JP2535497B2 - Electrolytic plating method and electrolytic plating apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic plating method and an electrolytic plating apparatus.

[0002]

2. Description of the Related Art In electroplating, a solid metal salt is submerged in the bottom of a plating tank in which an electrolytic solution is stored, and a material to be plated is immersed in the electrolytic solution. Is used as an anode and a voltage is applied to gradually dissolve the metal salt in the electrolytic solution and deposit the metal salt on the surface of the material to be plated.

[0003]

As the plating process progresses (the more the metal salt dissolves), the outer shape of the metal salt becomes smaller. For this reason, the surface of the metal salt and the surface of the material to be plated are reduced. Will be separated from the distance. as a result,
There was a possibility that the plating thickness would be uneven. The present invention has been made in view of the above circumstances, and in the case where the material to be plated has a linear or strip shape, it is possible to perform plating of a uniform thickness on the surface of the material to be plated. It is an object of the present invention to provide an electrolytic plating method and an electrolytic plating apparatus.

[0004]

In order to achieve the above object, the present invention takes the following technical means. That is, the electrolytic plating method according to the present invention applies a voltage by using a material to be plated as a cathode and a metal salt solution as an anode while running a linear or strip-shaped material to be plated in a work guide immersed in a metal salt solution. In the electrolytic plating method, the metal salt solution is flown into the work guide and the metal salt solution is applied to the work guide.
It is characterized by flowing along the running material to be plated while guiding the flow .

Further, the electrolytic plating apparatus according to the present invention includes a liquid receiving tank, a solution supply device for supplying a metal salt solution into the liquid receiving tank, and a linear or strip-shaped material to be plated in the liquid receiving tank. A work traveling device for traveling, an anode / work guide formed of an insoluble electrode material that is immersed in a metal salt solution in a liquid receiving tank and is provided in parallel with the moving direction of the material to be plated, and the liquid receiving device. in the electrolytic plating apparatus comprising a cathode brush provided so as to contact with the plating material inside or outside of the tank, the workpiece guide is provided in pairs in the running direction of the plating material, both the work between both work guide Guide to substantially close the respective inner ends of which is arranged word over click passage tube, through the material to be plated in the work passage pipe
Is bulk allowed and is connected to the solution supply device solution jet path forming a jet of the solution jet paths of this metal salt solution both Wakuga
Guide along the material to be plated so as to flow into the guide.
The feature is that it is oriented to the guide .

[0006]

In the present invention, the metal salt solution supplied from the solution supply device to the work passage pipe is supplied to the workpiece by the solution jetting passage formed in the work passage pipe. Flows in parallel while surrounding the outer peripheral surface. At this time, the metal salt solution comes into substantially uniform contact with the entire circumference of the material to be plated, and is supplied in a large amount without changing the distance from the material to be plated. Further, the metal salt solution has a relative velocity with respect to the material to be plated, and the metal ion concentration near the surface of the material to be plated in both work guides is always kept substantially uniform. Therefore, plating having a uniform thickness can be obtained over the entire circumference of the material to be plated. Of course, since the material to be plated is running, it is plated with a uniform thickness in the longitudinal direction.

Further, since the work passage pipe is arranged between the pair of work guides, the metal salt solution is simultaneously sprayed into both the work guides in front of and behind the work passage pipe,
Immersion time during the plating process becomes long, and the plating thickness obtained in one process becomes large. In particular, when the metal salt solution is sprayed before passing, the relative speed between the material to be plated and the metal salt solution increases, and plating is performed at a higher speed. Since the metal salt solution in the work passage pipe is provided in close proximity to the work passage pipe with both work guides, the metal salt solution is surely sprayed inside the work guide and, at the same time, the solution is less scattered.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of an electrolytic plating apparatus according to the present invention, in which 1 is a liquid receiving tank in which plating is performed, 2 is a work traveling device, and 3 is a solution supply device. In this embodiment, as apparent from FIG. 2, five wires as the material W to be plated can be plated at one time.

As shown in FIGS. 2 to 3 , the liquid receiving tank 1 is used.
Is divided into three tank parts 4, 5, 6 as a whole. The tank portion 5 at the center is long, and a work passage pipe 7 is provided at the center portion in the longitudinal direction such that both end openings (the inlet portion 8 and the outlet portion 9) are directed along the same direction. This work passage pipe 7 is one in which the nozzle end 11 is attached to the branch ports on both sides in the horizontal direction of the cheese pipe 10 by screwing, press-fitting, or adhering, and as shown in FIG. It is arranged to pass through the inside. Inside each of the nozzle ends 11, there is formed a small diameter portion which is tapered from both sides toward the central portion. The inner diameter of this small diameter portion is 2 times the outer diameter of the material W to be plated.
It is formed so as to be about 3 times. This work passage pipe 7 is connected to a liquid supply main pipe 12 having a portion that crosses the bottom of the tank portion 3, and this liquid supply main pipe 12 is connected to the solution supply device 3 (see FIG. 1) described above. ing. Further, with reference to FIG. 4, a solution that causes the solution supplied from the solution supply device 3 to flow through the work passage pipe 7 from both the inlet 8 and the outlet 9 while surrounding the material W to be plated. A jet flow path is formed.

Then, as shown in FIGS. 2 and 3, the end portions of the work guides 15 are arranged in close proximity to the inlet portion 8 and the outlet portion 9 of the work passage tube 7. The work guide 15 is composed of a pair of plate materials arranged so as to sandwich the passage of the material to be plated W from both sides, and is immersed in the metal salt solution in the liquid receiving tank 1 to move the material to be plated W. It is provided parallel to the direction. And this work guide 1
In Fig. 5, each plate material is formed of an insoluble electrode material and also serves as an anode electrode.

