JPS62113482A - Photovoltaic device - Google Patents

Photovoltaic device

Info

Publication number
JPS62113482A
JPS62113482A JP60254576A JP25457685A JPS62113482A JP S62113482 A JPS62113482 A JP S62113482A JP 60254576 A JP60254576 A JP 60254576A JP 25457685 A JP25457685 A JP 25457685A JP S62113482 A JPS62113482 A JP S62113482A
Authority
JP
Japan
Prior art keywords
type
amorphous silicon
silicon carbide
semiconductor layer
amorphous semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60254576A
Other languages
Japanese (ja)
Inventor
Satoo Yanagiura
聡生 柳浦
Yuichi Honda
本多 友一
Yasunori Suzuki
康則 鈴木
Takashi Shibuya
澁谷 尚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP60254576A priority Critical patent/JPS62113482A/en
Publication of JPS62113482A publication Critical patent/JPS62113482A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
    • H01L31/204Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table including AIVBIV alloys, e.g. SiGe, SiC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/075Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PIN type, e.g. amorphous silicon PIN solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)

Abstract

PURPOSE:To decompose an amorphous silicon carbide layer by small power, to reduce the diffusion of an impurity from other layers remarkably and to improve film quality by forming the amorphous silicon carbide layer, using (CvHw)xSiYHz as a raw material gas. CONSTITUTION:A transparent electrode 2, P-type, I-type and N-type each amorphous semiconductor layer 3, 4, 5 and a back electrode 6 are laminated and shaped onto the main surface of a light-transmitting insulating substrate 1 in the order. The P-type amorphous semiconductor layer 3 is shaped by employing amorphous silicon carbide and the I-type and N-type respective amorphous semiconductor layer 4, 5 by using amorphous silicon respectively. The P-type amorphous semiconductor layer 3 is formed in such a manner that (C2H5)3 SiH+B2H6 as a raw material gas is decomposed and amorphous silicon carbide is evaporated and formed onto the surface of the substrate S. A substance shown in general formula (CvHw)xSiYHz (v-z represent arbitrary number containing zero) as the raw material gas may be used as the amorphous silicon carbide layer. Accordingly, the diffusion of an impurity can be reduced largely, thus improving film quality.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は非晶質シリコンカーバイド層を用いた光起電力
装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photovoltaic device using an amorphous silicon carbide layer.

〔従来技術〕[Prior art]

一般に太陽電池、光センサ、TPT等には非晶質シリコ
ンが広く用いられている。例えば太陽電池についてみる
と、ガラス等の透光性絶縁基板の主面に透明電極を形成
し、この透ryJ電極上に伝導型がp型、i型、n型の
各非晶質半導体からなる光活性層を形成し、更にこの表
面に裏面電極を形成して構成され、透光性絶縁基板、透
明電極を通して非晶質半導体層内に光を導入し、生起せ
しめた光起電力を透明電極、裏面電極を通じて外部に取
り出すようになっている。
Generally, amorphous silicon is widely used for solar cells, optical sensors, TPT, etc. For example, in solar cells, a transparent electrode is formed on the main surface of a transparent insulating substrate such as glass, and amorphous semiconductors of p-type, i-type, and n-type conductivity are formed on this transparent RYJ electrode. A photoactive layer is formed, and a back electrode is formed on the surface of the photoactive layer. , and is taken out to the outside through the back electrode.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで前記非晶質半導体層における光入射側の非晶質
半導体層である例えばp型非晶質半導体層はこれに対す
る光の採り込みを容易にするためのワイドバンドギャッ
プ材料として従来非晶質シリコンカーバイドが広く使用
されているが、その非晶質シリコンカーバイドの形成の
ための原料ガスとしては通常Si H4,5i2116
,5iJs等と、C11,。
By the way, the amorphous semiconductor layer on the light incident side of the amorphous semiconductor layer, for example, the p-type amorphous semiconductor layer, is conventionally made of amorphous silicon as a wide bandgap material to facilitate the absorption of light into the p-type amorphous semiconductor layer. Although carbide is widely used, the source gas for the formation of amorphous silicon carbide is usually Si H4,5i2116
,5iJs et al., and C11,.

