JPH0632410B2 - Power module - Google Patents
Power moduleInfo
- Publication number
- JPH0632410B2 JPH0632410B2 JP15073885A JP15073885A JPH0632410B2 JP H0632410 B2 JPH0632410 B2 JP H0632410B2 JP 15073885 A JP15073885 A JP 15073885A JP 15073885 A JP15073885 A JP 15073885A JP H0632410 B2 JPH0632410 B2 JP H0632410B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- primary
- power module
- substrates
- conversion transformer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Housings And Mounting Of Transformers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Dc-Dc Converters (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はＤＣ−ＤＣコンバータの電力変換回路部分を一
体化したパワーモジュールに関するものである。Description: TECHNICAL FIELD The present invention relates to a power module in which a power conversion circuit portion of a DC-DC converter is integrated.
従来の技術 最近ＤＣ−ＤＣコンバータの１次側スイッチング回路を
集積化した１次基板と、２次整流回路を集積化した２次
基板と、変換トランスとを熱伝導性の良い電気的絶縁物
（例えば樹脂である。以下、この電気的絶縁物を樹脂と
よぶ。）で一体化したモジュールが考えられている。2. Description of the Related Art Recently, a primary substrate on which a primary side switching circuit of a DC-DC converter is integrated, a secondary substrate on which a secondary rectifying circuit is integrated, and a conversion transformer are electrically insulating materials having good thermal conductivity ( For example, it is a resin. Hereinafter, a module in which this electrical insulator is referred to as a resin) is considered.
発明が解決しようとする問題点 しかしながら、このような一体化モジュールでは、１次
２次回路の電力素子と変換トランスとを、近傍に配置す
るためそれらの部分で発生する熱はお互いに影響し合い
均一化してしまう。そのため、お互いの発熱量に差があ
ると、発熱量の少ないものまで温度を上げてしまうとい
う問題を有していた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in such an integrated module, since the power element of the primary / secondary circuit and the conversion transformer are arranged in the vicinity, heat generated in those portions influences each other. It becomes uniform. Therefore, if there is a difference in the calorific value from each other, there is a problem that the temperature is raised to the one with a small calorific value.
本発明はかかる点に関し、１次回路と２次回路を電気的
に絶縁分離した状態で、１次２次回路と変換トランスと
の配線距離を極力短くした配置をしても、お互いの熱の
影響を押え効果的な熱放散を可能にしたパワーモジュー
ルを提供するものである。With respect to such a point, the present invention relates to a situation in which the primary circuit and the secondary circuit are electrically insulated and separated from each other, and even if the wiring distance between the primary and secondary circuit and the conversion transformer is minimized, the mutual heat (EN) A power module that suppresses the influence and enables effective heat dissipation.
問題点を解決するための手段 上記問題を解決するため本発明のパワーモジュールは、
１次回路，２次回路、および変換トランスの個々の発熱
がお互いに影響しないように、発熱体と発熱体との間に
空隙を設けた構造にしたものである。Means for Solving the Problems In order to solve the above problems, the power module of the present invention is
In order to prevent the individual heat generations of the primary circuit, the secondary circuit, and the conversion transformer from affecting each other, a structure is provided in which a gap is provided between the heating elements.
作用 本発明は上記構造により、１次２次回路を電気的に分離
させたまま、さらに、変換トランスとの距離も短く配線
したままで、１次，２次回路の形成されたそれぞれの基
板の電力素子から発生する熱、および変換トランスから
発生する熱を、個々に放散させることが可能であり、さ
らにヒートシンクをつけることでより効果的な放散が出
きる。従って一体化したパワーモジュールをより小型化
することが可能となる。The present invention has the above-described structure, and the primary and secondary circuits are electrically separated from each other, and the distance between the primary and secondary circuits is short, and wiring is performed on each substrate on which the primary and secondary circuits are formed. It is possible to dissipate the heat generated from the power element and the heat generated from the conversion transformer individually, and more effective dissipation can be obtained by attaching a heat sink. Therefore, it is possible to further reduce the size of the integrated power module.