Cathode brushes 16 are provided in the tank portions 4 and 6 before and after the liquid receiving tank 1 so as to be suspended corresponding to the passages of the material to be plated W and to bring the lower surface into contact with the material to be plated W. Has been. Reference numeral 17 is a guide roller. Next, the electrolytic plating method of the present invention will be described. The material W to be plated is passed through the inside of the work passage tube 7 and between the plate materials of the work guide 15 and is set to be in contact with the cathode brush 16.
In addition, a through hole or a slit (not shown) through which the material to be plated W is passed is provided in the partition wall that partitions the tank portions 4, 5, and 6 of the liquid receiving tank 1. The solution supply device 3 is operated so that the metal salt solution is supplied into the work passage pipe 7. As the metal salt solution, a metal salt (for example, zinc) having a dissolved concentration of 500 g / l was used. As a result, the metal salt solution comes into contact with the material W to be plated in the work passage pipe 7 while the inlet portion 8 and the outlet portion 9 of the work passage pipe 7 are in contact.
It flows out of the tank portion 5 into the tank portion 5 and accumulates in the tank portion 5, but the work passage pipe 7 (nozzle end 11)
Since a small-diameter portion is provided inside, the outflow is speeded up to the injection state. Therefore, even if the tank 5 is not provided, the material W to be plated is at least in the work passage tube 7 and is immersed in the metal salt solution. After the metal salt solution in the tank 5 has accumulated to a level where it contacts the work guide 15, the work guide 15 (anode) and the cathode brush 16 (cathode)
A voltage is applied between and. The current density at this time is 200
A / dm ² . Then, the work traveling device 2 is operated to cause the material W to be plated to travel at high speed. At this time,
The metal salt solution jetted from the work passage pipe 7 jets in parallel while having a relative speed while surrounding the outer peripheral surface of the material W to be plated running inside the work guide 15, and due to this jet flow, metal The salt solution comes into uniform contact with the entire circumference of the material to be plated. As a result, the metal salt dissolved in the metal salt solution is deposited on the surface of the material W to be plated, and plating having a uniform thickness can be obtained.

Incidentally, for reference, in the conventional electrolytic plating, the concentration of zinc sulfate in the state where the solid metal salt is immersed in the electrolytic solution to perform the plating treatment becomes 360 g / l, and The current density of the voltage applied between the salt (anode) and the material to be plated W (cathode) was 40 A / dm ² . In the electrolytic plating apparatus of the present invention, a plurality of liquid receiving tanks 1 (as a configuration including the work passage tube 7, the work guide 15, and the cathode brush 16) are provided in series,
It is possible that the plating process is performed in multiple stages. Thereby, the plating thickness can be adjusted.

[0013]

According to the plating method of the present invention, the metal salt solution is flowed in parallel with the relative speed with respect to the material to be plated traveling in the work guide while surrounding the outer peripheral surface thereof. The salt solution can be brought into uniform contact with the entire circumference of the material to be plated, and the metal ion concentration in the vicinity of the surface of the material to be plated in the work guide can always be kept substantially uniform. Therefore, it is possible to perform plating with a more uniform thickness not only in the longitudinal direction of the material to be plated but also in the entire circumference.

According to the plating apparatus of the present invention, in addition to the above effects, a pair of work guides are provided in the traveling direction of the material to be plated, and a work passage pipe for passing the material to be plated is arranged between both work guides. Therefore, a product having a large plating thickness can be economically manufactured. Further, since the work passage pipes are arranged in the vicinity of both the work guides, the work passage pipes can be surely ejected inside the both work guides, the scattering of the metal salt solution is reduced, and the working environment is improved.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram showing an embodiment of the present invention.

FIG. 2 is an enlarged plan view showing the liquid receiving tank of FIG.

FIG. 3 is an enlarged front sectional view showing the liquid receiving tank of FIG.

FIG. 4 is an enlarged front sectional view showing a main part of a work passage tube.

[Explanation of symbols]

 1 Liquid Receiving Tank 2 Work Traveling Device 3 Solution Supply Device 7 Work Passing Pipe 15 Work Guide 16 Cathode Brush

Claims (2)

(57) [Claims] 1. An electrolytic plating method in which a linear or strip-shaped material to be plated is run in a work guide immersed in a metal salt solution, and a voltage is applied using the material to be plated as a cathode and the metal salt solution as an anode, Flow the metal salt solution into the work guide and
While guiding the metal salt solution flow in Ido, electrolytic plating method characterized in that flowed along a material to be plated traveling. 2. A liquid receiving tank, a solution supply device for supplying a metal salt solution into the liquid receiving tank, and a work running device for running a linear or strip-shaped material to be plated in the liquid receiving tank.
An anode / work guide formed of an insoluble electrode material that is immersed in a metal salt solution in the liquid receiving tank and is provided in parallel with the moving direction of the material to be plated, and plating is performed inside or outside the liquid receiving tank. In an electroplating apparatus including a cathode brush provided so as to contact a material, a pair of the work guides are provided in the traveling direction of the material to be plated, and the inner ends of both work guides are provided between the work guides. > and is arranged word over click passage tube to substantially close, this is the work passage tube solution jet path connected to the cause and solution supply device passes through the plating material is formed, the solution jet passage metal salt
To guide by injecting a jet of solution into both work guides
An electroplating apparatus characterized in that the work guides are oriented along the material to be plated .