JPS5858292A - Plating device for plating object having micropore - Google Patents

Abstract

PURPOSE:To plate the inside of the micropores of an object to be plated efficiently by sandwiching said object horizontally in a plating cell, making the object to a cathode, injecting high velocity plating solns. into the mocropores of the object and subjecting the object to a rocking treatment. CONSTITUTION:An object 1 to be plated which is a printed wiring board is fed into a plating cell 3, and is sandwiched horizontally with guiding rolls 10. This object is converted to cathode by cathode rolls 11. Flow 16 of a plating soln. is injected through the opening 13 of a nozzle 12 at a high velocity so as to be admitted into the many micropores of the object 1 facing the opening 13. Then electric current flows to the object 1 from insoluble anodes 17 and soluble anodes 18 in an anode chamber 19, and the anode ions of the flow 16 deposit. During the time of the plating treatment, a partition wall 7 is moved back and forth together with the rolls 10, the rolls 11 and the 2nd supporting rolls 15 on a pass line 4 by means of a pressure cylinder 9, whereby the object 1 is rocked, and plated with good efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating apparatus, and particularly to a plating apparatus most suitable for plating printed wiring boards and other plated objects having minute holes.

Many techniques have been proposed in the past as apparatuses for plating plated objects having micropores, such as printed wiring boards. For example, Japanese Patent Publication No. 55-46473 [-Apparatus for plating the inner surface of a hole penetrating a plate], Japanese Patent Publication No. 53-124
No. 771 “Through hole plating method for multilayer printed board”
It has been known. In the former, printing is carried out by moving the latitude line board in a horizontal state via a cathodized guide rail, and letting the plating solution flow down from the bottom opening of the plating solution tank provided above the pass line, into the microholes of the printed wiring board. The plating solution is allowed to flow down. Then, several bundles of the plating solution flowing down into the microholes are used as current-carrying paths, and plating is performed by allowing current to flow from an anode plate separately provided below the above-mentioned pass line. In the latter case, nozzles were placed on both sides of the printed wiring board's beautiful holes, aligned with the microhole positions, and the plating solution was sprayed into the microholes from both nozzles, and the plating solution was applied according to the measured values of the deposition voltage and current. Plating is performed while adjusting the distance between the application electrode and the microhole. However, in the former case, in this conventional example, the plating solution simply flows down by using gravity to pass the plating solution through the micropores, so if the micropores are extremely small in size, There is a problem in that it becomes difficult for the plating solution to enter the micropores. In addition, although the latter problem can be solved by using the above-mentioned OL, the nozzles need to be installed in accordance with the positions of the micro holes, so it is difficult to position the many nozzles for the many micro holes, and the entire device becomes considerably complicated. There is a problem with this.

The present invention has been made by focusing on such conventional plating equipment, and it is possible to freely move the plated object in a horizontal state via a guide roller in a plating process ellipse, and to freely turn it into a cathode, and to freely spray the plating solution. A microhole characterized in that the opening of the nozzle is placed close to either above or below the pass line of the plated object in the plating process ellipse, and a high-speed plating liquid flow is applied to the microhole located at a position opposite to the nozzle opening of the middle part. The present invention aims to provide a complete plating apparatus for plating objects having the following characteristics.

below! 11! DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to figures showing examples.

First, an explanation will be given with reference to FIGS. 1 to 4. Reference numeral 1 denotes a printed wiring board as a plated object, and there are lines 4 on both the input and exit sides of the board for horizontally moving the plated object 1. The inlet 5 and the outlet 6't are each opened. A partition wall 7 is provided in the plating tank 3 to form a processing zone 8t, and is connected to a pressure cylinder 9 serving as a locking device, and is connected to a pressure cylinder 9 that serves as a locking device for handling the plated material 1 on the pass line 4, as will be described later. It is designed to be able to move back and forth. A plurality of upper and lower pairs of guide rollers 10 are supported on the partition wall 7, and a pair of upper and lower canter rollers 11 are also supported between these guide rollers 10. The guide roller 10 holds the plated object 1 and moves to the left Lv right in the figure on the full pass line 4, and the guide roller 1 near the opening 13 of the nozzle 12 which will be described later
01A is also used as the first support roller. Kan-
The draw 211 similarly holds the plated article 1 and allows a cathode current to flow through the plated article 1. Note that 14 is a backup roll. A second support rake 15 is positioned on the opposite side of the pass line 4 facing the opening 16 of the nozzle 12. This second support roller 15 is connected to the nozzle 1
When the plating liquid flow 16 is sprayed and pressure is applied to the plated object 1, the plated object 1 is supported. 10m, these guys F with narrow spacing of 10m
Low 210m, plated 1 at 10m? The second support roller 15 may be omitted if sufficient support is provided.

