JPS62109451U - - Google Patents
Info
- Publication number
- JPS62109451U JPS62109451U JP1985202325U JP20232585U JPS62109451U JP S62109451 U JPS62109451 U JP S62109451U JP 1985202325 U JP1985202325 U JP 1985202325U JP 20232585 U JP20232585 U JP 20232585U JP S62109451 U JPS62109451 U JP S62109451U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip component
- adhesive
- flow path
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/07141—
-
- H10W72/073—
-
- H10W72/075—
-
- H10W72/07521—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985202325U JPS62109451U (cg-RX-API-DMAC10.html) | 1985-12-26 | 1985-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985202325U JPS62109451U (cg-RX-API-DMAC10.html) | 1985-12-26 | 1985-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62109451U true JPS62109451U (cg-RX-API-DMAC10.html) | 1987-07-13 |
Family
ID=31166596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985202325U Pending JPS62109451U (cg-RX-API-DMAC10.html) | 1985-12-26 | 1985-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62109451U (cg-RX-API-DMAC10.html) |
-
1985
- 1985-12-26 JP JP1985202325U patent/JPS62109451U/ja active Pending
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