JPS6191997A - Metal-based printed circuit board - Google Patents
Metal-based printed circuit boardInfo
- Publication number
- JPS6191997A JPS6191997A JP21342984A JP21342984A JPS6191997A JP S6191997 A JPS6191997 A JP S6191997A JP 21342984 A JP21342984 A JP 21342984A JP 21342984 A JP21342984 A JP 21342984A JP S6191997 A JPS6191997 A JP S6191997A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- circuit board
- printed circuit
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野］
本発明は金属板をベースとした金属ベースプリント基板
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a metal-based printed circuit board based on a metal plate.
［背景技術］
従来より金属板の表面に絶縁層を介して回路層を形成し
た金属ベースプリント基板が提供されているが、この金
属ベースプリント基板にあっては、ベースが金属である
ために保管時や作業時などに打ち傷、こすり傷が発生し
易いという欠点があった。[Background Art] Metal-based printed circuit boards have been provided in which a circuit layer is formed on the surface of a metal plate through an insulating layer. The disadvantage is that bruises and scratches are likely to occur during operation.
［発明の目的］
本発明は上記の点に鑑みて成され午ものであって、作業
時に打ち傷やこすり傷が化１１１金属ベースプリント基
板を提供することを目的とするものである。[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a 111 metal base printed circuit board that is free from bruises and scratches during work.
［発明の開示１ 、。[Disclosure of the invention 1.
すなわち、本発明の金属ベースプリント基板は、金属板
１の表面に絶縁層６を介して回路層３を形成し、回路層
３を保護層４で被覆して成ることを特徴とするもので、
回路層３を保護層４で保護することにより、作業時に回
路層３に打ち傷やこすり傷等が生じるのを防いで上記目
的を達成したものである。That is, the metal-based printed circuit board of the present invention is characterized in that a circuit layer 3 is formed on the surface of a metal plate 1 via an insulating layer 6, and the circuit layer 3 is covered with a protective layer 4.
By protecting the circuit layer 3 with the protective layer 4, the above object is achieved by preventing bruises, scratches, etc. from occurring on the circuit layer 3 during work.
以下本発明を実施例に基づいて詳述する。第１図に示す
ように、金属板１の表面に絶縁Ｎ１６を介して銅箔等で
形成される回路層３を積層すると共に、回路層３の表面
に保ＩＮ４を被覆して金属ベースプリント基板２が形成
しである。ここで、保Ｒ層４としては塩化ビニルシーＦ
１ポリエステルフィルム、ポリエチレンフィルム、ポリ
プロピレンフィルム等や、あるいはこれらのシート、フ
イルムに粘着剤が付着しであるものを使用することがで
きる。このように回路層３の表面を保護層４で被−した
状態で例えば防錆処理やスルーホール５用の孔あけ作業
等を行うものである。スルーホール５の孔あけ作業を行
う場合には、第２図に示すように、保護層４を回路層３
の表面に被覆した状態で行うものであり、孔あけ時に回
路層３の表面に傷等が付くのを防止することができるも
のである。また、防錆処理を行う場合には、防錆剤を基
板２の端面、特に金属板１の周端部に塗布するものであ
る。防錆剤としては液状のケイ酸カリウム等の無機アル
カリケイ酸、アルカリスズケイ酸、リン酸、アルキルシ
リケートなどを用いることができ、また塗布方法は浸漬
法、スプレーなどによって基板２端面に塗布することが
でき、塗布後１００〜４００℃好ましくは１２０〜１３
０℃で焼き付は硬化させるのである。また、防錆剤を硬
化させるにあたっては乾燥、加熱硬化の他に紫外線を照
射して硬化させるようにしても良く、硬化方法について
は限定するものでない。次に、この上うにして孔あけ作
業あるいは防錆剤塗布等の作業を終えた、後、上記保護
層４を剥離し、その後回路層３の表面に電気、電子部品
等を半田付けなどで搭載するのである。The present invention will be described in detail below based on examples. As shown in FIG. 1, a circuit layer 3 made of copper foil or the like is laminated on the surface of a metal plate 1 via an insulating layer 16, and a protective layer 3 is coated on the surface of the circuit layer 3 to form a metal-based printed circuit board. 2 is formed. Here, the insulation layer 4 is made of vinyl chloride sheet F.
