JPS6185777A - Soldered terminal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to soldering terminals which are made electrically conductive by soldering a plurality of electrical conductors.

BACKGROUND ART Conventionally, when a thin coated conductor wire made of a thin conductor coated with an insulating material was soldered to a pin terminal of the conductor, the soldering work was performed manually using a soldering iron as a heat source. With this method, it is difficult to control the amount of heat and there are large variations in the amount of heat, the thin sheathed conductor tends to break due to the phenomenon of wire thinning, and the thermal peeling of the & sheath is not sufficient, resulting in poor continuity, resulting in poor reliability. It was missing. Further, there is a drawback that force is applied to the pin terminal by the soldering iron, which tends to bend the pin terminal (first terminal) and break the thinly coated conductive wire (second terminal). On the other hand, even when soldering is performed using a heat source using a Rede beam, as shown in FIG. As shown in FIG. 1(B), there was a drawback that the thin coated conductor wire was broken.

Purpose The present invention prevents the occurrence of bending of pin terminals during soldering, and also prevents the occurrence of disconnection and poor conduction of 1m coated conductor wires, thereby improving the reliability of soldering, and reducing the number of man-hours required for soldering. The aim is to reduce

Embodiment FIG. 2 and subsequent figures show embodiments of the present invention, in which numeral 1 indicates a thin coated conductive wire soldered to a pin terminal.

2 is 1m & m At the part where conductor 1 is wrapped around the pin terminal /? Cream solder to be applied, 3 a terminal block in which a pin terminal is embedded, 4 a laser beam serving as a heat source for soldering, 5 a pin terminal around which a thin coated conductive wire 1 is wrapped, 6
Apply cream solder to the parts to be soldered! RJ dispenser, 7 is a laser beam? A condensing optical system is a device for condensing S-rays, and reference numeral 8 indicates an optical axis when a hot ray such as a laser beam is condensed.

As shown in 2nd UA (A), the soldering of the finely coated 4 wires 1 wrapped around the pin terminal 5 to the pin terminal 5 is performed by applying cream solder 2 with a dispenser 6 to the part. As shown in Fig. 2 (B), soldering is done using parts coated with cream solder, and as shown in Fig. 3, soldering is done at a position slightly away from the part, near the end of the pin terminal 5, where the hot wire is concentrated. Position it so that it is above the light spot. Then, when the laser beam 4 is irradiated to the pin terminal 5 for an appropriate time, heat is transferred to the soldering part by heat conduction from the heat ray receiving part of the pin end "f5", so that the thin coated conductor 1 and the pin terminal 5 can be soldered.

Next, if the pin terminal 5 of the embodiment shown in FIGS. 2 and 3 is changed to the pin terminal 9 shown in FIG. In laser soldering, when a system is used, the positioning accuracy can be made loose to some extent, so the variation in one positioning can be ignored.

Furthermore, if the pin terminal 9 in Fig. 4 is changed to the pin terminal 10 in Fig. It is possible to prevent the influence of heat on the terminal block 3 more than 9.

Also, as shown in FIG. 6, when the laser beam must be irradiated from directly above the pin end f-11 because the component 12 is on the skin side of the pin terminal 11, the laser beam must be irradiated from directly above the pin end f-11. By using the pinot end f-11 equipped with the heat ray receiving part 11a, the direct thermal influence of the laser beam on the terminal block 3 and the thin coated conductive wire l can be prevented.

I can do that.

Effects As explained above, in the present invention, by irradiating a hot ray near the end of the first terminal (pin terminal) where the second terminal (thin coated conductor wire) is not wound, the heat rays are removed from the first terminal. A simple method of soldering using heat conduction prevents the second terminal from being disconnected by a hot wire, and has the effect of making it possible to use, for example, laser soldering. In this way, in the present invention, it is possible to perform soldering by fixed heat bonding by controlling the output level and irradiation time of a laser processing machine, for example, so that thinning of the thin coating-A wire and poor conductivity can be avoided. This allows for highly reliable soldering without any problems.

Furthermore, since non-contact processing using a laser beam can be used, deformation of the pin terminal will not occur, and since the irradiation time can be easily controlled, even if the terminal block is made of molded resin, there will be no deformation of the terminal block or the deformation of the pin terminal. This has the effect that no shedding occurs. In addition, by widening the portion of the pin terminal that receives the laser beam, the positioning accuracy can be made looser and there is an effect that direct thermal influence of the laser beam on one periphery can be prevented.

[Brief explanation of the drawing]

Figures 1 (A) and (B) are perspective views of a conventional example in which laser soldering of the finely coated conductive wire and the pin end f is performed by laser beam irradiation, and Figures 2 (A) and (B) are four thinly coated conductive wires. Laser soldering of pin terminals is a perspective view showing the process of applying cream solder to the parts, Figures 3 and 4 are side views and perspective views showing examples of the laser soldering method, and Figure 5 is a perspective view showing the process of applying cream solder to the parts. FIG. 6 is a side view of an example in which a pin terminal is provided with a constriction, and FIG. 6 is a perspective view showing another example of the laser soldering method. 1-1 thin coated conductor 2-m-riam collar opening 3
-m1 terminal block 4-11 laser beam 5.9,1
0.11-m-Pin terminal 6---Dispenser 7---Laser beam focusing optical system 8---Optical axis of laser beam ~j, =', ', 'f', '+ Porridge 1 (A) Second (A) Figure (B) Figure (B)

Claims (1)

[Scope of Claims] A soldering terminal in which a second terminal made of a conductive material is wound around a first terminal made of a conductive material and both terminals are soldered, wherein a heating wire is received near an end of the first terminal. A soldering terminal characterized by having a portion formed therein.