JPS6210388B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device aging device that performs operational aging by arbitrarily switching connections between input and output terminals on an aging substrate depending on the type of semiconductor device.

In general, aging of semiconductor devices involves operating semiconductor devices containing defects at high temperatures during the manufacturing process to accelerate defects and make imperfect semiconductor devices defective, thereby obtaining highly reliable semiconductor devices. and,
When aging a certain type of semiconductor element, as shown in FIG. 1, an aging board 1 is manufactured by connecting terminals using printed wiring specific to the semiconductor element and mounting circuit parts such as resistors and capacitors. In the aging board 1 shown in FIG. 1, 2a to 2d are sockets into which semiconductor elements (not shown) are inserted, 3a and 3b are printed wirings for power supply voltage (including ground voltage), and 4a and 4b are inputs, respectively. This is printed signal wiring. A large number of aging substrates 1 thus constructed are placed in an aging device 5 shown in FIG. 2 and subjected to operational aging. That is, in the aging device 5 shown in FIG. 2, 6 contains a large number of aging substrates 1;
A constant temperature bath maintains a high temperature (50 to 200°C), 7 is a control panel that controls the temperature, supply voltage, input signals, etc., and 8 is a switch that switches the necessary terminals of input signals. When performing operational aging, the control panel 7 maintains the temperature of the thermostatic chamber 6 constant, and the changeover switch 8 selects the necessary terminals and applies input signals to the semiconductor devices at a predetermined power supply voltage and It supplies an input signal voltage and performs operational aging.

However, in the conventional semiconductor device aging apparatus, if another type of semiconductor device is to be aged, a different type of aging substrate must be manufactured. In addition, when aging general-purpose logic elements such as gate arrays and transistor arrays, which have as many as 120 input/output terminals and whose input/output terminals can be changed depending on the application, fixed Printed wiring requires many types of aging boards. Also, if all terminals are printed and wired for versatility,
If you change the input/output terminal and it becomes an output terminal, you will need to disconnect it using a switch or other method. Moreover, if all the terminals are printed and wired, it is necessary to increase the size of the aging board or reduce the number of semiconductor elements mounted on the aging board due to the area of the wiring. On the other hand, if you try to reduce the number of printed wiring to terminals and increase the number of installed terminals, the input terminals will differ depending on the type of element, so whether or not the input terminals are printed wiring becomes a probabilistic matter. Therefore, sufficient aging cannot be performed. In this way, when aging a logic element, a large number of wiring lines and resistors are required, and the aging board must be made large.
Alternatively, the number of mounted elements must be reduced. Furthermore, when making aging substrates for elements limited to certain uses, many types of aging substrates are required for elements whose input terminals are changed. Therefore, it has been proposed to remove the input signal wiring on the aging board and wire only the power supply voltage and ground voltage, thereby effectively utilizing the area of the aging board to increase the number of mounted elements. In this case, the input/output terminal switch of the aging device is not required, but the device is not kept in a sufficient operating state, and initial defective devices cannot be completely removed, making it impossible to obtain a highly reliable device. There were some shortcomings.

Therefore, an object of the present invention is to provide a versatile semiconductor device aging device that has a large number of input/output terminals, can be applied to the aging of logic devices in which the input/output terminals are changed depending on the application, and can be equipped with a large number of devices. It provides equipment.

In order to achieve such an object, the present invention prints a necessary number of power supply lines, ground lines, and input signal lines on an aging board, and connects the power lines, ground lines, input signal lines, or some of these lines by printing them on the aging board. An extension wiring that connects to the terminal and has a connecting pin at the tip,
Pull out all the terminals from the socket into which the semiconductor element is inserted, provide a connection terminal at the tip, connect the desired connection pin to the connection terminal, and arbitrarily select and connect the changed input terminal depending on the application or type of semiconductor element. This aging substrate is placed in a constant temperature bath and operated at a high temperature for aging, and will be described in detail below using examples.

