JPS62112324A - Manufacture of x-ray mask - Google Patents

Abstract

PURPOSE:To assure the X-ray mask substrate bonding process with excellent plate precision by a method wherein an X-ray mask substrate and a substrate holding ring are adsorbed to a holding rotary mechanism and while rotating them concentrically, fluid bonding agent applied on the holding ring 4 is made even and the the rotary mechanism is moved to bond the substrate on the substrate holding ring. CONSTITUTION:A substrate holding ring 4 and a silicon substrate 3 are respectively held by the second holding rotary mechanism 2 and a first holding rotary mechanism 1 by vacuum adsorption. The substrate 3 and the ring 4 are rotated together with the mechanism 1, 2 at a uniform speed. The ring 4 is coated with sensitive resin 5 (fluid bonding agent). After making the sensitive resin 5 even, the mechanism 1 is lowered to bond the substrate 3 on the ring 4. Through these procedures, the resin 5 is made even by centrifugal force while the substrate 3 is vacuum adsorbed for correcting any warp to assure the bonding process with excellent plate precision.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing an X-ray mask used for X-ray exposure, and particularly to a method for bonding a mask substrate and a substrate support ring.

(Prior art) In general, an X-ray mask consists of forming a base film such as a BN film or an StN film on a silicon substrate (Xm mask substrate), and forming turns of an X-ray absorber on this pace film. However, as a matter of course, the silicon substrate in the X-ray exposed area is etched away, leaving the frame. At this time, the silicon substrate is first attached to the substrate support ring, and then the silicon is removed by etching.

This (attaching the substrate to the support ring) is for the purpose of reinforcement and improvement of planar accuracy, since the base film of the X-ray absorber is a membrane with a thickness of several μm.

Conventionally, in order to attach a silicon substrate to a substrate support ring as described above, a liquid adhesive such as a photosensitive resin was simply dropped or applied onto the support ring, and the silicon substrate was simply pasted.

(Problems to be Solved by the Invention) However, in such a method, unevenness of the photosensitive resin (liquid adhesive) and warping of the silicon substrate itself may cause the base film to deteriorate after pasting and etching away unnecessary parts of the silicon substrate. The technical drawback was that the plane accuracy did not improve.

It is an object of the present invention to provide a method of manufacturing an X-ray mask that eliminates the above-mentioned problems of uneven coating and warpage and that improves the plane accuracy of the base film.

(Means for Solving the Problems) This invention provides a method for attaching an X-ray mask substrate and a substrate support ring in the manufacturing process of an X-ray mask using two holding and rotating mechanisms. After the liquid adhesive applied to the substrate support ring becomes uniform due to centrifugal force while rotating separately concentrically at the same speed, one holding rotation mechanism is moved to remove the X-ray mask. The board and board support ring are pasted together.

(Function) In the method of the present invention, the applied liquid adhesive becomes uniform due to centrifugal force, and the X-ray mask substrate is attracted to the holding rotation mechanism, so that the unevenness is corrected. . Since the pasting is performed in this state, the XL mask substrate can be pasted with good planar accuracy.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a pasting device used in a first embodiment of the present invention. In this figure, reference numeral 1.2 denotes a first and a second holding and rotating mechanism body provided coaxially on the inside and outside. It is designed to be rotated separately by. In addition, the first holding rotation mechanism 1 on the inside can be raised and lowered, and furthermore, it can hold the silicon substrate 3 (X-ray mask substrate) by vacuum suction with its peripheral portion protruding outward in the form of a brim. It has become. On the other hand, if the outer second holding/rotating mechanism 2 is capable of holding the substrate support ring 4 by vacuum suction concentrically with the silicon substrate 3 above the first holding/rotating mechanism. When the substrate support ring 4 is held on the second holding/rotating mechanism 2, the substrate supporting ring 4 is attached to the peripheral part of the silicon substrate 3 on the first holding/rotating mechanism 1 (first holding/rotating mechanism 2). (projecting like a brim to the outside of the body 1) and are in a vertically overlapping positional relationship.