C2112、C2115等との混合ガスが用いられてい
る(特開昭57−103311号)。
A mixed gas with C2112, C2115, etc. is used (JP-A-57-103311).

しかしこれらの混合ガスはその分解に比較的高いパワー
(RFパワー50W程度)を必要とし、低いパワーでは
十分な分解が出来ないためプラズマCvD法にて成膜を
行う過程で基板に形成しである透明電極表面に対するプ
ラズマの衝撃が大きく、透明電極の構成元素であるIn
+ Snが成膜中のp型非晶質半導体層中に拡散し、膜
質を低下させるという問題があった。
However, these mixed gases require relatively high power (RF power of about 50 W) to decompose, and low power cannot sufficiently decompose them, so they are not formed on the substrate during film formation using the plasma CVD method. The impact of the plasma on the surface of the transparent electrode is large, and the In
+ There was a problem in that Sn diffused into the p-type amorphous semiconductor layer during film formation and deteriorated the film quality.

〔問題点を解決するための手段〕[Means for solving problems]

本発明はかかる事情に鑑みなされたものであって、その
目的とするところは低パワーで分解が可能な一般式(C
vHw)x 5iyHzで表わされる物質を原料ガスに
用いることによって、不純物の拡散を大幅に低減し得て
、膜質の向上が図れ、しかもC25iを共に含む〆めに
従来はSiH4等と0114等とを混合して用いたが単
一種の物質のみで足りることとなって設備の簡略化もは
かれるようにした光起電力装置を提供するにある。
The present invention was made in view of the above circumstances, and its purpose is to decompose the general formula (C
By using a material expressed by vHw) It is an object of the present invention to provide a photovoltaic device in which a mixture of materials is used, but only a single kind of material is required, and the equipment can be simplified.

本発明に係る光起電力装置は、光活性層中に非晶質シリ
コンカーバイド層を含む光起電力装置において、前記非
晶質シリコンカーバイド層は原料ガスとして一般式(C
vHw)xsiyHz  (v−zは零を含む任意数)
で表わされるガスを用いて形成されたことを特徴とする
The photovoltaic device according to the present invention includes an amorphous silicon carbide layer in the photoactive layer, wherein the amorphous silicon carbide layer is used as a raw material gas of the general formula (C
vHw) xsiyHz (v-z is any number including zero)
It is characterized by being formed using a gas represented by

〔実施例〕〔Example〕

以下本発明をその実施例を示す図面に基づき具体的に説
明する。第1図は本発明に係る半導体装置(以下本発明
装置という)の縦断面構造図であり、図中1はガラス等
を用いて構成した透光性絶縁基板、2はITO等を用い
て構成した透明電極、3は伝導型がp型の非晶質半導体
層、4は同じくi型の非晶質半導体層、5は同じくn型
の非晶質半導体層、6はA1等を用いて構成した裏面電
極を示している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof. FIG. 1 is a vertical cross-sectional structural diagram of a semiconductor device according to the present invention (hereinafter referred to as the device of the present invention), in which 1 is a transparent insulating substrate made of glass or the like, and 2 is a transparent insulating substrate made of ITO or the like. 3 is an amorphous semiconductor layer of p-type conductivity, 4 is an i-type amorphous semiconductor layer, 5 is an n-type amorphous semiconductor layer, 6 is composed of A1, etc. The back electrode is shown.

透光性絶縁基板1はその主面上に透明電極2、p型、i
型、n型の各非晶質半導体層3,4,5、裏面電極6を
この順序にf#層形成せしめられている。p型非晶質半
導体層3は非晶質シリコンカーバイドを、またi型、n
型の各非晶質半導体層4゜5は非晶質シリコンを夫々用
いて形成されている。
A transparent insulating substrate 1 has transparent electrodes 2, p-type, i
The f# layer is formed of the amorphous semiconductor layers 3, 4, 5, and the back electrode 6 in this order. The p-type amorphous semiconductor layer 3 is made of amorphous silicon carbide, as well as i-type, n-type
Each amorphous semiconductor layer 4.5 of the mold is formed using amorphous silicon.

p型非晶質半導体層3はプラズマCVD法にて原料ガス
である(C2H5)3Si H+B2H6を分解して基
FiS表面に非晶質シリコンカーバイドを革着形成せし
めである。12Fパワーとしては5W程度で十分である
The p-type amorphous semiconductor layer 3 is formed by decomposing (C2H5)3SiH+B2H6, which is a raw material gas, by a plasma CVD method to form amorphous silicon carbide on the surface of the base FiS. Approximately 5 W is sufficient as the 12F power.

