JPS62116799A - めっき装置の自動スクリ−ン装置 - Google Patents

めっき装置の自動スクリ−ン装置

Info

Publication number
JPS62116799A
JPS62116799A JP25716385A JP25716385A JPS62116799A JP S62116799 A JPS62116799 A JP S62116799A JP 25716385 A JP25716385 A JP 25716385A JP 25716385 A JP25716385 A JP 25716385A JP S62116799 A JPS62116799 A JP S62116799A
Authority
JP
Japan
Prior art keywords
width
screen plate
plate
movable screen
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25716385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0456119B2 (enExample
Inventor
Yoshizo Nakagawa
中川　佳三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP25716385A priority Critical patent/JPS62116799A/ja
Publication of JPS62116799A publication Critical patent/JPS62116799A/ja
Publication of JPH0456119B2 publication Critical patent/JPH0456119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP25716385A 1985-11-15 1985-11-15 めっき装置の自動スクリ−ン装置 Granted JPS62116799A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25716385A JPS62116799A (ja) 1985-11-15 1985-11-15 めっき装置の自動スクリ−ン装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25716385A JPS62116799A (ja) 1985-11-15 1985-11-15 めっき装置の自動スクリ−ン装置

Publications (2)

Publication Number Publication Date
JPS62116799A true JPS62116799A (ja) 1987-05-28
JPH0456119B2 JPH0456119B2 (enExample) 1992-09-07

Family

ID=17302571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25716385A Granted JPS62116799A (ja) 1985-11-15 1985-11-15 めっき装置の自動スクリ−ン装置

Country Status (1)

Country Link
JP (1) JPS62116799A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180074U (enExample) * 1986-04-18 1987-11-16
JP2019056164A (ja) * 2017-09-22 2019-04-11 株式会社荏原製作所 めっき装置
JP2019218618A (ja) * 2018-06-21 2019-12-26 株式会社荏原製作所 めっき装置、及びめっき方法
KR102470673B1 (ko) * 2021-05-20 2022-11-25 (주)네오피엠씨 애노드를 덮는 차폐판의 자동 이동장치

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180074U (enExample) * 1986-04-18 1987-11-16
JP2019056164A (ja) * 2017-09-22 2019-04-11 株式会社荏原製作所 めっき装置
US11332838B2 (en) 2017-09-22 2022-05-17 Ebara Corporation Plating apparatus
JP2019218618A (ja) * 2018-06-21 2019-12-26 株式会社荏原製作所 めっき装置、及びめっき方法
KR102470673B1 (ko) * 2021-05-20 2022-11-25 (주)네오피엠씨 애노드를 덮는 차폐판의 자동 이동장치

Also Published As

Publication number Publication date
JPH0456119B2 (enExample) 1992-09-07

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