1 Polyester film, polyethylene film, polypropylene film, etc., or sheets or films of these with an adhesive attached can be used. With the surface of the circuit layer 3 covered with the protective layer 4 in this manner, for example, anti-rust treatment, drilling for the through holes 5, etc. are performed. When drilling the through holes 5, as shown in FIG.
This is done while the surface of the circuit layer 3 is coated, and can prevent the surface of the circuit layer 3 from being scratched during drilling. Further, when carrying out rust prevention treatment, a rust preventive agent is applied to the end surface of the substrate 2, particularly to the peripheral end portion of the metal plate 1. As the rust preventive agent, inorganic alkali silicic acid such as liquid potassium silicate, alkali tin silicate, phosphoric acid, alkyl silicate, etc. can be used, and the application method is dipping, spraying, etc. to the two end faces of the substrate. 100-400℃ after coating, preferably 120-13℃
Baking hardens at 0°C. Further, in curing the rust preventive agent, in addition to drying and heat curing, it may be cured by irradiating ultraviolet rays, and the curing method is not limited. Next, after finishing the drilling work or the application of rust preventive agent, etc., the protective layer 4 is peeled off, and then electrical and electronic parts are soldered onto the surface of the circuit layer 3. It will be installed.
しかして、基板２の回路層３表面を保護層４で被覆する
ことにより、ベースが金属のために発生し易い打ち傷、
こすり傷等の発生を防ぐことができるものであり、しか
もベースの金属板１を防錆剤で防錆処理する際には、回
路層３は保護層４で被覆されているために防錆剤が回路
層３に付着して半田付は性等が低下するということもな
いものである。By covering the surface of the circuit layer 3 of the board 2 with the protective layer 4, bruises that are likely to occur because the base is made of metal can be avoided.
It is possible to prevent the occurrence of scratches, etc., and when the base metal plate 1 is treated with a rust preventive agent, since the circuit layer 3 is covered with the protective layer 4, the rust preventive agent is used. There is no possibility that the soldering properties will be deteriorated due to adhesion to the circuit layer 3.
［発明の効果Ｊ
上記のように本発明は、金属板の表面に絶縁層を介して
回路層を形成し、回路層を保護層で被覆したので、回路
層を保護層で保護して回路層に打ち傷やこすり傷が生じ
るのを防ぐことができるものであり、また基板を防錆処
理する際にも防錆剤が回路表面に付着して半田付き性が
低下するのを防ぐことができるものである。[Effect of the invention J As described above, the present invention forms a circuit layer on the surface of a metal plate through an insulating layer and covers the circuit layer with a protective layer. It can prevent scratches and scratches from occurring on the circuit board, and it can also prevent rust preventive from adhering to the circuit surface and reducing solderability when applying rust prevention treatment to the circuit board. It is.
第１図は本発明一実施例の概略断面図、＃＆２図は同上
のだの実施例の概略断面図である。
１は金属板、２は基板、３は回路層、４は保護層、６は
絶縁層である。
代理人 弁理士 石 １）艮 七
第１図FIG. 1 is a schematic cross-sectional view of one embodiment of the present invention, and Figures #2 and 2 are schematic cross-sectional views of the same embodiment. 1 is a metal plate, 2 is a substrate, 3 is a circuit layer, 4 is a protective layer, and 6 is an insulating layer. Agent Patent Attorney Ishi 1) Ai Figure 7 1
Claims (1)
回路層を保護層で被覆して成ることを特徴とする金属ベ
ースプリント基板。(1) Forming a circuit layer on the surface of the metal plate via an insulating layer,
A metal-based printed circuit board characterized by having a circuit layer covered with a protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21342984A JPS6191997A (en) | 1984-10-12 | 1984-10-12 | Metal-based printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21342984A JPS6191997A (en) | 1984-10-12 | 1984-10-12 | Metal-based printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6191997A true JPS6191997A (en) | 1986-05-10 |
Family
ID=16639077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21342984A Pending JPS6191997A (en) | 1984-10-12 | 1984-10-12 | Metal-based printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6191997A (en) |
-
1984
- 1984-10-12 JP JP21342984A patent/JPS6191997A/en active Pending
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