実施例 第１図(a),(b)は、本発明のパワーモジュールの一実施
例を示す平面図，断面図である。第１図において、１次
基板１と２次基板２はそれぞれに電力素子６，７を取り
つけており、お互いの素子面が対向するように配置され
ている。さらに、変換トランス３が基板１，２と隣接し
て配置されている。上記のように配置された基板１，２
と変換トランス３は全体を樹脂４により結合し、一体の
モジュールとしている。また、基板１，２の素子面と樹
脂４との間には熱を分離するための空隙５ａが設けられ
ている。Embodiments FIGS. 1 (a) and 1 (b) are a plan view and a sectional view showing an embodiment of a power module of the present invention. In FIG. 1, the primary substrate 1 and the secondary substrate 2 are provided with power devices 6 and 7, respectively, and are arranged so that their device surfaces face each other. Further, the conversion transformer 3 is arranged adjacent to the substrates 1 and 2. Substrates 1 and 2 arranged as described above
The conversion transformer 3 and the conversion transformer 3 are wholly connected by a resin 4 to form an integral module. Further, a space 5a for separating heat is provided between the element surfaces of the substrates 1 and 2 and the resin 4.
以上のように、基板１，２と樹脂４との間に空隙５ａを
設けることにより熱伝導率に差が生じ、基板上の各素子
の熱が変換トランス３に伝わりにくく、さらには基板間
の熱伝導率も低下し基板間の熱の伝達も少なくなる。こ
のように熱の分離をすることにより、モジュール全体の
熱を内部に蓄積することなく外部に放散することができ
る。また、ヒートシンクを基板１，２に付けることによ
りさらに効率良く放熱することが可能となる。As described above, by providing the gap 5a between the substrates 1 and 2 and the resin 4, a difference in thermal conductivity occurs, heat of each element on the substrate is difficult to be transmitted to the conversion transformer 3, and further, between the substrates. The thermal conductivity also decreases and the heat transfer between the substrates decreases. By separating the heat in this way, the heat of the entire module can be dissipated to the outside without being accumulated inside. Further, by attaching a heat sink to the substrates 1 and 2, it is possible to radiate heat more efficiently.
又、基板１，２のどちらか一方に空隙を設けることも可
能であり、さらには、基板１，２と変換トランス３との
間に設けることも可能である。Further, it is possible to provide a gap in either one of the substrates 1 and 2, and it is also possible to provide between the substrates 1 and 2 and the conversion transformer 3.
第２図は本発明の他の実施例を示す図で、(a)は平面
図、(b)はそのＡ−Ａ′断面図、(c)はそのＢ−Ｂ′断面
図である。第２図は第１図のパワーモジュールにヒート
シンク９を取り付けたもので、基板１および基板２の素
子面に空隙５ａを設けると同じに、変換トランス３とヒ
ートシンク９との間の樹脂４に空隙５ｂを設け、基板
１，２の放熱をより効果的にしたものである。2A and 2B are views showing another embodiment of the present invention. FIG. 2A is a plan view, FIG. 2B is a sectional view taken along the line AA ', and FIG. 2C is a sectional view taken along the line BB'. FIG. 2 shows the power module of FIG. 1 with a heat sink 9 mounted thereon. 5b is provided to make the heat dissipation of the substrates 1 and 2 more effective.
第３図は本発明の更に別の実施例を示す図で、(a)は平
面図、(b)はそのＡ−Ａ′断面図である。第３図は、同
じく第１のモジュールにヒートシンクを付けたものであ
るが、変換トランス３とヒートシンク９との間の空隙５
ｃをヒートシンク側に設けたものである。FIG. 3 is a view showing still another embodiment of the present invention, (a) is a plan view and (b) is a sectional view taken along line AA ′. FIG. 3 is the same as the first module with a heat sink, but the gap 5 between the conversion transformer 3 and the heat sink 9 is shown.
c is provided on the heat sink side.
