JPS6197896U - - Google Patents

Info

Publication number
JPS6197896U
JPS6197896U JP1984184209U JP18420984U JPS6197896U JP S6197896 U JPS6197896 U JP S6197896U JP 1984184209 U JP1984184209 U JP 1984184209U JP 18420984 U JP18420984 U JP 18420984U JP S6197896 U JPS6197896 U JP S6197896U
Authority
JP
Japan
Prior art keywords
heat sink
disposed
insulating substrate
heat
power control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984184209U
Other languages
Japanese (ja)
Other versions
JPH041756Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984184209U priority Critical patent/JPH041756Y2/ja
Publication of JPS6197896U publication Critical patent/JPS6197896U/ja
Application granted granted Critical
Publication of JPH041756Y2 publication Critical patent/JPH041756Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の具体的な１実施例に係る電圧
調整装置の内部構成を示す断面図である。第２図
は同実施例に於いて使用した電圧調整部の構造図
であり、第３図は同実施例の変形例で使用したヒ
ートシンクの断面図であり、第４図は第３図に示
すヒートシンクで構成した本考案の構成図である
。第５図は、同実施例に於いて使用した従来技術
を説明するための電圧調整部の回路図である。第
６図は従来技術を説明するために用いた電圧調整
装置の断面図である。 １０…電圧調整部、１８…ヒートシンク、２０
…制御回路、４０…放熱フイン、５０…保護ケー
ス、１１０…ＮＰＮ型トランジスタ、１２０…還
流ダイオード。 FIG. 1 is a sectional view showing the internal structure of a voltage regulator according to a specific embodiment of the present invention. Figure 2 is a structural diagram of the voltage regulator used in the same example, Figure 3 is a sectional view of a heat sink used in a modification of the same example, and Figure 4 is the same as shown in Figure 3. FIG. 2 is a configuration diagram of the present invention configured with a heat sink. FIG. 5 is a circuit diagram of a voltage regulator for explaining the conventional technology used in the same embodiment. FIG. 6 is a sectional view of a voltage regulator used to explain the prior art. 10... Voltage adjustment section, 18... Heat sink, 20
...control circuit, 40...heat dissipation fin, 50...protective case, 110...NPN type transistor, 120...freewheeling diode.

Claims (1)

【実用新案登録請求の範囲】 (1) 表面より外部に熱を放散する放熱フインと
、前記放熱フインが装着され、絶縁性を有する保
護ケースと、 前記保護ケース内に格納され、前記放熱フイン
上に配設された絶縁基板と、 前記絶縁基板上に配設され、熱伝導率、電気伝
導率の高いヒートシンクと、 前記ヒートシンク上に配設され、主電流回路端
子の１端を該ヒートシンクで形成し、発電機の界
磁電流となる主電流を制御する電力制御用トラン
ジスタと、 前記ヒートシンク上に配設され、該ヒートシン
クを介して前記電力制御用トランジスタの一端と
接続された還流ダイオードと、 前記絶縁基板上に配設され、前記電力制御用ト
ランジスタを制御する制御回路と、 から成る電圧調整装置。 (2) 前記ヒートシンクは、外部接続端子と、電
気的に接続されていることを特徴とする実用新案
登録請求の範囲第１項記載の電気調節装置。[Scope of Claim for Utility Model Registration] (1) A heat dissipating fin that dissipates heat from the surface to the outside; a protective case to which the heat dissipating fin is attached and having insulation properties; an insulating substrate disposed on the insulating substrate; a heat sink disposed on the insulating substrate and having high thermal conductivity and electrical conductivity; and a heat sink disposed on the heat sink and forming one end of a main current circuit terminal with the heat sink. a power control transistor that controls a main current serving as a field current of the generator; a freewheeling diode disposed on the heat sink and connected to one end of the power control transistor via the heat sink; A voltage regulator comprising: a control circuit disposed on an insulating substrate and controlling the power control transistor; (2) The electrical adjustment device according to claim 1, wherein the heat sink is electrically connected to an external connection terminal.
JP1984184209U 1984-12-03 1984-12-03 Expired JPH041756Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984184209U JPH041756Y2 (en) 1984-12-03 1984-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984184209U JPH041756Y2 (en) 1984-12-03 1984-12-03

Publications (2)

Publication Number Publication Date
JPS6197896U true JPS6197896U (en) 1986-06-23
JPH041756Y2 JPH041756Y2 (en) 1992-01-21

Family

ID=30741694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984184209U Expired JPH041756Y2 (en) 1984-12-03 1984-12-03

Country Status (1)

Country Link
JP (1) JPH041756Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299965A (en) * 1999-04-12 2000-10-24 Calsonic Kansei Corp Heat sink structure for fan controller
JP2017093123A (en) * 2015-11-09 2017-05-25 住友電気工業株式会社 Wireless power reception device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299965A (en) * 1999-04-12 2000-10-24 Calsonic Kansei Corp Heat sink structure for fan controller
JP2017093123A (en) * 2015-11-09 2017-05-25 住友電気工業株式会社 Wireless power reception device

Also Published As

Publication number Publication date
JPH041756Y2 (en) 1992-01-21

Similar Documents

Publication Publication Date Title
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
JPS62161600U (en)
JPS6197896U (en)
JPH0220346U (en)
JPH0517861Y2 (en)
JPH0226256U (en)
JPH0632410B2 (en) Power module
JPH01129676U (en)
JPS608464Y2 (en) electrical equipment
JP2544054Y2 (en) Power supply
JPH0351992Y2 (en)
JPH0412657U (en)
JPS59117165U (en) Electric circuit heat dissipation structure
JPS60125746U (en) semiconductor unit
JPH0179850U (en)
JPS61166536U (en)
JPS59115660U (en) High voltage insulation structure for semiconductor devices
JPS6142853U (en) Resin-encapsulated semiconductor device
JPS6232517U (en)
JPS593558U (en) GTO element protection device
JPS63138883U (en)
JPS61193379U (en)
JPS5965540U (en) Inverter device
JPS61192455U (en)
JPS62114405U (en)