JPS6186499A - Gas phase growth apparatus - Google Patents

Abstract

PURPOSE:To prevent the generation of wall deposition and to perform excellently the gas phase growth by interposing a cylindrical body made of quartz between the lower end of a susceptor assembly body and the upper surface of a base plate in leaving the slight clearance. CONSTITUTION:A barrel type susceptor assembly body 11 is fitted to a rotary axis 13 lengthened to the upper part by perforating a base plate 16. A reaction chamber is formed by providing a bell jar 14 around the susceptor assembly body 11. A cylindrical body 15 made of quartz which is supported in one hand and has the slight clearance for the other hand is interposed between the lower end of the susceptor assembly body 11 and the upper surface of base plate 16. For example, the cylindrical body 15 is provided to the position having the slight clearance unhindering the rotation of the susceptor 11 in the lower direction of the bell jar 14. By this mechanism, the inflow of the reaction gas to the lower side of the susceptor assembly body 11 is interrupted and generation of refuse is prevented and also the gas flow in the bell jar 14 is made smooth.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field to which the Invention Pertains] The present invention relates to a barrel-type vapor phase 5X long apparatus for vapor phase growth of silicon crystals and the like on semiconductor material substrates (hereinafter referred to as wafers) such as silicon.

[Prior art]

The barrel-type vapor phase growth apparatus using lamp heating, which has been put into practical use in the past, has a driving source for the rotating shaft that rotates the susceptor located above, supplies gas such as a reaction gas above the reaction tube, and supplies gas such as a reaction gas above the reaction tube. Exhaust air was to be exhausted from an exhaust port in the center. This method has no problem with the flow of debris; however, since the driving source is located above, there is a drawback that debris from the rotating part falls onto the wafer and causes contamination. Therefore, a method has been proposed in which the drive source is located below, but with this method, the exhaust port cannot be located in the center of the bottom of the bell-shaped reaction tube, that is, the bell jar. 1. The exhaust must be exhausted from the exhaust port. However, in this case, the reaction gas flows into the lower side of the susceptor, causing wall debos on the susceptor rotating shaft and base plate, and the wall debos are separated, floated up, and attached to the wafer, impeding good vapor phase growth. However, there are disadvantages such as disturbing the flow A'i of the reactant gas in the bell jar.

[Purpose of the invention]

The present invention eliminates this disadvantage, and its purpose is to
7. In order to prevent the reaction gas from flowing into gII+ under the susceptor.
flj to prevent wall deposits and reduce gas flow 7
``Our objective is to provide a vapor phase growth apparatus that makes L smooth and thereby enables good vapor phase growth.

[Key points of the invention]

In the gas phase 5' of the present invention, the long device includes a base plate, a rotating shelf extending upwardly through the base plate, and a rotating @
The vapor phase growth system is fully equipped with a barrel-shaped susceptor assembly attached to the base plate, and a bell jar whose lower end can be sealed to the base grate to form a reaction chamber around the susceptor assembly.
Vc, a cylindrical body made of quartz is interposed between the lower end of the susceptor assembly and the upper surface of the base plate, and is supported by one of the two and has a slight gap from the other. There is.

[Embodiment of the Invention] A diagram showing an embodiment of the present invention will be described below. ,
In FIG. 1, the susceptor assembly 11 has a plurality of strip-shaped susceptors arranged in a polygonal shape, and has a slope with respect to the axis, and the upper and lower surfaces are covered with a lid-like body, and the outer periphery is covered with a lid-like body. A number of wafers 12 are attached. The susceptor assembly 11 is configured to be rotated in both directions by a hollow rotating shaft 131C made of non-metallic material such as ceramics fixed to the upper and lower lid-like bodies, and its outer periphery and upper part are covered with a bell jar 14 made of quartz. Enter.

