JPS6210293A - High-speed plating method - Google Patents
High-speed plating methodInfo
- Publication number
- JPS6210293A JPS6210293A JP14965185A JP14965185A JPS6210293A JP S6210293 A JPS6210293 A JP S6210293A JP 14965185 A JP14965185 A JP 14965185A JP 14965185 A JP14965185 A JP 14965185A JP S6210293 A JPS6210293 A JP S6210293A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- plating solution
- suction
- injection nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は高速めつき方法、特にめっき液中の被めっぎ処
理物に噴射ノズルによるめつき液の吹付けを行ってめっ
き液を撹拌するようにした高速めっき方法の改良に関す
るものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a high-speed plating method, in particular, a method in which a plating solution is sprayed onto an object to be plated in a plating solution using a spray nozzle, and the plating solution is agitated. This invention relates to an improvement in a high-speed plating method.
[従来の技術と問題点]
従来、長尺の帯状の板材を連続的にめっきする場合、一
般的には帯状の板材をめっき液中を走行させて連続的に
めっきする方法が行われているが、この方法ではめっき
液の撹拌が十分に行われないため、めっき速度が遅く作
業効率が著しく悪いという欠点がある。この問題点を解
決する方法として、めっき液中を走行する帯状の板材に
噴射ノズルによるめっき液の吹付けを行ってめっき液を
撹拌するようにしためっき方法(例えば特開昭54−1
52630号公報)があり、この方法によればめっぎ液
中の帯状の板材のめっき面近傍のめつき液を撹拌するこ
とができるため、最初のめっき方法と比較して電流密度
を高く採れ作業効率を上げることができる。しかしなが
ら実験によれば、この方法においてもめつき液の撹拌は
未だ十分でないことがわかった。[Conventional technology and problems] Conventionally, when continuously plating long strip-shaped plates, the method generally used is to run the strip-shaped plates through a plating solution and plate them continuously. However, this method has the drawback that the plating solution is not sufficiently stirred, resulting in slow plating speed and extremely low work efficiency. As a method to solve this problem, a plating method in which the plating solution is sprayed by a spray nozzle onto a strip-shaped plate running through the plating solution and the plating solution is agitated (for example, JP-A-54-1
According to this method, the plating solution near the plating surface of the strip-shaped plate material can be stirred, so a higher current density can be obtained compared to the first plating method. Work efficiency can be increased. However, experiments have shown that this method still does not sufficiently stir the plating solution.
すなわち、流れの可視化実!!A(例えば液中に気泡を
発生させ、暗中でスリット光線を当てて気泡の流れを観
察するなど)によれば、第10図に示されるように噴射
ノズル6から噴射されためつき液は、矢印aで示される
ようにめっき液中を紙面を垂直に走行する帯状の板材3
′のめっき面7に衝突後そのめっき面近傍のめつき液を
F!t、痒し、さらに矢印すで示されるようにめっき而
7と平行な流れにその向きを変えて全体的なめっき液の
撹拌を行う。この場合噴射ノズル6から噴射されためっ
き液は、その粘性の作用によって矢印Cで示されるよう
に周囲のめっき液を同方向に引っ張りながら板材3′の
めっぎ而7に衝突するため、その衝突力は噴射時のもの
にくらべて弱くなる。また衝突後のめっき液は、めっき
面7と平行な流れにその向きを変えて周囲の淀んだ液中
に向って放射状に流れるため、次第に撹拌力が弱くなる
。したがってこの方法によれば、噴射ノズル6によるめ
っき液撹拌力は今一つ十分でなく、又その撹拌力も噴射
ノズル6から遠くなるにしたがって次第に弱くなり、め
っき面上を全面一様に撹拌することはできない。このた
め帯状の板材を高い電流密度で均一にめっきすることが
できない。なお第10図中、9は陽極である。In other words, visualization of the flow is real! ! According to method A (for example, by generating bubbles in the liquid and observing the flow of bubbles by shining a slit beam in the dark), as shown in FIG. A strip-shaped plate 3 running perpendicular to the plane of the paper in the plating solution as shown in a.
