JPS6189641A - Manufacture of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To prevent improper short circuit from occurring by a bonding wire by adding the step of forming a projection for preventing the wire from overturning near a bonding pad on a piping pattern prior to the mounting step. CONSTITUTION:A thick film conductor pattern 12 which contains a bonding pad BP is formed on a ceramic substrate 11 by a normal method. Then, a wire overturn preventing guard 13 is formed by a screen printing method to form an insulating projection. Then the prescribed semiconductor chip 14 is die bonded onto the substrate 11, and a wire bonding is performed to bond gold wirings so that the ends of the wires 15 are disposed between the guards 13 on the pad BP.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a hybrid integrated circuit, and particularly to a method for manufacturing a highly reliable hybrid integrated circuit by preventing falling of bonding wires. It is.

[Prior art].

In recent years, there has been a trend toward higher integration and higher density in the field of semiconductor devices, and the progress has been remarkable.

For example, thick film hybrid integrated circuits are shown in FIGS. 13 and 14 (
FIG. 13 is a cross-sectional view of bl + bl in FIG. 14) As shown in FIG. However, the mending portion 4 was formed in a planar manner as a thick film conductor pattern, similar to the wiring portion at the back. However, as devices become more densely packed, thick film conductors and wires become finer, and the number of locations that require wire dangling also increases. Danding is becoming necessary.

[Duration for the invention to be solved: m points]

In this way, as the no-arm turn becomes finer, it is natural that ? The spacing between the landing holes is also narrower,
Since the spacing between the dending and ear is also smaller,
Occurrence of short-circuit defects due to contact between wires or Wj Q-shape between the wire 5 and another wiring layer 6 as shown in FIG. 15 is a major problem.

The present invention was made in consideration of the above-mentioned circumstances, and aims to prevent the occurrence of short-circuit defects caused by bonding wires and to provide a thermally integrated circuit with reduced reliability.

[Means for solving problems]

Therefore, in the present invention, an insulating protrusion is formed near the wire ending node formed on the substrate as a guard to completely prevent the wire from flowing.

These protrusions are designed to prevent contact between wires.
Being jked.

In addition, IH between the chip and the binding/glad on the board
In order to prevent the bonding wire from coming into contact with other wiring layers (conductors on the board, etc.) that pass through the wire,
A protrusion is formed at a portion of the semiconductor chip that is a distance away from the bonding area.

[Effect]

In this way, the existence of the protrusion as force ゛-1.
Even if the bonding wire falls over, it is supported by the guards on both sides and will not come into contact with the contact-resistant wire.

From the bonding area to the semiconductor chip 91. The protrusion formed on the portion closer to j supports the bonding wire from falling from below and prevents the wire from coming into contact with other wires on the board.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

This shows a part of a thick film hybrid integrated circuit, and is made of an insulating ceramic substrate shown in Figures 1 and 2 (Figure 1 is a view from A-A Ib'f in Figure 2). Thick film conductor formed on 11/gonding pad B of l-turn 12
Two wire fall prevention guards 13 are disposed on P to surround both sides of the bonding wire 15.

In manufacturing this thick film hybrid integrated circuit, first, as shown in FIG. A 5 μm thick film conductor with 9 turns 12 is formed.

Next, as shown in Figure 4, by screen marking,
Wire fall prevention guard 13 made by screen printing method
The thickness is approximately 10-20μ? n., forming protrusions with colored edges. (7 is a screen, 8 is a squeegee, and 9 is an epoxy paste.) After that, a predetermined semiconductor chip 14 is die-dended once on the ceramic substrate, and then the Bonding wire 1 between wire fall prevention guard 130 on panod BP
As shown in Fig. 5 and Fig. 6 (Fig. 50 is the 7th view of B-B:j,'j of Fig. 6 (2)), wire ending/ding is applied so that the tip of No. 5 is glossy. Then, a gold wire with a diameter of 25 μh1 was connected.

In this way, the thickness shown in FIG.
A hybrid integrated circuit is formed. Note that FIGS. 3 to 6 are enlarged views of the main parts of FIGS. 1 and 2. In these diagrams, only one pumping unit is shown, but in reality it has a center pitch of 200μ.
m1 pad size 100 AmD, 1ch:/f 91
50 d's? There are 7 Deing Grads installed.

Since the wire fall prevention guard is provided in this manner, the thick film hybrid integrated circuit according to the embodiment of the present invention prevents short-circuit defects between the wires and has extremely high reliability.

