JPS6193633A - 半導体基板用モリブデン板の製造方法 - Google Patents

半導体基板用モリブデン板の製造方法

Info

Publication number
JPS6193633A
JPS6193633A JP21409984A JP21409984A JPS6193633A JP S6193633 A JPS6193633 A JP S6193633A JP 21409984 A JP21409984 A JP 21409984A JP 21409984 A JP21409984 A JP 21409984A JP S6193633 A JPS6193633 A JP S6193633A
Authority
JP
Japan
Prior art keywords
molybdenum
plate
thickness
punching
clearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21409984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0574935B2 (enrdf_load_stackoverflow
Inventor
Hideyuki Kameyasu
亀安　秀行
Akira Kobayashi
昭 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Tungsten Co Ltd
Original Assignee
Tokyo Tungsten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Tungsten Co Ltd filed Critical Tokyo Tungsten Co Ltd
Priority to JP21409984A priority Critical patent/JPS6193633A/ja
Publication of JPS6193633A publication Critical patent/JPS6193633A/ja
Publication of JPH0574935B2 publication Critical patent/JPH0574935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Punching Or Piercing (AREA)
JP21409984A 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法 Granted JPS6193633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21409984A JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21409984A JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Publications (2)

Publication Number Publication Date
JPS6193633A true JPS6193633A (ja) 1986-05-12
JPH0574935B2 JPH0574935B2 (enrdf_load_stackoverflow) 1993-10-19

Family

ID=16650205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21409984A Granted JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Country Status (1)

Country Link
JP (1) JPS6193633A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513056U (ja) * 1991-07-26 1993-02-19 京セラ株式会社 半導体素子収納用パツケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513056U (ja) * 1991-07-26 1993-02-19 京セラ株式会社 半導体素子収納用パツケージ

Also Published As

Publication number Publication date
JPH0574935B2 (enrdf_load_stackoverflow) 1993-10-19

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