JPS6196347U - - Google Patents

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Publication number
JPS6196347U
JPS6196347U JP18204184U JP18204184U JPS6196347U JP S6196347 U JPS6196347 U JP S6196347U JP 18204184 U JP18204184 U JP 18204184U JP 18204184 U JP18204184 U JP 18204184U JP S6196347 U JPS6196347 U JP S6196347U
Authority
JP
Japan
Prior art keywords
pressure
diaphragm
pressure gauges
semiconductor
output voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18204184U
Other languages
Japanese (ja)
Other versions
JPH041472Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18204184U priority Critical patent/JPH041472Y2/ja
Publication of JPS6196347U publication Critical patent/JPS6196347U/ja
Application granted granted Critical
Publication of JPH041472Y2 publication Critical patent/JPH041472Y2/ja
Expired legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例のセンサ部の構成を
示す構成図、第2図はせん断応力ゲージの構成を
示す構成図、第3図は不純物濃度に対する各係数
の特性を示す特性図、第4図は第1図に示すせん
断応力ゲージを用いて被測定圧力に対応した出力
電圧を得るブロツク図、第5図は本考案の他の実
施例のダイヤフラムの要部平面図、第6図は第5
図に示す垂直応力ゲージを用いて被測定圧力に対
応した出力電圧を得るブロツク図である。 1…ダイヤフラム、2…凹部、3…起歪部、4
…固定部、5…連通孔、6…基板、7…ガラス薄
膜、8,9…電源端、10,11…出力端、Gs
,Gs…せん断応力ゲージ、Gv,Gv
…垂直応力ゲージ、P…被測定圧力、PCC…演
算回路、V…定電圧。
FIG. 1 is a configuration diagram showing the configuration of a sensor section of an embodiment of the present invention, FIG. 2 is a configuration diagram showing the configuration of a shear stress gauge, and FIG. 3 is a characteristic diagram showing the characteristics of each coefficient with respect to impurity concentration. Fig. 4 is a block diagram of obtaining an output voltage corresponding to the pressure to be measured using the shear stress gauge shown in Fig. 1, Fig. 5 is a plan view of the main part of a diaphragm of another embodiment of the present invention, and Fig. is the fifth
FIG. 2 is a block diagram of obtaining an output voltage corresponding to a measured pressure using the vertical stress gauge shown in the figure. DESCRIPTION OF SYMBOLS 1... Diaphragm, 2... Recessed part, 3... Strain-generating part, 4
... Fixed part, 5... Communication hole, 6... Substrate, 7... Glass thin film, 8, 9... Power supply end, 10, 11... Output end, Gs
1 , Gs 2 ... shear stress gauge, Gv 1 , Gv 2
...Vertical stress gauge, P...Pressure to be measured, PCC...Arithmetic circuit, Vs ...Constant voltage.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体単結晶のダイヤフラムを有し前記ダイヤ
フラムに印加される被測定圧力を検出する半導体
圧力変換器において、前記ダイヤフラムの起歪部
上に形成された不純物濃度の異なる少くとも2個
の圧力ゲージと、前記圧力ゲージを定電圧で駆動
したときの前記圧力ゲージの出力電圧Eおよび
の任意の圧力印加の状態での基準温度におけ
る前記各圧力ゲージの出力の比bと前記各圧力ゲ
ージのピエゾ抵抗係数の温度係数の比aとを用い
てE=(E−abE)/(1−a)なる出
力電圧Eを演算する演算手段とを具備し、前記
被測定圧力に対応した出力電圧を出力することを
特徴とした半導体圧力変換器。
In a semiconductor pressure transducer having a semiconductor single crystal diaphragm and detecting a measured pressure applied to the diaphragm, at least two pressure gauges having different impurity concentrations formed on a strain-generating portion of the diaphragm; Ratio b of the output voltages of the pressure gauges E1 and E2 when the pressure gauges are driven with a constant voltage at a reference temperature under any pressure application state and the piezoelectricity of each of the pressure gauges. a calculation means for calculating an output voltage E 0 of E 0 =(E 2 -abE 1 )/(1-a) using the ratio a of the temperature coefficient of the resistance coefficient; A semiconductor pressure transducer characterized by outputting an output voltage.
JP18204184U 1984-11-30 1984-11-30 Expired JPH041472Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18204184U JPH041472Y2 (en) 1984-11-30 1984-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18204184U JPH041472Y2 (en) 1984-11-30 1984-11-30

Publications (2)

Publication Number Publication Date
JPS6196347U true JPS6196347U (en) 1986-06-20
JPH041472Y2 JPH041472Y2 (en) 1992-01-20

Family

ID=30739577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18204184U Expired JPH041472Y2 (en) 1984-11-30 1984-11-30

Country Status (1)

Country Link
JP (1) JPH041472Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013205403A (en) * 2012-03-29 2013-10-07 Toshiba Corp Pressure sensor and microphone
JP2015064375A (en) * 2014-12-04 2015-04-09 株式会社東芝 Pressure sensor and microphone
JP2017058340A (en) * 2015-09-18 2017-03-23 Smc株式会社 Pressure sensor and method for manufacturing the same
US10067021B2 (en) 2015-09-18 2018-09-04 Smc Corporation Pressure sensor having resistive bodies

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013205403A (en) * 2012-03-29 2013-10-07 Toshiba Corp Pressure sensor and microphone
US9759618B2 (en) 2012-03-29 2017-09-12 Kabushiki Kaisha Toshiba Pressure sensor and microphone
US10082430B2 (en) 2012-03-29 2018-09-25 Kabushiki Kaisha Toshiba Pressure sensor and microphone
JP2015064375A (en) * 2014-12-04 2015-04-09 株式会社東芝 Pressure sensor and microphone
JP2017058340A (en) * 2015-09-18 2017-03-23 Smc株式会社 Pressure sensor and method for manufacturing the same
US10048147B2 (en) 2015-09-18 2018-08-14 Smc Corporation Pressure sensor including a thin-film diaphragm provided with plural resistive bodies printed in a straight line and manufacturing method therefor
US10067021B2 (en) 2015-09-18 2018-09-04 Smc Corporation Pressure sensor having resistive bodies

Also Published As

Publication number Publication date
JPH041472Y2 (en) 1992-01-20

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