JPS619860U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS619860U JPS619860U JP9246484U JP9246484U JPS619860U JP S619860 U JPS619860 U JP S619860U JP 9246484 U JP9246484 U JP 9246484U JP 9246484 U JP9246484 U JP 9246484U JP S619860 U JPS619860 U JP S619860U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- contact surface
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の正面図、第２図は第１図の
右側面図、第３図は第１図の背面図である。
１，１′・・・絶縁セラミック基板、２・・・導体バタ
ーン、３・・・抵抗パターン、４・・・電子部品、５・
・・金属板、５ａ・・・金属板舌片、６・・・クリップ
式りード。1 is a front view of an embodiment of the present invention, FIG. 2 is a right side view of FIG. 1, and FIG. 3 is a rear view of FIG. 1. 1, 1'... Insulating ceramic substrate, 2... Conductor pattern, 3... Resistance pattern, 4... Electronic component, 5...
...Metal plate, 5a...Metal plate tongue piece, 6...Clip type lead.
Claims (1)
枚の回路板を、それらの回路非形成面が相互に接する態
様に重ね合わせ、２枚重ねた端部をＵ字形のリードにて
固定し、かつ電気的に接続してなる混成集積回路装置に
おいて、２枚の回路板の接触面部に、接触面の略全体を
被覆する均一厚の導電板を設けたことを特徴とする混成
集積回路装置。 ２ 接触面の略全体を被覆する均一厚の導電板は、Ｕ字
形のクリップ型リードの少なくとも１本に電気的に接続
してなることを特徴とする特許請求の範囲第１項に記載
された混成集積回路装置。[Scope of claims for utility model registration] 1. Each device is formed by forming a circuit on one side of an insulating substrate.2.
In a hybrid integrated circuit device, two circuit boards are stacked so that their non-circuit-forming surfaces are in contact with each other, the ends of the two stacked boards are fixed with U-shaped leads, and electrically connected. , a hybrid integrated circuit device characterized in that a conductive plate having a uniform thickness is provided on the contact surface portion of two circuit boards to cover substantially the entire contact surface. 2. The conductive plate having a uniform thickness that covers substantially the entire contact surface is electrically connected to at least one U-shaped clip lead. Hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9246484U JPS619860U (en) | 1984-06-22 | 1984-06-22 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9246484U JPS619860U (en) | 1984-06-22 | 1984-06-22 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS619860U true JPS619860U (en) | 1986-01-21 |
Family
ID=30649285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9246484U Pending JPS619860U (en) | 1984-06-22 | 1984-06-22 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619860U (en) |
-
1984
- 1984-06-22 JP JP9246484U patent/JPS619860U/en active Pending
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