The nozzle 12 is capable of spraying a large amount of plating solution or continuously, and is opened either above or below the pass line 40.
3 are placed close together.

In the example shown in FIG. 1, the nozzle 12 is located below the pass line 4, and in the example shown in FIG. However, the present invention is not limited to these examples, and the nozzle 12 may be placed either above or below the pass line 4 of the plated object 1.
It suffices if six warehouses are placed close to each other, and it does not matter whether the number is singular or plural.1. The reason why the opening 13 is placed close to either the upper or lower side of the pass line 4 is that, as shown in Figure IN5, the plating liquid flow 16 injected from the nozzle 12 is normally branched off from the liquid flow 16m that travels straight. Since the flow velocity of the liquid 116 flowing in the horizontal direction tends to be the liquid flow 16a and the liquid R and 16b, in the present invention, the distance between the light weight of the nozzle 12 and the pass line 4 [specific VC plated object 1] is 1s t.
The injection diameter W1 of the nozzle 12 is extremely large compared to the diameter of the microhole 2, so that the flow of both liquids is 16 m,
The relationship between the flow velocity of the plating liquid flow 16b is set such that liquid flow 16m≧liquid flow 16b, so to speak, a "dynamic pressure" of the plating liquid flow 16 as shown is applied to the microhole 2. As a result, ions can be supplied sufficiently and continuously, and secondly, the cathode current density can be increased to the inside of the micropores 20. .

The nozzle 12 has an insoluble anode near the opening 16.
i- and an anode chamber 19t- for filling the soluble anode 18 as required.

20 is a rectifying plate, and 21 is a communication port to the anode chamber 19.

Various structures can be employed for providing the insoluble anode 17vi in the vicinity of the opening 13. For example, in FIG. 6H), the insoluble anode 17m is provided with the front surface 12aK of the nozzle 12 exposed, and in FIG. In addition to insoluble ano-Y17b and 17btC, an insoluble ano-Y17e node 17e is also provided at the center. If a wide opening 161 is adopted, the injection area of the plating liquid flow 16 can be increased accordingly, and in this case, an insoluble anode 17c is placed in the center.
1 to prevent the current distribution from becoming non-uniform.

Insoluble anodes 17b, 17b, 17cK: As shown in FIG.
By using this method, it is possible to prevent the plating from being deposited thickly on the plated parts 1 and 4.

Furthermore, in FIG. 7H) 7i, the insoluble anode 17a
, 17a are exposed at the front surface 12a of the nozzle 1'2, but are exposed in a smaller area than in the case of FIG. 6(A). Another insoluble node 17@ is provided in the center of the wide opening 16, and an insulating material 21t is attached to the green side of the opening 13m. The method of installing the insulating material 21 is as shown in Figure 7 (P).
B is formed and the insulation #21t combination is fixed there with screws 22.

Further, in Fig. 8 I) Stem), the insoluble anode 17 of Fig. 3
Similarly, insoluble anodes 17f, 17f, and 17g are arranged at a portion slightly recessed from the front surface 121 of the nozzle 12 to prevent the plating from thickly depositing on the side of the plated object 1.

In Fig. 9 K) +01, insoluble anode 1 on both sides
For 7h, 17k, the central insoluble anode 17
1 are used in combination in the same manner as in the previous embodiment, and the central insoluble anode 17t has both ends set back with respect to the injection direction of the plating i[ff116, and is 1 m away from the complete surface of the nozzle 12, and Is is It<Is. It is designed to have an arcuate shape so that the so-called "dogbone dust" phenomenon does not occur.