' After colliding with the plating surface 7, the plating liquid near the plating surface is F! Then, as shown by the arrow, the direction of the flow is changed to parallel to the plating solution 7 to stir the entire plating solution. In this case, the plating solution injected from the injection nozzle 6 collides with the plating 7 of the plate material 3' while pulling the surrounding plating solution in the same direction as shown by arrow C due to its viscosity, so that the collision force is weaker than that during injection. Further, the plating solution after the collision changes its direction to flow parallel to the plating surface 7 and flows radially into the surrounding stagnant solution, so that the stirring force gradually becomes weaker. Therefore, according to this method, the power of stirring the plating solution by the injection nozzle 6 is not sufficient, and the stirring power gradually becomes weaker as the distance from the injection nozzle 6 increases, making it impossible to uniformly stir the entire surface of the plating surface. . For this reason, it is not possible to uniformly plate a strip-shaped plate material with a high current density. In addition, in FIG. 10, 9 is an anode.
[発明の目的]
本発明の目的は、前記した従来技術の欠点を解消し、め
つき面近傍のめつき液を激しく一様に高速撹拌すること
により、電流密度を高め、作業効率を上げることができ
ると共にむらのない均一なめっきを行うことができる高
速めつき方法を提供することにある。[Object of the Invention] The object of the present invention is to eliminate the drawbacks of the prior art described above, and to increase current density and improve work efficiency by vigorously and uniformly stirring the plating liquid near the plating surface at high speed. An object of the present invention is to provide a high-speed plating method capable of performing uniform plating without unevenness.
[発明の概要コ
すな禮ち本発明は、めっき液中の被めっき処理物に噴射
ノズルによるめっき液の吹付は及び吸引ノズルによるめ
っき液の吸込みを同時に行うことにより、めっき液中の
被めっき処理物のめっき面近傍のめっき液を激しく一様
に高速撹拌しながら被めっき処理物をめっきしようとす
るもので、これにより電流密度を高め作業効率を上げる
ことができると共にめっきの均一化を図ったものである
。[Summary of the Invention] The present invention provides a method for spraying the plating solution onto the object to be plated in the plating solution by simultaneously spraying the plating solution with an injection nozzle and sucking the plating solution into the object to be plated in the plating solution. This method attempts to plate the object to be plated while vigorously and uniformly stirring the plating solution near the plating surface of the object at high speed.This makes it possible to increase the current density, improve work efficiency, and ensure uniform plating. It is something that
本発明によれば噴射ノズルによるめっぎ液の撹拌力は吹
付は時と同程度のものを維持することが可能である。According to the present invention, it is possible to maintain the stirring force of the plating solution by the injection nozzle at the same level as when spraying.
[実施例J
次に添付図面第1〜9図により本発明高速めっき方法の
一実施例を説明する。[Example J] Next, an example of the high-speed plating method of the present invention will be described with reference to FIGS. 1 to 9 of the accompanying drawings.
すなわち第1図において、1はめつき槽、2はめつき液
、3はめつき液2中に浸漬された被めっき処理物である
。この被めっき処理物3としては例えばリードフレーム
累月の如ぎ長尺の帯状金属板が用いられる。第2(イ)
、(ロ)はそれぞれ被めっき処理物3の表面にマスキン
グテープ4を被覆し、めっき所要部5を露出させてなる
状態を示している。6は被めっき処理物3のめっき而7
に対向して設けられためつき液噴射ノズル、8はめつき
液吸引ノズル、9は陽極である。なお陰極は被めっき処
理物3によって構成されている。噴射ノズル5へのめっ
き液供給手段は省略した。That is, in FIG. 1, 1 is a plating tank, 2 is a plating solution, and 3 is an object to be plated immersed in the plating solution 2. As the object 3 to be plated, for example, a long belt-shaped metal plate such as a lead frame is used. Second (a)
, (B) respectively show a state in which the surface of the object 3 to be plated is coated with masking tape 4, and the required portion 5 to be plated is exposed. 6 is the plating process 7 of the object to be plated 3
8 is a plating liquid suction nozzle, and 9 is an anode. Note that the cathode is constituted by the object 3 to be plated. The plating solution supply means to the injection nozzle 5 was omitted.
第1図においてはめっき液2中の被めっき処理物3は噴
射ノズル5からめっき液の噴射を受け、しかもそのめっ
き液は被めっき処理物3のめっき而7に衝突した後で吸
引ノズル8によって吸込まれるのでほとんど抵抗なく一
様な流れを形成し、流速の減少も少なく、したがってめ
っき面7上のめっき液は最初のノズル噴射力を有効にM
持しイfから激しく流れることによって高速撹拌される
。In FIG. 1, the object to be plated 3 in the plating solution 2 is sprayed with the plating solution from the injection nozzle 5, and after colliding with the plating material 7 of the object to be plated 3, the plating solution is passed through the suction nozzle 8. Since it is sucked in, a uniform flow is formed with almost no resistance, and there is little decrease in flow velocity. Therefore, the plating solution on the plating surface 7 effectively utilizes the initial nozzle jet force.