Further, as other embodiments of the present invention, FIGS.
As shown in FIG. 7 (FIG. 7 is a sectional view taken along line a-a in FIG. 8), as a guard 23 for preventing wire sag, an insulating protrusion is provided on the chip-side protrusion on the pumping tube BP'. There are membrane hybrid integrated circuits. This is effective in preventing the wires 25 from coming into contact with another wiring layer 26 when it passes between the semiconductor chip 24 and the wiring node BP'.

This wire sagging prevention guard 23 is mounted on an insulating ceramino substrate 21, as shown in enlarged views of main parts in Figures 9 and 10 (Figure 9 is a bb-b sectional view of section 10). A protrusion with a thickness of 10 to 20 μm is formed on the bonding node BP′, which is a part of the formed thick film conductor pattern 22, at a position slightly away from the bonding position of the wire, that is, the tip position of the wire, toward the semiconductor chip 24 side. It is established as

In forming this thick film hybrid integrated circuit, prior to the step of mounting the semiconductor chip, that is, the die-dending step, similar to the case of providing a guard to prevent wires from falling over, a guard to prevent sagging is applied using a screen printing method or the like. Do 2
3 may be added, and the other steps may be carried out by ordinary methods.

According to this thick film hybrid integrated circuit, wires and other
It is possible to prevent short-circuit defects.

In these two embodiments, the guard for preventing the wire from falling over and the guard for preventing the wire from sagging were provided separately, but as shown in FIGS. 11 and 12 (FIG.
A′-A′ cross-sectional view of the figure) A U-shaped protrusion 31 is formed,
By providing both functions, it becomes possible to obtain a thick film hybrid integrated circuit with even higher reliability.

Further, the shape of the protrusion can be modified as appropriate1, and it goes without saying that it may be not only square but also circular, triangular, etc.

Furthermore, these η colors P as guards,! In the embodiment, the circuit was formed as a separate process after the turn formation, but in the case of a multilayer substrate, it can be performed in the same process when forming the interlayer insulating film.

The position of the protrusion does not necessarily have to be on the bonding pad, but may be in a state where it protrudes onto the substrate.

Further, in the embodiment, the circuit/mother turn is formed by a thick film method, but it is also applicable to a case where it is formed by a thin film method.

In addition, the present invention can be applied to electrodes of flip chips, chip carriers, etc. and turns, and is also effective in preventing leakage of connection solder.

〔Effect of the invention〕

As explained above, according to the present invention, since a guard is provided near the tip of the bonding wire to prevent the wire from falling over, In such cases, short-circuit defects between adjacent wires or between wires and other wiring layers can be prevented, and a highly reliable hybrid integrated circuit can be provided.

[Brief explanation of drawings]

1 and 2 are diagrams showing a thick film hybrid integrated circuit according to an example of this research, FIGS. 3 to 6 are diagrams showing the manufacturing process of the same thick film hybrid integrated circuit, and FIGS. Fig. 8 is a diagram showing a hybrid accumulation port 1 of another embodiment of the invention, Fig. 9 and Fig. 1
FIG. 0 is a partially enlarged view of the same hybrid integrated circuit, FIGS. 11 and 12 are diagrams showing hybrid integrated circuits of still other embodiments,
13 to 15 are diagrams showing conventional hybrid integrated circuits. l...Substrate, 2...Thick film conductor pattern, 3...Semiconductor chip, 4...Binding/mother board, 5...
Wire, 6...21 layers, 11...ceramic substrate,
12... Thick film conductor/turn, 13... Wire fall prevention guard, 14... Semiconductor chip, 15... Wire, BP, BP'... Bonding pad, 21...
...Ceramic substrate, 22...Thick film conductor/mother turn,
23... Guard for preventing dripping, 241. - Semiconductor chip, 31... U-shaped projection. 1 (21- Figure 1 Figure 2 Figure 3 L/P Figure 4 Figure 7 Figure 8 Figure 9 Figure 10 Figure 2. Figure 11 Figure 12 Figure 28

Claims (1)

[Claims] In a method for manufacturing a hybrid integrated circuit in which a semiconductor chip and a wiring pattern are arranged on a substrate and these are connected by a wire bonding method, prior to the mounting process, in the vicinity of the bonding pad on the wiring pattern, A method for manufacturing a hybrid integrated circuit, comprising the additional step of forming a protrusion to prevent a bonding wire from tipping over.