Below the bell jar 14, there is a cylindrical body 15 made of quartz that is concentric with the bell jar 14 and located close to it with a slight gap that does not hinder the rotation of the susceptor assembly 110. (base play) 16 in close contact with each other. The cylindrical body 15 is assembled with a susceptor, and the space formed between the bell jar 14, the susceptor assembly 11, and the cylindrical body 15 is called a reaction chamber.
The rotation a] 13 passes through the base plate 16 in a gas-tight manner. A quartz ring 194 is placed between the lower inner periphery of the bell jar 14 and the lower outer periphery of the cylindrical body 15 to prevent release of metal ions from the surface of the base plate 16. is a hole 19B for discharging gas from the reaction chamber to the outside.
It's open.

A double tube consisting of a fixed inner tube 17 and an outer tube 18 is provided at the center of the rotating shaft 13, and from the inner tube 17, N2 or H2 gas flows upward to the outer tube. 18 (is the upper end and only two are shown in the figure) and the nozzle IRA
As a result, the reaction residue flows toward the wafer 12 located below. Note that the reaction gas flow 1. The details will be described later.

An exhaust A' 121 is provided on the outer periphery of the lower part of the bell jar 14, surrounding it and with a base 20 placed on the outer periphery of the base plate 6, and opening only the bell jar 14 side.
This exhaust duct) 21U is connected to the exhaust pipe 22 shown in FIG. A cooling fluid supply section 25 is formed on the back side of the lamp house 24, and the cooling fluid supply section 25 [C! is blown into the air to cool the cooling air.

The base 20 (C is equipped with an elevating and rotating mechanism 28 adjacent to the exhaust l° tact 1, and the hawk 28 has an arm 2 at the upper end.
9 is fixed, and the tip of the arm 29 removably grips a grip part 31 fixed to the top of the lever 14 in a gripping tool 30. Further, an ERI-B cooling fluid supply section 33 is attached to a gripping tool 32 at the tip of the arm 29. The lower end of the B cooling fluid supply section 33 is placed on the upper surface of the lamp house 24, and the inner wall 34 has a large number of holes 35, so that the cooling air flows through the bell jar like the A cooling fluid supply section 25. It is sprayed on the top of 14. Here, the bell jar 14 and the B cooling fluid supply section 33 are attached to the arm 29 and can be raised and lowered at the same time, and the lower surface of the bell jar 14 is connected to the nozzle 18A.
After rising to the upper part, the arm 29 is rotated, and the end portions A and B are rotatably connected to each other, and the end portions A and B are pivoted to the side. The lower center can be separated and moved to the position indicated by the dotted line in the figure.

The cooling air blown out from the cooling fluid supply section 25 and the cooling fluid supply section 33 descends while cooling the outer circumference of the bell jar and the lamp 23, and after entering the exhaust tact 1, is shown in the upper part of Fig. 1. It is forcibly discharged to the outside from the exhaust pipe 22. As shown in the figure, the eight nozzles 18A through which the reaction gas flows are provided radially in this example.
6 is a distance from the axis on the susceptor assembly 11 having a slope with respect to the axis, in order to change the distance from the axis of the rotating shaft 13 by combining two or four of the eight nozzles 18A. The reaction scum is ejected corresponding to each of the different wafers 12. Alternatively, in addition to this configuration, the nozzle 18
It was a good idea to make two of A as a set and provide holes 36 near the tip of each at an angle facing each other.
The two reactant gas flows rL may collide to form a wide downward gas flow.

Next, the operation of the embodiment described in ``11J'' will be explained.
fr: The lamp house 24 is raised, and then the bell jar 14 and the B cooling fluid supply section 33 are completely lowered to the state shown in FIG. 1. In this state, N2 gas is ejected from the inner tube 17 and the outer tube 18 to purge the air, and after the air purging is completed, the N2 gas is applied to the verge, and then to the lamp 23 and heated. 12 wafers for heating
When the temperature reaches the sludge temperature, reaction scum such as slag/etc. is ejected from the outer tube 18 and hence from the nozzle 18A together with N2 gas.
Perform the vapor phase 1jX and length.

