JPS62118550A - 集積回路の冷却構造 - Google Patents
集積回路の冷却構造Info
- Publication number
- JPS62118550A JPS62118550A JP25757085A JP25757085A JPS62118550A JP S62118550 A JPS62118550 A JP S62118550A JP 25757085 A JP25757085 A JP 25757085A JP 25757085 A JP25757085 A JP 25757085A JP S62118550 A JPS62118550 A JP S62118550A
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- integrated circuit
- flat
- heat dissipation
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 35
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 21
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25757085A JPS62118550A (ja) | 1985-11-19 | 1985-11-19 | 集積回路の冷却構造 |
| US06/931,847 US4854377A (en) | 1985-11-19 | 1986-11-18 | Liquid cooling system for integrated circuit chips |
| EP86308975A EP0225108B1 (en) | 1985-11-19 | 1986-11-18 | Liquid cooling system for integrated circuit chips |
| DE8686308975T DE3666644D1 (en) | 1985-11-19 | 1986-11-18 | Liquid cooling system for integrated circuit chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25757085A JPS62118550A (ja) | 1985-11-19 | 1985-11-19 | 集積回路の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118550A true JPS62118550A (ja) | 1987-05-29 |
| JPH0461504B2 JPH0461504B2 (enrdf_load_stackoverflow) | 1992-10-01 |
Family
ID=17308105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25757085A Granted JPS62118550A (ja) | 1985-11-19 | 1985-11-19 | 集積回路の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118550A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6046498A (en) * | 1997-06-30 | 2000-04-04 | Nec Corporation | Device having a heat sink for cooling an integrated circuit |
-
1985
- 1985-11-19 JP JP25757085A patent/JPS62118550A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6046498A (en) * | 1997-06-30 | 2000-04-04 | Nec Corporation | Device having a heat sink for cooling an integrated circuit |
| US6251709B1 (en) | 1997-06-30 | 2001-06-26 | Nec Corporation | Method of manufacturing a cooling structure of a multichip module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0461504B2 (enrdf_load_stackoverflow) | 1992-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4884168A (en) | Cooling plate with interboard connector apertures for circuit board assemblies | |
| US4854377A (en) | Liquid cooling system for integrated circuit chips | |
| US5513070A (en) | Dissipation of heat through keyboard using a heat pipe | |
| CA1228173A (en) | Cooling system for electronic circuit device | |
| EP0241290B1 (en) | Cooling system for electronic components | |
| JPH05145208A (ja) | 回路ユニツト | |
| JP2950472B2 (ja) | 電子集積回路パッケージのメタライゼーション構造を形成する方法 | |
| JPH0680756B2 (ja) | 液冷集積回路パツケ−ジ | |
| JP2005522017A (ja) | ウェーブはんだ付け法によるマザーボードチップセットのヒートシンクの取付け | |
| EP0932330B1 (en) | Electronic apparatus | |
| JPH0244776B2 (enrdf_load_stackoverflow) | ||
| JPS62118550A (ja) | 集積回路の冷却構造 | |
| JPS61148706A (ja) | フレキシブル・ケーブルを有するディスプレイ組立体 | |
| JP2504059B2 (ja) | 電子回路パッケ−ジの冷却構造 | |
| JP2790044B2 (ja) | 電力増幅器の放熱実装構造 | |
| JP3936485B2 (ja) | プリント配線基板ユニットおよび基板用矯正部品 | |
| CN115001255A (zh) | 功率模块、电源控制器、电动车辆及功率模块的组装方法 | |
| JPH0442926Y2 (enrdf_load_stackoverflow) | ||
| JPS62118552A (ja) | 集積回路の冷却構造 | |
| JPH0461505B2 (enrdf_load_stackoverflow) | ||
| CN220659482U (zh) | 玻璃基线路板的夹具及系统 | |
| CN217392824U (zh) | 一种有效消除裂缝的涂胶工装 | |
| KR930004251B1 (ko) | 전력 반도체 패키지 | |
| JPH03250794A (ja) | 半導体装置 | |
| JPS6177349A (ja) | 混成集積回路の冷却方法 |