JPS6190413A - 電解コンデンサの外装方法 - Google Patents
電解コンデンサの外装方法Info
- Publication number
- JPS6190413A JPS6190413A JP21299584A JP21299584A JPS6190413A JP S6190413 A JPS6190413 A JP S6190413A JP 21299584 A JP21299584 A JP 21299584A JP 21299584 A JP21299584 A JP 21299584A JP S6190413 A JPS6190413 A JP S6190413A
- Authority
- JP
- Japan
- Prior art keywords
- exterior
- resin
- capacitor element
- electrolytic capacitor
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 46
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920003002 synthetic resin Polymers 0.000 claims description 19
- 239000000057 synthetic resin Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 239000003792 electrolyte Substances 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 11
- 238000001746 injection moulding Methods 0.000 claims description 10
- PCCVSPMFGIFTHU-UHFFFAOYSA-N tetracyanoquinodimethane Chemical compound N#CC(C#N)=C1C=CC(=C(C#N)C#N)C=C1 PCCVSPMFGIFTHU-UHFFFAOYSA-N 0.000 claims description 9
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000001721 transfer moulding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011245 gel electrolyte Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Glass Compositions (AREA)
- Cable Accessories (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21299584A JPS6190413A (ja) | 1984-10-11 | 1984-10-11 | 電解コンデンサの外装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21299584A JPS6190413A (ja) | 1984-10-11 | 1984-10-11 | 電解コンデンサの外装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6190413A true JPS6190413A (ja) | 1986-05-08 |
| JPH0527964B2 JPH0527964B2 (cs) | 1993-04-22 |
Family
ID=16631723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21299584A Granted JPS6190413A (ja) | 1984-10-11 | 1984-10-11 | 電解コンデンサの外装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190413A (cs) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56154038U (cs) * | 1980-04-14 | 1981-11-18 | ||
| JPS57113932A (en) * | 1980-12-29 | 1982-07-15 | Hitachi Ltd | Speed reducer |
| JPS57173932A (en) * | 1981-04-20 | 1982-10-26 | Sanyo Electric Co Ltd | Treatment of organic semiconductor substance |
| JPS5866324A (ja) * | 1981-10-16 | 1983-04-20 | 日立コンデンサ株式会社 | 電子部品の外装法 |
-
1984
- 1984-10-11 JP JP21299584A patent/JPS6190413A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56154038U (cs) * | 1980-04-14 | 1981-11-18 | ||
| JPS57113932A (en) * | 1980-12-29 | 1982-07-15 | Hitachi Ltd | Speed reducer |
| JPS57173932A (en) * | 1981-04-20 | 1982-10-26 | Sanyo Electric Co Ltd | Treatment of organic semiconductor substance |
| JPS5866324A (ja) * | 1981-10-16 | 1983-04-20 | 日立コンデンサ株式会社 | 電子部品の外装法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527964B2 (cs) | 1993-04-22 |
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