JPH01145128U

JPH01145128U -

Info

Publication number: JPH01145128U
Application number: JP4179088U
Authority: JP
Priority date: 1988-03-28
Filing date: 1988-03-28
Publication date: 1989-10-05

Description

[Brief explanation of the drawing]

第１図は本考案に係る一実施例の半導体製造装
置を説明する一部断面正面図、第２図は第１図中
の要部拡大縦断面図、第３図は別の実施例を説明
する要部拡大縦断面図である。第４図は半導体ウ
エーハ上の不要な突起を破砕除去するための半導
体製造装置の斜視図、第５図は半導体ウエーハ上
の不要な突起を破砕除去している状態の要部拡大
正面図である。１……ターンテーブル、２……アーム、３……
加工用ヘツド、５……浮上量を測定する装置、６
……基台、７……小孔、８……光センサ、８ａ…
…投光素子、８ｂ……受光素子、９……透光性部
材、８０……光センサ、８０ａ……投光素子、８
０ｂ……受光素子、８０ｃ……投光性部材、Ｗ…
…半導体ウエーハ、ｍ……不要な突起（マウンド
）。 FIG. 1 is a partially sectional front view illustrating a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged vertical sectional view of the main part in FIG. 1, and FIG. 3 is an illustration of another embodiment. FIG. Fig. 4 is a perspective view of a semiconductor manufacturing device for crushing and removing unnecessary protrusions on a semiconductor wafer, and Fig. 5 is an enlarged front view of the main parts in a state where unnecessary protrusions on a semiconductor wafer are being crushed and removed. . 1... Turntable, 2... Arm, 3...
Processing head, 5... Device for measuring flying height, 6
...Base, 7...Small hole, 8...Light sensor, 8a...
... Light projecting element, 8b ... Light receiving element, 9 ... Translucent member, 80 ... Optical sensor, 80a ... Light projecting element, 8
0b... Light receiving element, 80c... Light emitting member, W...
...Semiconductor wafer, m...Unnecessary protrusion (mound).

Claims

[Claims for Utility Model Registration] A gas outlet is provided at the substantially central portion of the lower end, and is disposed so as to be able to float a minute distance above the rotationally driven semiconductor wafer and move in the radial direction of the semiconductor wafer. A device for measuring the flying height of a wafer processing head for crushing and removing unnecessary protrusions on semiconductor wafers, which includes a base whose top surface is in the same plane as the surface of the semiconductor wafer, and an optical sensor embedded in the base. A semiconductor manufacturing apparatus comprising: and a translucent member disposed on the light emitting/receiving element in the optical sensor and having an upper surface aligned with the upper surface of the base.