A first embodiment of the present invention implemented using such an apparatus will be described. First, the substrate support ring 4 is held by the second holding/rotating mechanism 2, and the silicon substrate 3 is held by the first holding/rotating mechanism 1 by vacuum suction. At this time, the first holding/rotating mechanism l is in a raised state, and therefore the silicon substrate 3 and the substrate support ring 4 are
, the I-in board 3 is on the top, and the board support ring 4 is on the bottom, which are vertically stacked and concentrically located with a distance between them. Thereafter, by operating a drive mechanism (not shown), the first. The second holding/rotating mechanism 1.2, that is, the silicon substrate 3 and the substrate support ring 4 are rotated at a constant speed. Then, the photosensitive resin 5 (liquid adhesive) is applied onto the substrate support ring 4 while rotating at a constant speed in this manner. Then, the applied photosensitive resin 5 becomes uniform due to centrifugal force. When the photosensitive resin 5 becomes uniform, the first holding and rotating mechanism 1 is lowered and the peripheral portion of the silicon substrate 30 is overlapped with the substrate support ring 4.
Paste the page. At this time, the photosensitive resin 5 is made uniform by centrifugal force as described above. Further, since the silicon substrate 3 is vacuum-adsorbed by the first holding and rotating mechanism IK, the warp is corrected. Therefore, the silicon substrate can be pasted with good planar accuracy.

FIG. 2 is a cross-sectional view of a pasting device used in a second embodiment of the invention. In this device, a heating element 6 is provided on the layer surface of the vacuum suction part of the first holding/rotating mechanism 1, and a central axis 1a
A heat insulating material 7 is attached to the top, and the rest is the same as the device shown in FIG.

In the second embodiment carried out using this apparatus, the silicon substrate 3 on the first holding/rotating mechanism 1 is heated and expanded by a heating element 6 in advance. Then, in this state, the silicon substrate 3 and the substrate support ring 4 are attached in the same manner as in the first embodiment.

Then, after pasting, when the temperature returned to room temperature, the silicon substrate 3
Residual stress is generated. Therefore, it is expected that the plane precision of the base film will be further improved after the unnecessary silicon portions are removed by etching.

In the second embodiment, the silicon substrate 3 is heated and expanded, but may be cooled and contracted.Furthermore, the substrate support ring 4 may be heated or cooled instead of the silicon substrate 3. The reason why the silicon substrate 3 or the substrate support ring 4 can be selectively heated or cooled in this way is that the silicon substrate 3 and the substrate support ring 4 are each held by separate rotating mechanisms.

(Effects of the Invention) As explained in detail above, according to the X-ray mask manufacturing method of the present invention, the applied liquid adhesive is made uniform by centrifugal force, and the X-ray mask substrate is held by the holding rotation mechanism. Since the silicon substrate is adsorbed, the warpage is corrected, and the bonding is performed in that state, the silicon substrate can be bonded with good planar accuracy.

[Brief explanation of drawings]

(Drawings) Fig. 1 is a sectional view showing a device with a sticker used in the first embodiment of the X-ray mask manufacturing method of the present invention, and Fig. 2 is a sectional view showing the device used in the second embodiment of the invention. The attached figure is a sectional view showing the device. l...First holding/rotating mechanism body, 2...Second holding/rotating mechanism body, 3...Silicon substrate, 4...One substrate support ring, 5...Photosensitive resin. seventy

Claims (1)

[Scope of Claims] (a) An X-ray mask substrate and a substrate support ring are attracted to two holding rotation mechanisms, and while rotating them concentrically and separately at the same speed, (b) The X-ray mask substrate and a substrate support ring are An X-ray mask manufacturing method characterized in that after the applied liquid adhesive is made uniform by centrifugal force, (c) one holding rotation mechanism is moved and an X-ray mask substrate and a substrate support ring are attached.