発明の効果 以上のように本発明によれば、きわめて簡単な構造で一
体型パワーモジュール内の発熱体を熱分離することがで
き、熱放散を効果的に行なうことができる。またモジュ
ール全体として熱設計が容易となり、小型化できる。EFFECTS OF THE INVENTION As described above, according to the present invention, the heat generating element in the integrated power module can be thermally separated with an extremely simple structure, and heat can be effectively dissipated. In addition, the thermal design of the module as a whole becomes easy and the module can be miniaturized.
第１図(a),(b)は、本発明の一実施例におけるパワーモ
ジュールの平面図、そのＡ−Ａ′断面図、第２図(a)は
本発明の他の実施例の平面図、第２図(b)は(a)のＡ−
Ａ′断面図、第２図(c)は(b)のＢ−Ｂ′断面図、第３図
(a)は本発明の更に別の実施例を示す平面図、第３図(b)
はそのＡ−Ａ′断面図である。 １……１次基板、２……２次基板、３……変換トラン
ス、４……樹脂、５ａ……空隙ａ、５ｂ……空隙ｂ、５
ｃ……空隙ｃ、６……１次側電力素子、７……２次側電
力素子、８……接続リード、９……ヒートシンク。1 (a) and 1 (b) are plan views of a power module in one embodiment of the present invention, a sectional view taken along the line AA ', and FIG. 2 (a) is a plan view of another embodiment of the present invention. , Fig. 2 (b) shows A- of (a).
Sectional view taken along the line A ', FIG. 2 (c) is a sectional view taken along the line BB' of (b), and FIG.
(a) is a plan view showing still another embodiment of the present invention, and FIG. 3 (b).
Is a sectional view taken along line AA ′. 1 ... primary substrate, 2 ... secondary substrate, 3 ... conversion transformer, 4 ... resin, 5a ... void a, 5b ... void b, 5
c ... Air gap c, 6 ... Primary power element, 7 ... Secondary power element, 8 ... Connection lead, 9 ... Heat sink.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 西井 和彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 森 久子 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭62−51244（ＪＰ，Ａ) 実開 昭60−5152（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kazuhiko Nishii, 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Hisako Mori, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 56) References Japanese Unexamined Patent Publication No. 62-51244 (JP, A) Actually developed 60-5152 (JP, U)
Claims (1)
スとを電気的絶縁物で一体化し、前記１次側，２次側基
板の素子実装面に前記絶縁物の空隙を設けたことを特徴
とするパワーモジュール。1. A primary-side substrate, a secondary-side substrate, and a conversion transformer are integrated by an electrical insulator, and voids of the insulator are provided on element mounting surfaces of the primary-side and secondary-side substrates. The power module that is characterized.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15073885A JPH0632410B2 (en) | 1985-07-09 | 1985-07-09 | Power module |
| US06/880,315 US4712160A (en) | 1985-07-02 | 1986-06-30 | Power supply module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15073885A JPH0632410B2 (en) | 1985-07-09 | 1985-07-09 | Power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6212194A JPS6212194A (en) | 1987-01-21 |
| JPH0632410B2 true JPH0632410B2 (en) | 1994-04-27 |
Family
ID=15503332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15073885A Expired - Lifetime JPH0632410B2 (en) | 1985-07-02 | 1985-07-09 | Power module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632410B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5957959A (en) * | 1982-09-27 | 1984-04-03 | 日本特殊陶業株式会社 | Manufacture of high strength sic sintered body |
| US7236086B1 (en) | 1993-06-14 | 2007-06-26 | Vlt, Inc. | Power converter configuration, control, and construction |
-
1985
- 1985-07-09 JP JP15073885A patent/JPH0632410B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6212194A (en) | 1987-01-21 |
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