It is stirred at high speed by the vigorous flow from the holder f.
このためめっき面6仝体が高速かつ均一撹拌されること
になり、高い電流密度での均一なめっきが可能となる。As a result, the plating surface 6 is stirred uniformly at high speed, making it possible to perform uniform plating at a high current density.
吸引ノズル8による吸引は例えば真空ポンプのようなも
のに接続するか、あるいは通常用いている循環用ポンプ
の吸込口に連結することによって行うことができる。Suction by the suction nozzle 8 can be performed by connecting it to a vacuum pump, for example, or by connecting it to the suction port of a commonly used circulation pump.
ここで被めっき処理物3は長尺物である必要はなく、め
っき而7も必ずしも平滑面である必要はない。又被めっ
き処理物3の両面をめっ、きする場合はその両側にそれ
ぞれ噴射ノズル及び吸引ノズルを配置すればよい。Here, the object 3 to be plated does not need to be a long object, and the object 7 to be plated does not necessarily have to have a smooth surface. Further, when plating both sides of the object 3 to be plated, an injection nozzle and a suction nozzle may be arranged on each side.
噴射ノズル及び吸引ノズルの配置は必ずしも第1図のよ
うにする必要はなく、例えば第3図(イ)、(ロ)のよ
うにパイプ周壁に多数の噴射口及び吸引口を有する構造
の噴射ノズル6及び吸引ノズル8を被めっき処理物3の
長手方向に沿って配置しても良い。この場合噴射ノズル
6から噴射されるめっき液はそのノズル長さに相当する
幅をもって第3図(ロ)の矢印方向すなわち被めっき処
理物3の幅方向に流れることになる。The arrangement of the injection nozzle and suction nozzle does not necessarily have to be as shown in Fig. 1. For example, an injection nozzle having a structure having a large number of injection ports and suction ports on the peripheral wall of the pipe as shown in Fig. 3 (a) and (b). 6 and the suction nozzle 8 may be arranged along the longitudinal direction of the object 3 to be plated. In this case, the plating solution injected from the injection nozzle 6 flows in the direction of the arrow in FIG. 3(b), that is, in the width direction of the object 3 to be plated, with a width corresponding to the length of the nozzle.
噴射ノズル及び吸引ノズルの配置についてはざらに第4
図(イ)、(0)、あるいは第5図のように配置しても
良く、これらはいずれも噴射ノズル6及び吸引ノズル8
の複数本をそれぞれ交互に配置してにするものである。Regarding the arrangement of the injection nozzle and suction nozzle, please refer to Section 4.
They may be arranged as shown in Figures (A), (0), or Figure 5, and these include the injection nozzle 6 and the suction nozzle 8.
A plurality of books are arranged alternately.
第2図(イ)、(ロ)に示されるめっき方法も含めて第
3図(イ)。Figure 3 (A) includes the plating method shown in Figures 2 (A) and (B).
(ロ)及び第5図に示されるめっき方法は、いずれも噴
射ノズル6及び吸引ノズル8によるめっき液の高速撹拌
区域を相当広くとることができる。In both of the plating methods shown in (b) and FIG. 5, the area where the plating solution is stirred at high speed by the injection nozzle 6 and the suction nozzle 8 can be considerably widened.
したがってこれらのめっき方法によれば、被めっき処理
物3のめっき面積をかなり広くとることができるため、
被めっき処理物3の片面あるいは両面を全面めっきする
場合にはめっきの均一化に、走行する被めっき処理物を
連続的にめっきする場合にはめつき作業の高速化にそれ
ぞれ著しい効果を発揮するものである。その中でもめっ
きの均一化という点では実験によれば第3図及び第4図
に示されるめっき方法が優れている。第5図に示される
めっき方法は被覆めっき処理物3の進行方向に対して噴
射ノズル6及び吸引ノズル8をそれぞれ角度を付けて配
置したものであるが、この方法によればめっき液の1党
拌をよりmMにすることができるため撹拌効果の向上を
期待することができる。Therefore, according to these plating methods, the plating area of the object 3 to be plated can be made considerably large.