なお、ワイドバンドギャップ材料としてはトリエチルシ
ラン(C2Hs)3SiHに限らず、テトラエチルシラ
ン(C2Hs)4Si、モノメチルシラン(CH3)S
+ H] l  ジメチルシラン(CI+3):Si 
H2、テトラメチルシラン(CH3)4Si等を用いて
もよく、一般式%式%) で表わされる物質であればよい。
Note that the wide bandgap material is not limited to triethylsilane (C2Hs)3SiH, but also tetraethylsilane (C2Hs)4Si, monomethylsilane (CH3)S
+ H] l dimethylsilane (CI+3):Si
H2, tetramethylsilane (CH3)4Si, etc. may be used, and any substance represented by the general formula % may be used.

ただ現在市場で得られるこれらのガスの純度は表1に示
す如くであり、不純物の少ない(C2H5) 3SiH
However, the purity of these gases currently available on the market is as shown in Table 1.
.

(C2H5) 4 Si等が望ましい。(C2H5)4Si etc. are desirable.

表   1 透明電極2、i型、n型非晶質半導体層4.5及び裏面
電極6等の形成条件、原料ガス等は従来の方法をそのま
ま通用すればよい。
Table 1 The conditions for forming the transparent electrode 2, the i-type and n-type amorphous semiconductor layers 4.5, the back electrode 6, and the like, as well as the raw material gas, may be determined by conventional methods.

第2図(イ)〜(ホ)はp型非晶質半導体層の原料ガス
として(C2H5) 3Sill +B2116を用い
た本発明装置と同じくp型非晶質半導体層の原料ガスと
してSiH4+C■4 +B2Hr、を用いた従来装置
との光劣化特性についての比較試験結果を示すグラフで
あり、横軸にはいずれも時間(時)を、また縦軸には夫
々光劣化率(%)、変換効率η(%)、開放電圧Voc
 (V) 、短絡電流rsc (mA) + 曲線因子
FFをとって示しである。グラフ中黒光でプロットした
のは本発明装置の、また白丸でプロットしたのは従来装
置の結果を示している。
Figures 2 (a) to (e) show SiH4 + C4 + B2Hr as the raw material gas for the p-type amorphous semiconductor layer, similar to the device of the present invention using (C2H5) 3Sill +B2116 as the raw material gas for the p-type amorphous semiconductor layer. This is a graph showing the results of a comparative test on photodegradation characteristics with a conventional device using (%), open circuit voltage Voc
(V), short circuit current rsc (mA) + fill factor FF. In the graph, the black light plots indicate the results of the device of the present invention, and the white circles plot the results of the conventional device.

これらのグラフから明らかなように上記した光劣化率、
変換効率、開放電圧、短絡電流2曲線因子のいずれにつ
いても本発明装置は優れた結果を示しているが、特に−
変換効率、光劣化率においての向上が顕著であることが
解る。
As is clear from these graphs, the above photodegradation rate,
The device of the present invention shows excellent results in terms of conversion efficiency, open circuit voltage, and short circuit current 2 fill factors, but especially -
It can be seen that the conversion efficiency and photodegradation rate are significantly improved.

なお、上述の実施例にあっては光の入射側に位置するp
型非晶質半導体層の形成にテトラエチルシラン等の原料
ガスを用いる場合につき説明したが、何らこれらに限る
ものではなく、n−1−p接合型の場合にはn型非晶質
半導体層の形成に同様の原料ガスを用い得ることは勿論
である。
Note that in the above embodiment, p located on the light incident side
Although the case where raw material gas such as tetraethylsilane is used to form an n-type amorphous semiconductor layer has been described, it is not limited to these in any way. Of course, similar source gases can be used for formation.