FIG. 3 is a plan view showing an embodiment of the semiconductor device aging apparatus according to the present invention. In the same figure, 9 is an aging board whose details are shown in FIG.

In the aging board 9 shown in FIG. 4, 10a to 10d are sockets for inserting semiconductor elements (not shown), 11a and 11b are power supply lines and ground lines printed on the aging board 9, and 12a and 12b. is an input signal line printed on this aging board 9, 13
14 is a socket extension wiring which is extended from all the terminals of the sockets 10a to 10d by printed wiring and has a connecting terminal 13a at the tip, and 14 is connected to the input signal lines 12a and 12b, respectively, and has a connecting pin 14a at the tip. , an extension wire for contacting this connecting pin 14a with the connecting terminal 13a of the necessary socket extension wire 13, and a rest pin 15 for holding the connecting pin 14a of the unused extension wire 13 in contact.

In this case, it goes without saying that there is no need for a switch on the control panel to switch between input and output terminals.

Next, the operation of semiconductor device aging according to the above configuration will be explained.

First, semiconductor devices to be subjected to operational aging are inserted into the sockets 10a to 10d. Then, the connection pin 14a of the extension wiring 14 on the input signal lines 12a and 12b is connected to the connection terminal 13a required for the input signal of the socket extension wiring 13 extended from the terminals of the sockets 10a to 10d. Then, this aging substrate 9 is placed in a constant temperature chamber 6 of a semiconductor device aging device shown in FIG. 3, and a constant temperature is maintained, and a predetermined power supply voltage (including ground voltage) and input signal voltage are supplied to the semiconductor device. Perform motion aging.

The above explanation describes an aging device for logic elements that has a large number of input/output terminals and changes the input/output terminals depending on the application. Of course, if the lines and input signal lines are wired in advance, aging can be performed by changing the terminal connections of any semiconductor element.

In addition, although the example explained the case where the power supply line is fixed, it goes without saying that if the power supply line is wired with connection pins in the same way as the input signal line, it can be applied to many types of semiconductor devices with different power supply pins. .

As described above in detail, the semiconductor device aging apparatus according to the present invention eliminates the need for a large number of wiring lines on the aging board, has a large effective area, and can increase the number of semiconductor devices mounted. Moreover, it has the versatility to handle semiconductor devices that have a large number of input/output terminals and whose input/output terminals are changed depending on the application, and can be aged in the operating state, resulting in highly reliable semiconductor devices. effective.

[Brief explanation of the drawing]

Figure 1 is a top view showing a conventional aging board;
FIG. 2 is a front view showing a conventional semiconductor device aging apparatus equipped with the aging substrate shown in FIG.
FIG. 3 is a front view showing an embodiment of the semiconductor device aging apparatus according to the present invention, and FIG. 4 is a top view showing an aging substrate mounted on the device shown in FIG. 1... Aging board, 2a to 2d... Socket,
3a and 3b...printed wiring, 4a and 4b
...Printed wiring, 5...Aging device, 6...Thermostatic chamber, 7...Control panel, 8...Switch, 9...Aging board, 10a to 10d...Socket, 11a and 11b...Power line and ground line, 12a and 12b...Input signal Line, 13... socket extension wiring,
13a... Connection terminal, 14... Extension wiring, 14a... Connection pin, 15... Rest pin. Note that the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1 Print the required number of power lines, ground lines, and input signal lines on the aging board, connect them to the power line, ground line, input signal line, or some of these lines, and connect an extension with a connecting pin at the tip. Pull out all the terminals from the socket into which the wiring and semiconductor element will be inserted, provide a connection terminal at the end of this, connect the desired connection pin to the connection terminal, and select the changed input terminal arbitrarily depending on the application and type of semiconductor element. A semiconductor device aging device characterized in that the aging substrate is placed in a constant temperature bath, operated at high temperature, and aged.