It has a remarkable effect on uniformity of plating when plating one or both sides of the object to be plated 3, and speeds up the plating work when continuously plating a moving object to be plated. It is. Among these methods, experiments have shown that the plating methods shown in FIGS. 3 and 4 are superior in terms of uniform plating. In the plating method shown in FIG. 5, the injection nozzle 6 and the suction nozzle 8 are arranged at angles with respect to the traveling direction of the coated plating object 3. According to this method, one part of the plating solution is Since the stirring can be made more mM, it can be expected that the stirring effect will be improved.
めっき液2中で噴射ノズル6からめつき液を噴射する本
方法の場合、吸引ノズル8を設けても、従来技術におい
て説明したように第3図(イ)に示すように粘性の作業
により大なり小なり噴射ノズル6および吸引ノズル8の
周囲のめつき液が点線で示す矢印d方向に引っ張られる
ことには変わりなく、これによって撹拌効果が減少され
るという欠点がある。第6図〜第9図に示されるめっき
方法はかかる欠点を流体抵抗材の設置によって改善しよ
うとするものである。すなわち第6図によれば、例えば
第7図に示すような穴あき板からなる流体抵抗材10を
噴射ノズル6及び吸引ノズル8相互間に配置することに
よって、これらノズルの周囲に存在するめつき液の粘性
流れを著しく制限するものである。この流体抵抗材10
は穴あき板のほかにメツシュ状の物など、液中のイオン
は通過するが流れに対しては抵抗を生じるような物で構
成される。第7図に示される流体抵抗材10の場合穴径
を2 tta以下にすることによって流体抵抗効果を発
揮することが認められた。メツシュ状の物としては繊維
状のちの、細線を織ったものなどが考えられる。このよ
うな流体抵抗材は普通は絶縁体でつくられるが、これを
陽極として使う場合には導体でつくることもあり得る。In the case of this method in which the plating solution is injected from the injection nozzle 6 in the plating solution 2, even if the suction nozzle 8 is provided, as explained in the prior art, as shown in FIG. The plating liquid around the injection nozzle 6 and the suction nozzle 8 is still pulled in the direction of the arrow d shown by the dotted line, which has the disadvantage that the stirring effect is reduced. The plating method shown in FIGS. 6 to 9 attempts to improve this drawback by installing a fluid resistance material. That is, according to FIG. 6, by arranging the fluid resistance material 10 made of a perforated plate as shown in FIG. 7 between the injection nozzle 6 and the suction nozzle 8, the plating liquid existing around these nozzles This significantly limits the viscous flow of This fluid resistance material 10
In addition to a perforated plate, it consists of a mesh-like material that allows ions in the liquid to pass through but creates resistance to flow. In the case of the fluid resistance material 10 shown in FIG. 7, it has been found that the fluid resistance effect can be exhibited by setting the hole diameter to 2 tta or less. The mesh-like material may be woven from fibers or fine wires. Such fluid resistance materials are usually made of insulators, but can also be made of conductors when used as anodes.
第8図に示されるめっき方法は、第4図と同じように噴
射ノズル6及び吸引ノズル8の複数本をそれぞれ交互に
配置したものであるが、この場合流体抵抗材10を図の
ように配置することによってノズル周囲に存在するめつ
き液の粘性流れを著しく制限することができる。The plating method shown in FIG. 8 is a method in which a plurality of injection nozzles 6 and suction nozzles 8 are arranged alternately as in FIG. 4, but in this case, the fluid resistance material 10 is arranged as shown in the figure. By doing so, the viscous flow of the plating liquid around the nozzle can be significantly restricted.
第9に示されるめっき方法は流体抵抗材10の機能ある
いは効用を巧みに生かした例であり、被めつき処理物3
の両端面近傍に一対の噴射ノズル6及び吸引ノズル8を
配置し、この間を流体抵抗材10で連結することによっ
て被めっき処理物3及び流体抵抗材70相互間のめつき
液を高速で移動、撹拌せしめることにより、簡単な構造
をもってめっきの高速化を可能にしたものである。The plating method shown in the ninth example is an example that skillfully takes advantage of the function or effect of the fluid resistance material 10, and the plating method
A pair of injection nozzles 6 and suction nozzles 8 are disposed near both end faces of the plating process, and by connecting them with a fluid resistance material 10, the plating liquid is moved between the object to be plated 3 and the fluid resistance material 70 at high speed. By stirring, it is possible to speed up plating with a simple structure.
