JPS6210939Y2 - - Google Patents
Info
- Publication number
- JPS6210939Y2 JPS6210939Y2 JP1989082U JP1989082U JPS6210939Y2 JP S6210939 Y2 JPS6210939 Y2 JP S6210939Y2 JP 1989082 U JP1989082 U JP 1989082U JP 1989082 U JP1989082 U JP 1989082U JP S6210939 Y2 JPS6210939 Y2 JP S6210939Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- airtight terminal
- kovar
- airtight
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000833 kovar Inorganic materials 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 8
- 238000005253 cladding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989082U JPS58123572U (ja) | 1982-02-17 | 1982-02-17 | 気密端子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989082U JPS58123572U (ja) | 1982-02-17 | 1982-02-17 | 気密端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58123572U JPS58123572U (ja) | 1983-08-23 |
JPS6210939Y2 true JPS6210939Y2 (en, 2012) | 1987-03-14 |
Family
ID=30032078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989082U Granted JPS58123572U (ja) | 1982-02-17 | 1982-02-17 | 気密端子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58123572U (en, 2012) |
-
1982
- 1982-02-17 JP JP1989082U patent/JPS58123572U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58123572U (ja) | 1983-08-23 |
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