JPS62112331A - ダイボンデイング装置 - Google Patents

ダイボンデイング装置

Info

Publication number
JPS62112331A
JPS62112331A JP60252556A JP25255685A JPS62112331A JP S62112331 A JPS62112331 A JP S62112331A JP 60252556 A JP60252556 A JP 60252556A JP 25255685 A JP25255685 A JP 25255685A JP S62112331 A JPS62112331 A JP S62112331A
Authority
JP
Japan
Prior art keywords
die bonding
lead frame
cam
die
claw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60252556A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543181B2 (cg-RX-API-DMAC7.html
Inventor
Masao Yamamoto
雅夫 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60252556A priority Critical patent/JPS62112331A/ja
Publication of JPS62112331A publication Critical patent/JPS62112331A/ja
Publication of JPH0543181B2 publication Critical patent/JPH0543181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)
JP60252556A 1985-11-11 1985-11-11 ダイボンデイング装置 Granted JPS62112331A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60252556A JPS62112331A (ja) 1985-11-11 1985-11-11 ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60252556A JPS62112331A (ja) 1985-11-11 1985-11-11 ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS62112331A true JPS62112331A (ja) 1987-05-23
JPH0543181B2 JPH0543181B2 (cg-RX-API-DMAC7.html) 1993-06-30

Family

ID=17239011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60252556A Granted JPS62112331A (ja) 1985-11-11 1985-11-11 ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS62112331A (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106046A (ja) * 1988-10-14 1990-04-18 Matsushita Electron Corp チップボンダ
JP2014175546A (ja) * 2013-03-11 2014-09-22 Hitachi High-Tech Instruments Co Ltd 複数ボンディングヘッド位置合わせ方法及びダイボンダ
JP2025510502A (ja) * 2022-02-25 2025-04-15 アプライド マテリアルズ インコーポレイテッド チップツーウエハアライメント精度のランツーラン最適化のための機械学習及び統合計測

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02106046A (ja) * 1988-10-14 1990-04-18 Matsushita Electron Corp チップボンダ
JP2014175546A (ja) * 2013-03-11 2014-09-22 Hitachi High-Tech Instruments Co Ltd 複数ボンディングヘッド位置合わせ方法及びダイボンダ
JP2025510502A (ja) * 2022-02-25 2025-04-15 アプライド マテリアルズ インコーポレイテッド チップツーウエハアライメント精度のランツーラン最適化のための機械学習及び統合計測

Also Published As

Publication number Publication date
JPH0543181B2 (cg-RX-API-DMAC7.html) 1993-06-30

Similar Documents

Publication Publication Date Title
US11410870B2 (en) Die attach systems, and methods of attaching a die to a substrate
US7568606B2 (en) Electronic device handler for a bonding apparatus
JPS62112331A (ja) ダイボンデイング装置
EP0655884A1 (en) Transport-by-suction type die
EP0655883B1 (en) General-purpose lead working machine
US20080314964A1 (en) Wire bonding apparatus and process
JP2991857B2 (ja) Ｔｏ−２２０半導体製造機のリード・フレーム自動供給装置
US5975835A (en) Lead frame conveying method and conveying apparatus
US5435681A (en) Pusher device for plate-form articles
US5951283A (en) Substrate transporting device
JP2004140047A (ja) 樹脂封止装置
JPH01239864A (ja) 基板搬送装置
JPH08133446A (ja) 板状物移送機構
JP2800950B2 (ja) 半導体部品製造用短冊状リードフレームの間欠移送装置
JP2984381B2 (ja) インナリードボンディング装置
JP3673051B2 (ja) バンプ形成方法及びバンプボンダー
JP2679259B2 (ja) ベアチップの共晶ボンディング装置および共晶ボンディング方法
JPS6246807A (ja) 循環式リニアフイ−ダ
JP2000058728A (ja) 半導体装置の製造方法および製造装置
JP2888231B2 (ja) 捺印機におけるｉｃパッケージ位置決め装置
JPS59113632A (ja) ワイヤボンダ−
JP2961584B2 (ja) 電子部品のベース部押え装置
JPH06318611A (ja) 半導体モールド装置
JPS6332254B2 (cg-RX-API-DMAC7.html)
JPS6116689Y2 (cg-RX-API-DMAC7.html)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees