JPS6210293A - High-speed plating method - Google Patents

Abstract

PURPOSE:To increase the plating speed and to improve the quality of plating by simultaneously carrying out the spraying and suction of a plating soln. with respect to a material to be plated in the plating soln. with an injection nozzle and a suction nozzle and agitating the plating soln. in the vicinity of the surface to be plated at high speed. CONSTITUTION:The spraying of a plating soln. 2 by an injection nozzle 6 and the suction of the plating soln. 2 by a suction nozzle 8 are simultaneously carried out with respect to a material 3 to be plated consisting of a strip sheet material, etc., and traveling in the plating soln. 2 in a plating bath 1. Consequently, the plating soln. 2 in the vicinity of the surface 7 of the material 3 to be plated is agitated at high speed. Plural injection nozzles 6 and suction nozzles 8 are alternately arranged along the surface 7 to be plated and the spraying and suction of the soln. can be carried out over a wide range. A fluid resisting material such as a perforated plate and a meshy material is provided at the rear of the injection nozzle 6 and the agitation effect is preferably enhanced.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a high-speed plating method, in particular, a method in which a plating solution is sprayed onto an object to be plated in a plating solution using a spray nozzle, and the plating solution is agitated. This invention relates to an improvement in a high-speed plating method.

[Conventional technology and problems] Conventionally, when continuously plating long strip-shaped plates, the method generally used is to run the strip-shaped plates through a plating solution and plate them continuously. However, this method has the drawback that the plating solution is not sufficiently stirred, resulting in slow plating speed and extremely low work efficiency. As a method to solve this problem, a plating method in which the plating solution is sprayed by a spray nozzle onto a strip-shaped plate running through the plating solution and the plating solution is agitated (for example, JP-A-54-1
According to this method, the plating solution near the plating surface of the strip-shaped plate material can be stirred, so a higher current density can be obtained compared to the first plating method. Work efficiency can be increased. However, experiments have shown that this method still does not sufficiently stir the plating solution.

In other words, visualization of the flow is real! ! According to method A (for example, by generating bubbles in the liquid and observing the flow of bubbles by shining a slit beam in the dark), as shown in FIG. A strip-shaped plate 3 running perpendicular to the plane of the paper in the plating solution as shown in a.
' After colliding with the plating surface 7, the plating liquid near the plating surface is F! Then, as shown by the arrow, the direction of the flow is changed to parallel to the plating solution 7 to stir the entire plating solution. In this case, the plating solution injected from the injection nozzle 6 collides with the plating 7 of the plate material 3' while pulling the surrounding plating solution in the same direction as shown by arrow C due to its viscosity, so that the collision force is weaker than that during injection. Further, the plating solution after the collision changes its direction to flow parallel to the plating surface 7 and flows radially into the surrounding stagnant solution, so that the stirring force gradually becomes weaker. Therefore, according to this method, the power of stirring the plating solution by the injection nozzle 6 is not sufficient, and the stirring power gradually becomes weaker as the distance from the injection nozzle 6 increases, making it impossible to uniformly stir the entire surface of the plating surface. . For this reason, it is not possible to uniformly plate a strip-shaped plate material with a high current density. In addition, in FIG. 10, 9 is an anode.

[Object of the Invention] The object of the present invention is to eliminate the drawbacks of the prior art described above, and to increase current density and improve work efficiency by vigorously and uniformly stirring the plating liquid near the plating surface at high speed. An object of the present invention is to provide a high-speed plating method capable of performing uniform plating without unevenness.

[Summary of the Invention] The present invention provides a method for spraying the plating solution onto the object to be plated in the plating solution by simultaneously spraying the plating solution with an injection nozzle and sucking the plating solution into the object to be plated in the plating solution. This method attempts to plate the object to be plated while vigorously and uniformly stirring the plating solution near the plating surface of the object at high speed.This makes it possible to increase the current density, improve work efficiency, and ensure uniform plating. It is something that

According to the present invention, it is possible to maintain the stirring force of the plating solution by the injection nozzle at the same level as when spraying.

[Example J] Next, an example of the high-speed plating method of the present invention will be described with reference to FIGS. 1 to 9 of the accompanying drawings.

That is, in FIG. 1, 1 is a plating tank, 2 is a plating solution, and 3 is an object to be plated immersed in the plating solution 2. As the object 3 to be plated, for example, a long belt-shaped metal plate such as a lead frame is used. Second (a)
, (B) respectively show a state in which the surface of the object 3 to be plated is coated with masking tape 4, and the required portion 5 to be plated is exposed. 6 is the plating process 7 of the object to be plated 3
8 is a plating liquid suction nozzle, and 9 is an anode. Note that the cathode is constituted by the object 3 to be plated. The plating solution supply means to the injection nozzle 5 was omitted.

In FIG. 1, the object to be plated 3 in the plating solution 2 is sprayed with the plating solution from the injection nozzle 5, and after colliding with the plating material 7 of the object to be plated 3, the plating solution is passed through the suction nozzle 8. Since it is sucked in, a uniform flow is formed with almost no resistance, and there is little decrease in flow velocity. Therefore, the plating solution on the plating surface 7 effectively utilizes the initial nozzle jet force.
It is stirred at high speed by the vigorous flow from the holder f.

As a result, the plating surface 6 is stirred uniformly at high speed, making it possible to perform uniform plating at a high current density.

Suction by the suction nozzle 8 can be performed by connecting it to a vacuum pump, for example, or by connecting it to the suction port of a commonly used circulation pump.

Here, the object 3 to be plated does not need to be a long object, and the object 7 to be plated does not necessarily have to have a smooth surface. Further, when plating both sides of the object 3 to be plated, an injection nozzle and a suction nozzle may be arranged on each side.

The arrangement of the injection nozzle and suction nozzle does not necessarily have to be as shown in Fig. 1. For example, an injection nozzle having a structure having a large number of injection ports and suction ports on the peripheral wall of the pipe as shown in Fig. 3 (a) and (b). 6 and the suction nozzle 8 may be arranged along the longitudinal direction of the object 3 to be plated. In this case, the plating solution injected from the injection nozzle 6 flows in the direction of the arrow in FIG. 3(b), that is, in the width direction of the object 3 to be plated, with a width corresponding to the length of the nozzle.

Regarding the arrangement of the injection nozzle and suction nozzle, please refer to Section 4.
They may be arranged as shown in Figures (A), (0), or Figure 5, and these include the injection nozzle 6 and the suction nozzle 8.
A plurality of books are arranged alternately.

Figure 3 (A) includes the plating method shown in Figures 2 (A) and (B).

In both of the plating methods shown in (b) and FIG. 5, the area where the plating solution is stirred at high speed by the injection nozzle 6 and the suction nozzle 8 can be considerably widened.

Therefore, according to these plating methods, the plating area of the object 3 to be plated can be made considerably large.
It has a remarkable effect on uniformity of plating when plating one or both sides of the object to be plated 3, and speeds up the plating work when continuously plating a moving object to be plated. It is. Among these methods, experiments have shown that the plating methods shown in FIGS. 3 and 4 are superior in terms of uniform plating. In the plating method shown in FIG. 5, the injection nozzle 6 and the suction nozzle 8 are arranged at angles with respect to the traveling direction of the coated plating object 3. According to this method, one part of the plating solution is Since the stirring can be made more mM, it can be expected that the stirring effect will be improved.

In the case of this method in which the plating solution is injected from the injection nozzle 6 in the plating solution 2, even if the suction nozzle 8 is provided, as explained in the prior art, as shown in FIG. The plating liquid around the injection nozzle 6 and the suction nozzle 8 is still pulled in the direction of the arrow d shown by the dotted line, which has the disadvantage that the stirring effect is reduced. The plating method shown in FIGS. 6 to 9 attempts to improve this drawback by installing a fluid resistance material. That is, according to FIG. 6, by arranging the fluid resistance material 10 made of a perforated plate as shown in FIG. 7 between the injection nozzle 6 and the suction nozzle 8, the plating liquid existing around these nozzles This significantly limits the viscous flow of This fluid resistance material 10
In addition to a perforated plate, it consists of a mesh-like material that allows ions in the liquid to pass through but creates resistance to flow. In the case of the fluid resistance material 10 shown in FIG. 7, it has been found that the fluid resistance effect can be exhibited by setting the hole diameter to 2 tta or less. The mesh-like material may be woven from fibers or fine wires. Such fluid resistance materials are usually made of insulators, but can also be made of conductors when used as anodes.