At this time, N2 gas is directly ejected from the inner pipe 17, and the upper space of the bell jar 14 is filled with N2 gas, thereby cooling the upper wall surface of the bell jar 14 and preventing contact of the reaction gas with the upper wall surface. These gases are then exhausted from the holes 19B of the pace plate 16. At this time, since the cylindrical body 15 is located between the susceptor assembly assembly and the pace plate 16, gas may enter the lower part of the susceptor assembly and kick up dust or disturb the gas flow inside the belljar 14. It is ejected smoothly without any damage. lamp 2
At the same time as heating by 3, the cooling air from the blower and cooler is supplied to the hole 2 of the cooling fluid supply section 25 of the blower 33.
6 and 35 are blown onto the lamp 23 of the perger 14, and after cooling the rung 23 and the bell jar 4t, it descends along the bell jar 14 and is forcibly exhausted from the exhaust pipe 22 from the exhaust pipe 14. be done. The air volume is several tens of rr depending on the size of the quartz bell jar]4. /minute to number 1
0 (1y7//min, which is an extremely large amount, but the exhaust duct 2
1 surrounds the lower part of the bell jar 14 and has a large circumference, so that the exhaust resistance is small and suction from the exhaust pipe 22 allows smooth exhaust.

After vapor phase growth has been carried out for a certain period of time, the lamp 23 is turned off to stop heating, and the wafer is transferred through the belljar 14 while purging the reaction gas by spouting only N2 gas from both tubes 18. 12, then stop the N2 gas and blow out the N2 gas! :Kuberja 14
Turn the inside into N2 gas. Finally, the bell jar 4 and the like are raised by a lifting mechanism 28, the lamp house 24 is opened, and the wafer 12 is taken out, thereby completing the series of vapor phase growth operations. If the bell jar 4 needs to be cleaned, the bell jar 14 is raised, then rotated to the side by the lifting and rotating mechanism 28, and then lowered and placed on the vcH floor on a stand (not shown). I'm going to take it off and wash it now.

〔Effect of the invention〕

The vapor phase growth apparatus Pi of the present invention, as described above, includes a barrel-shaped susceptor assembly attached to the rotating IN that extends upward through the pace plate, and a susceptor assembly whose lower end can be sealed to the pace plate. A bell jar that forms a reaction chamber around the solid body, and a cylinder made of quartz plow that is supported by ten thousand of the two and has a slight gap from the other between the lower end of the susceptor assembly and the upper surface of the base plate. The main component is the body.

In this configuration, the reaction gas inflow to the lower side of the susceptor assembly is not blocked by the cylindrical body, so that the occurrence of wall debos and the generation of dust under the susceptor assembly are prevented. Furthermore, since the flow of gas inside the bell jar becomes smooth, there is an advantage that good vapor phase growth is possible.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention, and FIG. 1 is a sectional view, and FIG. 42 is a sectional view taken along the line 2--2 in FIG. 11... Susceptor assembly, 12... Wafer, 13...
... Rotary canter shaft, 14... Belljar, 15... Cylindrical body, 16... Pace plate, 17... Inner tube, 18...
... Outer tube, 23... Lamp, 24... Lamp house, 25.33... Cooling fluid supply section, 28... Lifting and rotation mechanism. Toshiba Machine Co., Ltd. Piece 1 Figure Piece 2 Procedural Amendment (Method) % Formula % ], Indication of the case 1982 Patent Application No. 209418 2, Name of the invention Vapor phase growth device, etc. 3 Person making the amendment

Claims (1)

[Claims] a base plate, a rotating shaft extending upwardly through the base plate, a barrel-shaped susceptor assembly attached to the rotating shaft, and a reaction chamber having a lower end sealed to the base plate and surrounding the susceptor assembly. A cylindrical body made of quartz is provided between the lower end of the susceptor assembly and the upper surface of the base plate, and is supported by one of the two and has a slight gap from the other. A vapor phase growth apparatus characterized by interposing.