Furthermore, in #110 diagram t(l), mesh-like insoluble anodes 17j, 17k are attached to the entire surface or inside of the opening 13 of the nozzle 12 111KIj.

Furthermore, in FIGS. 11(a) and 11(b), a plurality of round bar-shaped insoluble anodes 17l are arranged in the opening 13 of the nozzle 12 so as to form a circular arc.

Next, the combined use of the insoluble anodes 17, 17a to 17/ and the soluble anode 18 will be explained. Generally speaking,
Insoluble anodes 17, 17a to 17j plated 1 [
It is preferable to keep the distance between the soluble anode 18 and the plated object 1 [cando] as small as possible and bring them close together, but in order to obtain uniformity of the plating thickness, it is also desirable to keep the distance between the soluble anode 18 and the plated object 1 [cando] as small as possible and bring them close together. .

By the way, if only the insoluble anodes 17, 17a to 171 are used, the generation of hydrogen at the Va electrode where the voltage is significantly high and the generation of anode accumulation will increase, resulting in a decrease in the deposition efficiency. Consumption is huge. Therefore, the soluble anode 1 is combined with the insoluble anodes 17.17a to 171.
8, the precipitate fA can be increased even though the voltage is lowered. In addition, when only the soluble anode 18 is used, it is easier to make the plating thickness uniform, and in order to achieve a high current density, a correspondingly large anode with a thorny surface is required, which requires an increase in the size of the entire plating equipment. However, as mentioned above, an insoluble anode 17.17
When used in combination with 1 to 171, there is no need to increase the size of the 19 device. Furthermore, to explain the electrolytic bath using a sulfuric acid steel bath as an example, the phosphorus content in the copper anode material, the non-uniform precipitation of precipitates such as black film that forms and adheres to the anode coating surface, etc. Although it is prone to step plating, poor appearance, and increased consumption of brighteners, these disadvantages can be significantly overcome by using an insoluble anode and a soluble anode together.

As the dissolvable anode 18, an oval rod-type anode is normally used, but in the present invention, instead of this, a granular anode called a small sphere, a shot-like anode, or a broken vinyl scrap wire is used. It is preferable to use an anode that has been peeled off and cut in this way, or an anode that is in the form of an Ij piece.

Next, the entire operation of this embodiment will be explained.

Printed wiring board 1 as a plated product has a population of 5j! When the printed wiring board 1 is fed into the smudge treatment tank 3, the upper and lower surfaces of the printed wiring board 1 are held by a pair of guide rollers 10 and moved in the direction of the outlet 6 in a horizontal state. Becomes cathodized. and nozzle 12
A plating solution flL16 is sprayed at high speed from the opening 16 and is applied to the many microholes 2 of the printed wiring board 1 facing the opening 13. The printed wiring board 1 is coated with steel foil 2.5 on both sides as shown in FIG. , the electric current flows into this copper plating layer 24 from the insoluble anode 17, the soluble anode 18 in the anode chamber 19, etc., and the anode ions of the plating solution fij6 flow into each microscopic hole 2. The electroless steel plating layer 24 inside the hole 2 will be folded into the soil. The plating tank 3 may be filled with a plating solution in advance and allowed to overflow, or the plating solution ft16 may be simply sprayed from the nozzle 12 to perform rainbow plating.

In the former case, the plating solution flow 16 injected into the plating solution filled in the plating tank 3 is the plating product IK.
When colliding, a plated object 1 exhibits an agitation pattern 1!1.
And "dynamic pressure" is applied to the micropores 2. During these plating processes, the partition wall 7 together with the guide roller 1o, the can roller 11, and the second support row 215 is reciprocated on the pass line 4 by the pressure cylinder 9, so that A so-called locking process is applied to achieve efficient plating. This locking process can also be performed by circular or elliptical movement in addition to reciprocating movement on a horizontal plane.Furthermore, instead of locking the plated object 1 as described above, the nozzle 1211fa
It is also possible to perform

Next, an embodiment in which a soluble anode is used in addition to an insoluble anode will be described with reference to FIGS. 12 to 14'. First, the structure of the embodiment shown in FIGS. 12 to 14 will be described.