〔効果〕〔effect〕

以上の如く本発明装置にあっては、非晶質シリコンカー
バイド層を(Cν)1w)x 5iytlzを原料ガス
に用いて形成したから、小さいパワーでその分解を行う
ことが出来て他層からの不純物の拡散を格段に低減出来
、膜品質が向上し、光電変換特性、光劣化特性の大幅な
向上を図れるなど、本発明は優れた効果を奏するもので
ある。
As described above, in the device of the present invention, since the amorphous silicon carbide layer is formed using (Cν)1w) The present invention has excellent effects such as significantly reducing impurity diffusion, improving film quality, and greatly improving photoelectric conversion characteristics and photodegradation characteristics.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明装置の断面構造図、第2図(イ)〜(ホ
)は本発明装置と従来装置との光劣化特性を比較して示
すグラフである。 1・・・透光性絶縁基板 2・・・透明電極 3・・・
p型非晶質半導体層 4・・・i型非晶質半導体層5・
・・n型非晶質半導体層 6・・・裏面電極耳 1 図
FIG. 1 is a cross-sectional structural diagram of the device of the present invention, and FIGS. 2(a) to (e) are graphs comparing the photodegradation characteristics of the device of the present invention and a conventional device. 1... Transparent insulating substrate 2... Transparent electrode 3...
P-type amorphous semiconductor layer 4...I-type amorphous semiconductor layer 5...
...N-type amorphous semiconductor layer 6...Back electrode lug 1 Figure

Claims (1)

【特許請求の範囲】 1、光活性層中に非晶質シリコンカーバイド層を含む光
起電力装置において、前記非晶質シリコンカーバイド層
は原料ガスとして一般式(C_VH_W)_XSi_Y
H_Z(V〜Zは零を含む任意数)で表わされるガスを
用いて形成されたことを特徴とする光起電力装置。 2、前記原料ガスは(C_2H_5)_3SiH、又は
(C_2H_5)_4Siである特許請求の範囲第1項
記載の光起電力装置。
[Claims] 1. In a photovoltaic device including an amorphous silicon carbide layer in a photoactive layer, the amorphous silicon carbide layer has the general formula (C_VH_W)_XSi_Y as a raw material gas.
A photovoltaic device formed using a gas represented by H_Z (V to Z are arbitrary numbers including zero). 2. The photovoltaic device according to claim 1, wherein the source gas is (C_2H_5)_3SiH or (C_2H_5)_4Si.
JP60254576A 1985-11-12 1985-11-12 Photovoltaic device Pending JPS62113482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60254576A JPS62113482A (en) 1985-11-12 1985-11-12 Photovoltaic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60254576A JPS62113482A (en) 1985-11-12 1985-11-12 Photovoltaic device

Publications (1)

Publication Number Publication Date
JPS62113482A true JPS62113482A (en) 1987-05-25

Family

ID=17266959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60254576A Pending JPS62113482A (en) 1985-11-12 1985-11-12 Photovoltaic device

Country Status (1)

Country Link
JP (1) JPS62113482A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5445992A (en) * 1993-05-10 1995-08-29 Canon Kabushiki Kaisha Process for forming a silicon carbide film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892217A (en) * 1981-11-28 1983-06-01 Semiconductor Energy Lab Co Ltd Manufacture of semiconductor device
JPS59165468A (en) * 1983-03-10 1984-09-18 Shin Etsu Chem Co Ltd Manufacture of window frame material for solar battery

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5892217A (en) * 1981-11-28 1983-06-01 Semiconductor Energy Lab Co Ltd Manufacture of semiconductor device
JPS59165468A (en) * 1983-03-10 1984-09-18 Shin Etsu Chem Co Ltd Manufacture of window frame material for solar battery

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5445992A (en) * 1993-05-10 1995-08-29 Canon Kabushiki Kaisha Process for forming a silicon carbide film

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