each column. 6. Contents of amendment (1) The claims of the specification will be amended as shown in the attached sheet. (2) Page 7, line 19 of the specification [superimposed body in front]] Page 8, line 2 of the specification, up to ``provided'' are as in the next sentence. Correct.

Claims (2)

【特許請求の範囲】[Claims] (1)金属体からなるキャリアと誘電体板との重ね合せ
体を備えたマイクロ波集積回路において、前記重ね合せ
体の側面に各々設けた金属体からなる側壁の中で、入出
力端子を接続する第1の側壁と、前記端子を除く電子部
品を接続する第2の側壁とを別々に設けたことを特徴と
するマイクロ波集積回路。
(1) In a microwave integrated circuit equipped with a stacked body of a carrier made of a metal body and a dielectric plate, input/output terminals are connected in side walls made of metal bodies provided on the sides of the stacked body. A microwave integrated circuit characterized in that a first side wall for connecting electronic components other than the terminals and a second side wall for connecting electronic components other than the terminals are separately provided.
(2)キャリアと第2の側壁とが、一体の金属体からな
ることを特徴とする特許請求の範囲第1項記載のマイク
ロ波集積回路。
(2) The microwave integrated circuit according to claim 1, wherein the carrier and the second side wall are made of an integral metal body.
JP60259975A 1985-11-19 1985-11-19 Microwave integrated circuit device Expired - Lifetime JPH0824241B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60259975A JPH0824241B2 (en) 1985-11-19 1985-11-19 Microwave integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60259975A JPH0824241B2 (en) 1985-11-19 1985-11-19 Microwave integrated circuit device

Publications (2)

Publication Number Publication Date
JPS62118601A true JPS62118601A (en) 1987-05-30
JPH0824241B2 JPH0824241B2 (en) 1996-03-06

Family

ID=17341527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60259975A Expired - Lifetime JPH0824241B2 (en) 1985-11-19 1985-11-19 Microwave integrated circuit device

Country Status (1)

Country Link
JP (1) JPH0824241B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619098U (en) * 1979-07-20 1981-02-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619098U (en) * 1979-07-20 1981-02-19

Also Published As

Publication number Publication date
JPH0824241B2 (en) 1996-03-06

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