JPS6212194A - Power module - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a power module that integrates a power conversion circuit portion of a DC-DC converter.

Conventional technology: A primary substrate on which a primary side switching circuit of a DC-DC converter is integrated, a secondary substrate on which a secondary rectifier circuit is integrated, and a conversion transformer are connected to an electrical insulator with good thermal conductivity. (For example, resin. Hereinafter, this electrical insulator will be referred to as resin.) A module integrated with the electrical insulator is being considered.

Problems to be Solved by the Invention However, in such an integrated module, the power elements of the primary and secondary circuits and the conversion transformer are placed close to each other, so the heat generated in these parts influences each other. It becomes uniform. Therefore, if there is a difference in the amount of heat generated between them, there is a problem in that the temperature of the one with the least amount of heat is increased.

The present invention solves this problem, even if the primary circuit and the secondary circuit are electrically insulated and separated, and the wiring distance between the primary and secondary circuit and the conversion transformer is arranged as short as possible, the heat dissipation from each other is minimized. The present invention provides a power module that enables effective heat dissipation while suppressing the influence of heat.

Means for Solving the Problems In order to solve the above problems, the power module of the present invention has the following features:
The structure is such that a gap is provided between the heating elements so that the individual heat generation of the primary circuit, secondary circuit, and conversion transformer does not affect each other.

Effect of the present invention With the above structure, the primary and secondary circuits can be electrically separated, and the wiring distance from the conversion transformer can be kept short, and each board on which the primary and secondary circuits are formed can be connected to each other. The heat generated from the power elements and the heat generated from the conversion transformer can be dissipated individually, and more effective dissipation can be achieved by adding a heat sink.

Therefore, it is possible to further downsize the integrated power module.

Embodiment FIGS. 1(&) and 1(b) are a plan view and a sectional view showing an embodiment of the power module of the present invention. In FIG. 1, a primary substrate 1 and a secondary substrate 2 each have a power element 6.
．． 7 are attached, and are arranged so that their element surfaces face each other. Further, the conversion transformer 3 is connected to the substrate 1.
It is located adjacent to 2. The substrates 1 and 2 and the conversion transformer 3 arranged as described above are combined as a whole with a resin 4 to form an integrated module. Additionally, there is a gap 62 between the element surfaces of the substrates 1 and 2 and the resin 4 for separating heat.
L is provided.

As described above, by providing the gap 6a between the substrate 1.2 and the resin 4, a difference in thermal conductivity occurs, making it difficult for the heat of each element on the substrate to be transferred to the conversion transformer 3, and furthermore, Thermal conductivity between the substrates also decreases, and heat transfer between the substrates also decreases. By separating the heat in this way, the heat of the entire module can be dissipated to the outside without being accumulated inside. Furthermore, by attaching heat sinks to the substrates 1 and 2, it becomes possible to dissipate heat even more efficiently.

Further, it is also possible to provide a gap in either one of the substrates 1 and 2, and furthermore, it is also possible to provide a gap between the substrates 1 and 2 and the conversion transformer 3.

FIG. 2 is a diagram showing another embodiment of the present invention, in which (2L) is a plan view, (b) is a sectional view taken along line A-A', and (C) is a cross-sectional view taken along line B.
-B' sectional view. FIG. 2 shows the power module shown in FIG. 1 with a heat sink 9 attached. In the same way as a gap 6a is provided on the element surfaces of the substrates 1 and 2, a gap is formed in the resin 4 between the conversion transformer 3 and the heat sink 9. 6b is provided to make the heat dissipation of the substrate 1.2 more effective.

FIG. 3 is a diagram showing still another embodiment of the present invention, (&) is a plan view, and (b) is a sectional view taken along the line A-A'. In FIG. 3, a heat sink is similarly attached to the first module, but a gap 5C between the conversion transformer 3 and the heat sink 9 is provided on the heat sink side.

Effects of the Invention As described above, according to the present invention, the heating element within the integrated power module can be thermally isolated with an extremely simple structure, and heat dissipation can be performed effectively. Moreover, the thermal design of the module as a whole becomes easier and the module can be made smaller.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are a plan view of a power module according to an embodiment of the present invention, and a sectional view taken along the line A-A', and FIG. 2e) is a plan view of another embodiment of the present invention. Figure 2 (
b) is an A-A' sectional view of (a), and Figure 2 (C) is a cross-sectional view of (b).
), FIG. 3(2L) is a plan view showing still another embodiment of the present invention, and FIG. 3(b) is a cross-sectional view of the person
FIG. 1...Primary board, 2...Secondary board, 3
...Conversion transformer, 4...Resin, 6&
...Gap a, 6b...Gap b, 6C
...Gap C16...Primary side power element,
7...Secondary side power element, 8...Connection lead, 9...Heat sink. Name of agent: Patent attorney Toshio Nakao and 1 other person3-
Ichimugi Kantrance 7---2 Nku ζ 狽すden: J-Shu Uterus 1 Figure
8-Gaichiro night ν-do' 2”
5b-Next Wr, b9---Heat sink (S

Claims (1)

[Claims] The primary board, the secondary board, and the conversion transformer are integrated with an electrical insulator, and gaps are provided in the insulator on the element mounting surfaces of the primary and secondary boards. power module.