以上噴射ノズル及び吸引ノズルの配置例、流体抵抗材の
設置例について種々紹介したが、これ以外にも例えば被
めっき処理物の形状によっているいろな配置構造が考え
られる。Various examples of the arrangement of the injection nozzle and suction nozzle and examples of the installation of the fluid resistance material have been introduced above, but in addition to these, various arrangement structures can be considered depending on the shape of the object to be plated, for example.
E発明の効果J
本発明のめっき方法によれば、めっき液中の被めっき処
理物に噴射ノズルによるめっき液の吹付は及び吸引ノズ
ルによるめっき液の吸込みを同時に行うことにより、め
っき液中の被めっき処理物のめっき面近傍のめっき液を
高速撹拌しながら被めっき処理物をめっきするから、め
っき面近傍辷存在するめつき液全体をノズルの噴射吸引
作業により強制撹拌するため、従来の液中ノズル噴射方
式によるめっき方法の欠点を解消し、めっき面全体を高
い電流密度でしかも均一にめっきすることができる。し
たがってこの方法によればめっき速度の著しい向上並び
にめっき品質の向上をみることができ、特に長尺の被め
っき処理物を連続的にめっきする場合にはめっき作業の
著しい効率化をみることができる。又、本発明によれば
めっき面近傍のめつき液を強制循環することにもなるた
め、めっき液の清浄化あるいは清浄なめつき液の維持及
びそれによるめっき品質の向上にも効果がある。E Effects of the Invention J According to the plating method of the present invention, the plating solution is sprayed onto the object to be plated in the plating solution by the injection nozzle, and the plating solution is sucked by the suction nozzle at the same time. Since the object to be plated is plated while stirring the plating solution near the plating surface of the object to be plated at high speed, the entire plating solution existing near the surface to be plated is forcibly stirred by the jet suction operation of the nozzle. This eliminates the drawbacks of the spray plating method, and allows the entire plating surface to be plated uniformly with high current density. Therefore, this method can significantly improve plating speed and plating quality, and can significantly improve the efficiency of plating work, especially when continuously plating long objects to be plated. . Further, according to the present invention, the plating solution near the plating surface is forced to circulate, which is effective in cleaning the plating solution, maintaining a clean plating solution, and thereby improving the plating quality.
【図面の簡単な説明】
第1図は本発明の一実施例に係るめっき方法の概要説明
図、第2図(イ)、(ロ)はそれぞれめっぎ液中の被め
っき処理物の断面図、第3図くイ)は本発明の他の実施
例に係るめっき方法の概要説明図、第3図(ロ)は第3
図(イ)の側面図、第4図(イ)は本発明の他の実施例
に係るめっき方法の概要説明図、第4図(ロ)は第4図
(イ)の側面図、第5図、第6図、第8図及び第9図は
それぞれ本発明の他の実施例に係るめっぎ方法の概要説
明図、第7図は流体抵抗材の断面構造図、第10図は従
来例に係るめっき方法の概要説明図である。
1:めっき層、2:めっき液、
3:被めっき処理物、4:マスキングテープ、5:めっ
き所要部、6:噴射ノズル、
7:めっき面、8:吸引ノズル、9コ陽極、10:流体
抵抗材。
代理人 弁理士 佐 藤 不二雄
第1図
αロSt/ス+Iし[Brief Description of the Drawings] Figure 1 is a schematic explanatory diagram of a plating method according to an embodiment of the present invention, and Figures 2 (a) and (b) are cross sections of objects to be plated in a plating solution. Figure 3(b) is a schematic explanatory diagram of a plating method according to another embodiment of the present invention, and Figure 3(b) is a
FIG. 4(A) is a schematic explanatory diagram of a plating method according to another embodiment of the present invention; FIG. 4(B) is a side view of FIG. 4(A); 6, 8, and 9 are respectively schematic explanatory diagrams of plating methods according to other embodiments of the present invention, FIG. 7 is a cross-sectional structural diagram of a fluid resistance material, and FIG. 10 is a conventional FIG. 2 is a schematic explanatory diagram of a plating method according to an example. 1: Plating layer, 2: Plating solution, 3: Object to be plated, 4: Masking tape, 5: Required part for plating, 6: Spray nozzle, 7: Plating surface, 8: Suction nozzle, 9 anodes, 10: Fluid Resistance material. Agent: Patent Attorney Fujio Sato Figure 1 αRo St/S+I
Claims (6)
めっき液の吹付け及び吸引ノズルによるめっき液の吸込
みを同時に行うことにより、めっき液中の被めっき処理
物のめっき面近傍のめっき液を高速撹拌しながら被めっ
き処理物をめっきすることを特徴とする高速めっき方法
。(1) By simultaneously spraying the plating solution onto the object to be plated in the plating solution using the injection nozzle and sucking the plating solution through the suction nozzle, the plating solution near the plating surface of the object to be plated in the plating solution is removed. A high-speed plating method characterized by plating the object to be plated while stirring at high speed.