The nozzles 25 are disposed above or below the plated article pass line 4, or vertically opposed to each other by being shifted by ti in the moving direction of the plated article 1, and are arranged close to the pass line 4,
Since the shape and structure of each nozzle are the same, only one nozzle 25 will be described below. First, the 14th
As shown in the figure, this nozzle 25 has a nozzle opening 26 having a length W corresponding to the left and right width of the plated object 1 and an appropriate width Nak.

Plating liquid leaks into the nozzle 25! ! 27°28
In preparation for this, a position along the plating solution outflow paths 27 and 28, in the illustrated example, a position II between the plating solution outflow paths 27 and 28.
, 1ζ anode chamber 29 is divided and provided. The anode chamber 29 has an opening 60 for inflowing the plating solution at the end thereof, and a mesh body 31 is provided in the opening 60. Further, an anode case 62 made of, for example, titanium can be inserted into the anode chamber 29, and a soluble anode 36 can be stored inside the anode case 62. In the case of copper plating, the soluble anode 33 is filled in the anode case 32 with a ball-shaped, chip-shaped, plate-shaped, rod-shaped copper anode, or the like. The soluble anode 63 dissolves and decreases in quantity as the plating process progresses, so an opening/closing lid 34 is attached to the anode case 32 so that it can be replenished as needed.
-11135 on the upper plate of No. 5 is removable. Further, the anode case S2 is provided with a large number of through holes 66 so that the soluble anode 63 inside can be easily dissolved, and the support part 3
It is positioned in the anode chamber 29 via the anode chamber 29, leaving a space 38 above and below it. The purpose of providing the space 68 above and below is to electrically prevent hair node ions from collecting on the upper and lower edges of the plated object 1 during plating and to enable uniform plating. 68
It is also possible to adopt other means instead. Furthermore, this anode case 32 is entirely connected to the port 17, for example.
It is surrounded by an anode pack 39 made of fluoropyrene. This anode bag 69 is a soluble anode 63
This is to prevent the formation of sludge, that is, the adhesion of sludge to the surface of the plated object 1, but it is not always necessary and can be omitted. 40 is an air bleed conduit.

An insoluble anode 17m is attached near the light leakage of the nozzle opening 26 of the nozzle 25, and a rectifying plate 41 is attached inside the opening 26.

A guide portion 42 is formed integrally with the nozzle 25 outside the nozzle opening 26 [FIG. 12] so that the plating liquid flow after colliding with the plated object 1 becomes a branch flow and flows along the plated object 1. You can also do this.

Next is the effect on this example? explain.

The plating solution from the nozzle opening 2619 will be injected toward the pass line 4, but since the anode chamber 29 is divided and provided in the nozzle 25 at a position along the plating solution flow path 27, 28, the opening 60 Although the plating solution flows into the anode chamber 29 through the mesh body 31t through the plating solution outlet channels 27 and 28, the stirring state thereof is relatively weak. The plating solution that has flowed into the anode chamber 29 fills the anode chamber 29, so that the soluble anode 66 passes through the anode case 62 and the anode hack 69 completely and dissolves into the plating solution. When the anode chamber 29 is filled with plating solution, the anode chamber 29173
The air that was present in the
It is expelled to the outside. The plating solution then comes into contact with the insoluble anodes 17m, 17m disposed near the tip of the opening 26, and ions are supplied thereto. This insoluble anode 17m, 1
The effect of the combined use of 7m and the soluble anode 63 is the same as that described in the previous embodiment, so repeated explanation will be omitted.

