JPS6199065U - - Google Patents
Info
- Publication number
- JPS6199065U JPS6199065U JP18475684U JP18475684U JPS6199065U JP S6199065 U JPS6199065 U JP S6199065U JP 18475684 U JP18475684 U JP 18475684U JP 18475684 U JP18475684 U JP 18475684U JP S6199065 U JPS6199065 U JP S6199065U
- Authority
- JP
- Japan
- Prior art keywords
- pressing member
- pressing
- semiconductor device
- lead
- ball screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 2
- 235000014676 Phragmites communis Nutrition 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の一実施例による半導体装置の
試験装置の構成図、第２図は従来の半導体装置の
試験装置の構成図、第３図は従来、及び上記実施
例の被試験半導体装置の斜視図である。
１…被試験半導体装置、３…リード、５…測定
用基板、２１…押え蓋（押圧部材）、２１ａ…押
圧片（突部）、２３…ボールネジ、２４…支持リ
ング（支持部材）、２７，２９…上、下ストツパ
、２８…ソレノイド、３２…モータ。
FIG. 1 is a configuration diagram of a semiconductor device testing device according to an embodiment of the present invention, FIG. 2 is a configuration diagram of a conventional semiconductor device testing device, and FIG. 3 is a configuration diagram of a conventional semiconductor device testing device and a semiconductor device under test according to the above embodiment. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor device under test, 3... Lead, 5... Measurement substrate, 21... Holder lid (pressing member), 21a... Pressing piece (protrusion), 23... Ball screw, 24... Support ring (supporting member), 27, 29...Upper and lower stopper, 28...Solenoid, 32...Motor.
Claims (1)
を押圧して接触接続せしめた状態で上記被試験装
置の特性を試験する装置において、上記リードを
押圧するための押圧部材と、該押圧部材を上方に
開いた上昇位置と上記リードを押圧する下降位置
との間で揺動駆動する押圧部材駆動装置とを備え
たことを特徴とする半導体装置の試験装置。 (2) 上記押圧部材は、その前部下面に上記リー
ドを押圧するための突部を有する棒状体であり、
上記押圧部材駆動装置は、上記押圧部材の略中央
を揺動可能に支持する支持部材と、上下方向に設
けられ上記支持部材と螺合するボールネジと、該
ボールネジを回転駆動するモータと、上記押圧部
材が上昇、下降したときそれぞれ該押圧部材の後
端部に当接して該押圧部材を上方に開いた上昇位
置、水平押圧位置まで揺動させる上、下ストツパ
と、上記押圧部材が水平押圧位置に来たとき上記
突部がリードに押圧されるよう押圧部材の後端部
を上方に付勢するソレノイドとからなるものであ
ることを特徴とする実用新案登録請求の範囲第１
項記載の半導体装置の試験装置。[Scope of Claim for Utility Model Registration] (1) In an apparatus for testing the characteristics of the semiconductor device under test in a state where the leads of the semiconductor device under test are pressed and connected to the measurement circuit board, 1. A testing apparatus for a semiconductor device, comprising: a pressing member; and a pressing member driving device that swings the pressing member between a raised position where the pressing member is opened upward and a lowered position where the lead is pressed. (2) the pressing member is a rod-shaped body having a protrusion on its front lower surface for pressing the lead;
The pressing member driving device includes a support member that swingably supports substantially the center of the pressing member, a ball screw provided in the vertical direction and screwed into the support member, a motor that rotationally drives the ball screw, and a motor that rotationally drives the ball screw. When the member rises and descends, upper and lower stoppers abut against the rear end of the pressing member and swing the pressing member to an upwardly opened raised position and a horizontal pressing position, and the pressing member is placed in a horizontal pressing position. and a solenoid that biases the rear end of the pressing member upward so that the protrusion is pressed against the lead when the protrusion reaches the reed.
A test device for a semiconductor device as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18475684U JPS6199065U (en) | 1984-12-05 | 1984-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18475684U JPS6199065U (en) | 1984-12-05 | 1984-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6199065U true JPS6199065U (en) | 1986-06-25 |
Family
ID=30742241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18475684U Pending JPS6199065U (en) | 1984-12-05 | 1984-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6199065U (en) |
-
1984
- 1984-12-05 JP JP18475684U patent/JPS6199065U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6199065U (en) | ||
| JPS6016538U (en) | Single-sided processing equipment for semiconductor wafers | |
| JPH0187896U (en) | ||
| JPH03104986U (en) | ||
| JPS6279172U (en) | ||
| JPS602719Y2 (en) | Stereo left/right discrimination device | |
| JPS62202653U (en) | ||
| JPS60172701U (en) | Automatic specimen enclosing device | |
| JPS6363780U (en) | ||
| JPS6287008U (en) | ||
| JPS62154648U (en) | ||
| JPS59109140U (en) | Wafer vacuum chuck table | |
| JPS6041059U (en) | Pressurizing device for leadless diode | |
| JPH03113747U (en) | ||
| JPH0297680U (en) | ||
| JPS647497B2 (en) | ||
| JPH031749U (en) | ||
| JPS60169510U (en) | vertical measuring instrument | |
| JPS63167735U (en) | ||
| JPH0372377U (en) | ||
| JPS63129873U (en) | ||
| JPH01124583U (en) | ||
| JPS6210647U (en) | ||
| JPS6338323U (en) | ||
| JPH01145128U (en) |