材であることを特徴とする特許請求の範囲第(1)項記
載の高速めっき方法。(2) A high-speed plating method as set forth in claim (1), wherein the object to be plated is a strip-shaped plate running in a plating solution.
の吹付け及び吸込みを広範囲にわたって行うことを特徴
とする特許請求の範囲第(1)項又は第(2)項記載の
高速めっき方法。(3) A high-speed plating method according to claim (1) or (2), characterized in that the plating solution is sprayed and sucked over a wide range using a plurality of injection nozzles and suction nozzles.
物のめっき面に沿って交互に配置することを特徴とする
特許請求の範囲第(3)項記載の高速めっき方法。(4) A high-speed plating method according to claim (3), characterized in that a plurality of injection nozzles and suction nozzles are arranged alternately along the plating surface of the object to be plated.
ルの背後からのめっき液の流れ込みを押えることにより
、噴射ノズル及び吸引ノズルによるめっき液の撹拌効果
を高めるようにしたことを特徴とする特許請求の範囲第
(1)〜(4)項記載の高速めっき方法。(5) A fluid resistance material is provided behind the injection nozzle to suppress the flow of the plating solution from behind the injection nozzle, thereby increasing the effect of stirring the plating solution by the injection nozzle and the suction nozzle. A high-speed plating method according to claims (1) to (4).
ることを特徴とする特許請求の範囲第(5)項記記の高
速めっき方法。(6) The high-speed plating method according to claim (5), wherein the fluid resistance material is a perforated plate or a mesh-like material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14965185A JPS6210293A (en) | 1985-07-08 | 1985-07-08 | High-speed plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14965185A JPS6210293A (en) | 1985-07-08 | 1985-07-08 | High-speed plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6210293A true JPS6210293A (en) | 1987-01-19 |
Family
ID=15479880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14965185A Pending JPS6210293A (en) | 1985-07-08 | 1985-07-08 | High-speed plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6210293A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679908A (en) * | 1995-11-08 | 1997-10-21 | Crucible Materials Corporation | Corrosion resistant, high vanadium, powder metallurgy tool steel articles with improved metal to metal wear resistance and a method for producing the same |
US5900560A (en) * | 1995-11-08 | 1999-05-04 | Crucible Materials Corporation | Corrosion resistant, high vanadium, powder metallurgy tool steel articles with improved metal to metal wear resistance and method for producing the same |
JP2009074126A (en) * | 2007-09-20 | 2009-04-09 | Dowa Metaltech Kk | Plating method and device therefor |
JP4686816B2 (en) * | 2000-05-30 | 2011-05-25 | 住友電気工業株式会社 | Plating method |
-
1985
- 1985-07-08 JP JP14965185A patent/JPS6210293A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679908A (en) * | 1995-11-08 | 1997-10-21 | Crucible Materials Corporation | Corrosion resistant, high vanadium, powder metallurgy tool steel articles with improved metal to metal wear resistance and a method for producing the same |
US5900560A (en) * | 1995-11-08 | 1999-05-04 | Crucible Materials Corporation | Corrosion resistant, high vanadium, powder metallurgy tool steel articles with improved metal to metal wear resistance and method for producing the same |
US5936169A (en) * | 1995-11-08 | 1999-08-10 | Crucible Materials Corporation | Corrosion resistant, high vanadium, powder metallurgy tool steel articles with improved metal to metal wear resistance and a method for producing the same |
JP4686816B2 (en) * | 2000-05-30 | 2011-05-25 | 住友電気工業株式会社 | Plating method |
JP2009074126A (en) * | 2007-09-20 | 2009-04-09 | Dowa Metaltech Kk | Plating method and device therefor |
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