Next, another embodiment will be described based on FIGS. 15 and 16. In the previous embodiment, as shown in FIG.
is provided at a position "along" the plating solution outflow path 27.28 in the nozzle 25 between both of these plating solution outflow paths 27.28, and an opening 30 for plating solution inflow is provided at the tip of the anode chamber 29. However, in the embodiment shown in FIG. 15, a plating solution outflow path 45 is formed in the center of the nozzle 25, and anode chambers 46 are arranged on both sides thereof. The anode chamber 46 is communicated with the plating solution outflow path 45 through an opening 47 and a mesh 48 stretched over the opening 47. The position of the opening 47 is such that the plating solution can easily flow into the anode chamber 46 from the plating solution outflow path 45, and at the same time, the agitation of the inflow to remove the solution does not occur. In addition, 43 is an insoluble anode. Further, in the embodiment shown in FIG. 16, the anode chamber 49 is connected to the plating solution outlet passage 5 in the same manner as in the embodiment shown in FIG.
It is located on both sides of 0, but the 1st F1 entrance 51 is located at 21 places.
and a second opening 52 and each first . Second opening 5
1 and 52 are provided with mesh bodies 55 and 53. Note that 44 is an insoluble anode.

The other configurations and functions of the embodiment shown in FIGS. 15 to 16 are almost the same as those of the previous embodiment [FIGS. 15 to 16], so the same or similar parts are denoted by the same reference numerals in the drawings and redundant explanations will be given. omitted. Note that illustration of the anode case 62, anode pack 69, and the like is omitted in FIGS. 15 and 16.

As explained above, according to the present invention, it is possible to efficiently perform plating into a large number of micropores of a plated object, and the nozzle openings can be arranged close to each other by shifting the position above and below the pass line of the plated object. Then, insert both 1i into the microhole.
A uniform layer of gold can be deposited on the entire inner surface, including near the entrances on both sides of the micropores, by passing a plating solution flow through it.
In addition, if the anode is placed near the opening of the nozzle close to the pass line, the anode will be placed close to the plated object, making it possible to obtain an extremely high cathode current density even with ordinary plating equipment. This method has many excellent effects, including the ability to efficiently perform plating on a large number of micropores in a plated object.

[Brief explanation of the drawing]

Fig. 1 is a schematic longitudinal sectional view showing one embodiment of the plating apparatus according to the present invention, Fig. 2 is a longitudinal sectional view equivalent to Fig. 1 showing another embodiment, and Fig. 3 is an enlarged longitudinal sectional view showing the main parts. 4 is an enlarged cross-sectional view of the part indicated by the arrow ■ in FIG. 3, FIG. The stem) is a sectional view of the nozzle tip showing examples of insoluble anodes, and the arrow ri in Fig. 6
- A sectional view along the pi line, FIG. 7 Kl is a sectional view of the nozzle tip showing another embodiment of the insoluble anode, and FIG. 7 TPL is an arrow te in FIG. 7 (A).
11 is an exploded perspective view of the nozzle tip shown in FIG. Top view of the nozzle tip seen in direction F, #! Figure 9 B) is a sectional view of the nozzle tip showing still another embodiment of the insoluble anode, and Figure 9 I
Q+ is a cross-sectional view taken along the line Fff)--1 in the same figure; 1 is a partial perspective view of the nozzle tip showing still another embodiment of the insoluble anode, FIG. ? The longitudinal cross-sectional views of the nozzle shown in FIGS. 13 and 14 are respectively indicated by the arrows ■■-■ in FIG.
■ line, cross-sectional view along ■■-■■ line, Figures 15 and 16
Each figure is a nozzle longitudinal sectional view showing still other embodiments of the nozzle. 1 Plated item (printed wiring board) 2
Micro hole 3 Plated cypress 4 Pass line 7 Partition wall 9 Pressure cylinder 10, 10a Guide roller 11 Canter roller 12.25 Nozzle 13.13m, 26 Opening 16.16m, 16b Plating liquid flow 18.65 Dissolvable anode 19 .29,46,49 Anode chamber 21
Insulating material

Claims (1)

[Claims] The plating object can be moved horizontally in the plating tank via guide rollers and can be cathodized, and the opening of the nozzle, which can spray the plating solution, is placed above or below the pass line of the plating object in the plating tank. 1. A plating apparatus for plating a plated object having microholes, characterized in that the microholes are arranged close to each other and a high speed plating liquid flow is applied to the microholes located at a position opposite to the nozzle opening of the plating object.