The plating method shown in FIG. 8 is a method in which a plurality of injection nozzles 6 and suction nozzles 8 are arranged alternately as in FIG. 4, but in this case, the fluid resistance material 10 is arranged as shown in the figure. By doing so, the viscous flow of the plating liquid around the nozzle can be significantly restricted.

The plating method shown in the ninth example is an example that skillfully takes advantage of the function or effect of the fluid resistance material 10, and the plating method
A pair of injection nozzles 6 and suction nozzles 8 are disposed near both end faces of the plating process, and by connecting them with a fluid resistance material 10, the plating liquid is moved between the object to be plated 3 and the fluid resistance material 70 at high speed. By stirring, it is possible to speed up plating with a simple structure.

Various examples of the arrangement of the injection nozzle and suction nozzle and examples of the installation of the fluid resistance material have been introduced above, but in addition to these, various arrangement structures can be considered depending on the shape of the object to be plated, for example.

E Effects of the Invention J According to the plating method of the present invention, the plating solution is sprayed onto the object to be plated in the plating solution by the injection nozzle, and the plating solution is sucked by the suction nozzle at the same time. Since the object to be plated is plated while stirring the plating solution near the plating surface of the object to be plated at high speed, the entire plating solution existing near the surface to be plated is forcibly stirred by the jet suction operation of the nozzle. This eliminates the drawbacks of the spray plating method, and allows the entire plating surface to be plated uniformly with high current density. Therefore, this method can significantly improve plating speed and plating quality, and can significantly improve the efficiency of plating work, especially when continuously plating long objects to be plated. . Further, according to the present invention, the plating solution near the plating surface is forced to circulate, which is effective in cleaning the plating solution, maintaining a clean plating solution, and thereby improving the plating quality.

[Brief Description of the Drawings] Figure 1 is a schematic explanatory diagram of a plating method according to an embodiment of the present invention, and Figures 2 (a) and (b) are cross sections of objects to be plated in a plating solution. Figure 3(b) is a schematic explanatory diagram of a plating method according to another embodiment of the present invention, and Figure 3(b) is a
FIG. 4(A) is a schematic explanatory diagram of a plating method according to another embodiment of the present invention; FIG. 4(B) is a side view of FIG. 4(A); 6, 8, and 9 are respectively schematic explanatory diagrams of plating methods according to other embodiments of the present invention, FIG. 7 is a cross-sectional structural diagram of a fluid resistance material, and FIG. 10 is a conventional FIG. 2 is a schematic explanatory diagram of a plating method according to an example. 1: Plating layer, 2: Plating solution, 3: Object to be plated, 4: Masking tape, 5: Required part for plating, 6: Spray nozzle, 7: Plating surface, 8: Suction nozzle, 9 anodes, 10: Fluid Resistance material. Agent: Patent Attorney Fujio Sato Figure 1 αRo St/S+I

Claims (6)

[Claims] (1) By simultaneously spraying the plating solution onto the object to be plated in the plating solution using the injection nozzle and sucking the plating solution through the suction nozzle, the plating solution near the plating surface of the object to be plated in the plating solution is removed. A high-speed plating method characterized by plating the object to be plated while stirring at high speed. (2) A high-speed plating method as set forth in claim (1), wherein the object to be plated is a strip-shaped plate running in a plating solution. (3) A high-speed plating method according to claim (1) or (2), characterized in that the plating solution is sprayed and sucked over a wide range using a plurality of injection nozzles and suction nozzles. (4) A high-speed plating method according to claim (3), characterized in that a plurality of injection nozzles and suction nozzles are arranged alternately along the plating surface of the object to be plated. (5) A fluid resistance material is provided behind the injection nozzle to suppress the flow of the plating solution from behind the injection nozzle, thereby increasing the effect of stirring the plating solution by the injection nozzle and the suction nozzle. A high-speed plating method according to claims (1) to (4). (6) The high-speed plating method according to claim (5), wherein the fluid resistance material is a perforated plate or a mesh-like material.