JPS6187665U - - Google Patents
Info
- Publication number
- JPS6187665U JPS6187665U JP17074484U JP17074484U JPS6187665U JP S6187665 U JPS6187665 U JP S6187665U JP 17074484 U JP17074484 U JP 17074484U JP 17074484 U JP17074484 U JP 17074484U JP S6187665 U JPS6187665 U JP S6187665U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- soldering iron
- thread solder
- guide tube
- thread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 16
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17074484U JPH0221177Y2 (cg-RX-API-DMAC10.html) | 1984-11-10 | 1984-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17074484U JPH0221177Y2 (cg-RX-API-DMAC10.html) | 1984-11-10 | 1984-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6187665U true JPS6187665U (cg-RX-API-DMAC10.html) | 1986-06-07 |
| JPH0221177Y2 JPH0221177Y2 (cg-RX-API-DMAC10.html) | 1990-06-07 |
Family
ID=30728454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17074484U Expired JPH0221177Y2 (cg-RX-API-DMAC10.html) | 1984-11-10 | 1984-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221177Y2 (cg-RX-API-DMAC10.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210015863A (ko) | 2018-06-06 | 2021-02-10 | 데쿠세리아루즈 가부시키가이샤 | 접속체의 제조 방법, 접속 방법 |
| KR20210015864A (ko) | 2018-06-06 | 2021-02-10 | 데쿠세리아루즈 가부시키가이샤 | 접속체, 접속체의 제조 방법, 접속 방법 |
| KR20210016523A (ko) | 2018-06-06 | 2021-02-16 | 데쿠세리아루즈 가부시키가이샤 | 필러 함유 필름 |
| US12172240B2 (en) | 2018-06-26 | 2024-12-24 | Resonac Corporation | Solder particles |
| US12247270B2 (en) | 2018-06-26 | 2025-03-11 | Resonac Corporation | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses |
-
1984
- 1984-11-10 JP JP17074484U patent/JPH0221177Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210015863A (ko) | 2018-06-06 | 2021-02-10 | 데쿠세리아루즈 가부시키가이샤 | 접속체의 제조 방법, 접속 방법 |
| KR20210015864A (ko) | 2018-06-06 | 2021-02-10 | 데쿠세리아루즈 가부시키가이샤 | 접속체, 접속체의 제조 방법, 접속 방법 |
| KR20210016523A (ko) | 2018-06-06 | 2021-02-16 | 데쿠세리아루즈 가부시키가이샤 | 필러 함유 필름 |
| US12172240B2 (en) | 2018-06-26 | 2024-12-24 | Resonac Corporation | Solder particles |
| US12247270B2 (en) | 2018-06-26 | 2025-03-11 | Resonac Corporation | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0221177Y2 (cg-RX-API-DMAC10.html) | 1990-06-07 |